DK163761C - Optisk komponent og hus til en saadan komponent. - Google Patents

Optisk komponent og hus til en saadan komponent.

Info

Publication number
DK163761C
DK163761C DK547384A DK547384A DK163761C DK 163761 C DK163761 C DK 163761C DK 547384 A DK547384 A DK 547384A DK 547384 A DK547384 A DK 547384A DK 163761 C DK163761 C DK 163761C
Authority
DK
Denmark
Prior art keywords
component
house
optical
optical component
Prior art date
Application number
DK547384A
Other languages
Danish (da)
English (en)
Other versions
DK547384A (da
DK163761B (da
DK547384D0 (da
Inventor
Hideaki Nishizawa
Original Assignee
Sumitomo Electric Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP58218964A external-priority patent/JPS60110180A/ja
Priority claimed from JP58223020A external-priority patent/JPS60113978A/ja
Priority claimed from JP58232341A external-priority patent/JPS60124885A/ja
Application filed by Sumitomo Electric Industries filed Critical Sumitomo Electric Industries
Publication of DK547384D0 publication Critical patent/DK547384D0/da
Publication of DK547384A publication Critical patent/DK547384A/da
Publication of DK163761B publication Critical patent/DK163761B/da
Application granted granted Critical
Publication of DK163761C publication Critical patent/DK163761C/da

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/02002—Arrangements for conducting electric current to or from the device in operations
    • H01L31/02005—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier
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    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
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    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
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    • H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
    • H01L31/10—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by potential barriers, e.g. phototransistors
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    • H01L31/102—Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier
    • H01L31/105—Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier the potential barrier being of the PIN type
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    • H01L2224/13111—Tin [Sn] as principal constituent
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    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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    • H01L2224/48471—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area being a ball bond, i.e. wedge-to-ball, reverse stitch
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    • H01L33/58—Optical field-shaping elements
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
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    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Optics & Photonics (AREA)
  • Light Receiving Elements (AREA)
  • Gyroscopes (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Die Bonding (AREA)
DK547384A 1983-11-21 1984-11-16 Optisk komponent og hus til en saadan komponent. DK163761C (da)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP58218964A JPS60110180A (ja) 1983-11-21 1983-11-21 光素子用パツケ−ジ
JP21896483 1983-11-21
JP22302083 1983-11-25
JP58223020A JPS60113978A (ja) 1983-11-25 1983-11-25 光素子
JP58232341A JPS60124885A (ja) 1983-12-08 1983-12-08 受光ダイオードの製造方法
JP23234183 1983-12-08

Publications (4)

Publication Number Publication Date
DK547384D0 DK547384D0 (da) 1984-11-16
DK547384A DK547384A (da) 1985-05-22
DK163761B DK163761B (da) 1992-03-30
DK163761C true DK163761C (da) 1992-08-24

Family

ID=27330223

Family Applications (2)

Application Number Title Priority Date Filing Date
DK547384A DK163761C (da) 1983-11-21 1984-11-16 Optisk komponent og hus til en saadan komponent.
DK033291A DK33291A (da) 1983-11-21 1991-02-26 Fremgangsmaade til fremstilling af en optisk komponent

Family Applications After (1)

Application Number Title Priority Date Filing Date
DK033291A DK33291A (da) 1983-11-21 1991-02-26 Fremgangsmaade til fremstilling af en optisk komponent

Country Status (8)

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US (2) US4663652A (de)
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DK33291D0 (da) 1991-02-26
CA1267468C (en) 1990-04-03
DK547384A (da) 1985-05-22
DK163761B (da) 1992-03-30
EP0313174A3 (en) 1989-11-15
EP0313174A2 (de) 1989-04-26
DE3486214T2 (de) 1994-01-13
FI82999B (fi) 1991-01-31
US4727649A (en) 1988-03-01
FI844473L (fi) 1985-05-22
FI844473A0 (fi) 1984-11-14
EP0313174B1 (de) 1993-09-22
DK33291A (da) 1991-02-26
EP0145316A2 (de) 1985-06-19
FI82999C (fi) 1991-05-10
EP0145316B1 (de) 1990-03-07
US4663652A (en) 1987-05-05
AU1319788A (en) 1988-06-09
DE3486214D1 (de) 1993-10-28
CA1267468A (en) 1990-04-03
AU592256B2 (en) 1990-01-04
EP0145316A3 (en) 1986-07-30
NO169684C (no) 1992-07-22
NO169684B (no) 1992-04-13
DK547384D0 (da) 1984-11-16
DE3481571D1 (de) 1990-04-12
NO844596L (no) 1985-05-22

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