DK143289B - Fremgangsmaade til metallisering af formstoffer og isaer til fremstilling af trykte kredsloebsplader - Google Patents
Fremgangsmaade til metallisering af formstoffer og isaer til fremstilling af trykte kredsloebsplader Download PDFInfo
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- DK143289B DK143289B DK375772AA DK375772A DK143289B DK 143289 B DK143289 B DK 143289B DK 375772A A DK375772A A DK 375772AA DK 375772 A DK375772 A DK 375772A DK 143289 B DK143289 B DK 143289B
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
- C23C18/26—Roughening, e.g. by etching using organic liquids
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1605—Process or apparatus coating on selected surface areas by masking
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
- H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/143—Electron beam
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
- Y10T428/249987—With nonvoid component of specified composition
- Y10T428/24999—Inorganic
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
143289
Den foreliggende opfindelse angår en fremgangsmåde til metal' lisering af formstoffer, især til fremstilling af trykte kredsløbsplader, ved hvilken formstofoverfladen især af et på et bæremateriale påført adhæsionsformidlende lag, der indehol-5 der oxidativt nedbrydelige harpiks- eller gummibestanddele i en kunstharpiksblanding, ved en passende forbehandling gøres vedvarende polær, og ved hvilken det på denne formstof-overflade i det mindste i de til metallisering bestemte områder først påføres i det mindste et reducerbart salt af 10 et metal, der virker katalytisk på en strømløs metaludskillelse, nemlig et salt af kobber, nikkel, cobalt eller jern eller en blanding af sådanne salte, hvorefter det påførte metalsalt i det mindste i de til metallisering bestemte områder, fortrinsvis efter tørringen, reduceres til katalytisk 15 virksomme metalkim, der sensibiliserer disse områder for strømløs metaludskillelse, og i tilslutning hertil afsættes der et metallag fra et strømløst metaludskillelsesbad i de således sensibiliserede områder.
Fra USA patentskrift nr.3.524.754 kendes en sådan fremgangs-20 måde, hvor reduktionen af det påførte metalsalt sker i en reducerende opløsning. Dette medfører ikke alene forbrug af reduktionsbad, men der er desuden risiko for, at badet ikke virker lige stærkt i alle de i berøring med badet værende områder, hvorfor en meget omhyggelig overvågning af reduk-25 tionen er nødvendig. Endvidere kræves der en omhyggeligt udført skylning for at få fjernet alle rester af reduktionsbadet, hvorunder der er fare for lokal udvaskning af de reducerede lag. Alt i alt kan denne kendte fremgangsmåde medføre en uensartet tykkelse og/eller afgrænsning af det ved 30 den strømløse metalafsætning fremkomne kredsløbsmønster.
Formålet med den foreliggende opfindelse er at anvise en fremgangsmåde af den nævnte art, hvor disse ulemper er undgået.
Dette opnås med fremgangsmåden ifølge opfindelsen, der er 143289 2 ejendommelig ved, at reduktionen gennemføres ved varmeind-virkning.
Ved passende styring af temperatur og behandlingstid fås der herved en meget ensartet sensibilisering af metalsaltet.
5 Ved fremgangsmåden ifølge opfindelsen har det vist sig hensigtsmæssigt, at den med det reducerbare metalsalt forsynede overflade bringes op på en temperatur på fra 100 til 170°C, som fastholdes, indtil en indtrædende mørkfarvning viser, at der er sket en reduktion til et ikke-strømledende lag, 10 som består af katalytisk virksomme metalkim. Dette betyder, at bærematerialets overflade i det eller de pågældende områder er sensibiliseret for strømløs metaludskillelse.
Ved en særlig foretrukken videreudvikling af fremgangsmåden ifølge opfindelsen bringes den med metalsaltopløsning 15 behandlede overflade i berøring med en anordning, hvis kontaktflade svarer til de områder, som i et efterfølgende procestrin skal metalliseres. Herved opnås en samtidig og ensartet reduktion af det eller de ønskede områder.
I en alternativ udførelsesform bringes en opvarmet stift i 20 kontakt med den med metalsaltopløsning behandlede overflade og føres på en sådan måde, at den successivt kommer i berøring med de områder, der skal metalliseres. Denne fremgangsmåde er især velegnet, hvor det f.eks. drejer sig om kredsløbsplader med gennemgående huller, hvis vægge også 25 skal metalliseres.
I det følgende vil opfindelsen blive nærmere belyst ved hjælp af eksempler.
Eksempel 1.
Den i det foreliggende eksempel beskrevne fremgangsmåde 30 skal tjene til en nærmere belysning af fremstillingen af en 143289 3 trykt kredsløbsplade med såkaldte gennempletterede hulvægge, idet der som bærer anvendes en sådan, som i normaltilstanden har en upolær overflade. En sådan bærer består f.eks. af et epoxid-glas-pressestof. Dette børstes først i 5 våd tilstand, hvorefter det tørres og forsynes med gennemgående huller, hvis vægge skal metalliseres.
Bærepladen foraktiveres derefter ved neddypning i en opløsning. Opløsningen består f.eks. af lige store volumendele dimethylformamid og 1,1,1-trichlorethan. Behandlings-10 tiden andrager ved 23°C ca. 1 minut. Efter lufttørring fås en temporært polær, befugtelig overflade. Denne behandles derefter med en opløsning, som i 1 liter vand indeholder 100 g chromsyre og 300 ml koncentreret svovlsyre. Indvirkningstiden er 5 minutter ved ca. 45°C. Efter at overfladen 15 er blevet afvasket, behandles den i 5 minutter ved 23°C med en egnet reduktionsmiddelopløsning, som f.eks. en sådan, som indeholder 20 g kaliumhydrogensulfit og 1 ml svovlsyre i 1 liter vand, for at fjerne alle rester af oxidationsmidlet.
Efter afskylning fås en permanent polær, befugtelig, mikro-20 porøs overflade.
Derefter behandles den således forbehandlede overflade med en opløsning af et reducerbart metalsalt, hvor denne opløsning f.eks. kan have følgende sammensætning:
Kobber-II-formiat 10 g 25 Dinatriumsaltet af anthra- quinon-2,6-disulfonsyre 2 g
Vand 100 g
Glycerol 1 g
Behandlingen sker ved stuetemperatur, og indvirkningstiden 30 andrager 1-2 minutter.
Det således forberedte bæremateriale opvarmes i 10-20 minutter i en ovn ved 130-140°C for at reducere metalsaltlaget til en belægning af kobberkim. Efter afkøling underkastes 4 143289 overfladen en behandling i et strømløst metaludskillende bad, hvorved der dannes et tyndt sammenhængende metallag, som derefter forsynes med en lystryk-maskelak, hvorefter overfladen belyses gennem et forlag og fremkaldes. Herpå fore-5 tager man en galvanisk udskillelse af mere metal, f.eks. kobber, på de ikke-maskerede dele af den tynde metalfilm, hvorved ledningsmønsteret opbygges. Endelig fjerner man fotolakmasken. Det tynde og indtil da af masken dækkede metallag ætses derefter væk ved hjælp af et passende ætsnings-10 middel.
Eksempel 2.
I det foreliggende eksempel går man ud fra kobber-kascheret epoxidglaspressestof. Først fremstiller man alle de huller, hvis vægge skal metalliseres. Derefter behandles bæreren 15 f.eks. med et varmt alkalisk rensningsmiddel i ca. 1-2 minutter, for til slut at blive neddyppet i en metalsaltopløsning som den i eksempel 1 angivne. Den således forberedte bæreplade opvarmes derefter i 10-20 minutter i en ovn ved 130-140°C, hvorved der dannes et elektrisk ledende lag af katalytisk 20 virksomme kobberkim.Den således for den strømløse metaludskillelse sensibiliserede overflade, incl. hulvægge, forsynes dernæst på kendt måde med et metallag, f.eks. et kobberlag, i et strømløst metaludskillende bad.
Reducerbare metalsaltopløsninger til anvendelse ved frem-25 gangsmåden ifølge den foreliggende opfindelse er sammenstillet i tabel I.
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b'b'&ib'b'b'b'bi &i>d M ^ tr> M ^ Cri tn Dn | b> Cn 0i b> (Τ' ¢71 !j!^O
±i b S S jj id . *t-j (Ο Η -Η -Η M *d 4-IHHCH H. ® f- 3 h ti c g> g 4j tfl >i So·· G H-j SS-pS-pSS i* ϋ ^«hh 3 33« 3 8 5 o 2 & & 4J G 8 Q 01 Φ Τί τ) = H +) T3
RpcuH-OHHidgro 0 -Q -y rj b T* S
o rl 0 ί t) £ 2 H E E H TirtT ffnS3 Him 3333333311¾ 3 <u S|i S| |ΐ ti 3 ti ti ti 33η 33,8 ο ΰ £«οο&3™ -83¾ c ° hhg & a a $$33^33J§S 3II8SSIη,§ΰ|.·§-3 331 £3 η ? Β 3 3 ^ c :ζ 3 S S c 3 μ υ υ ςτ + © 6 143289
Fremgangsmåden ifølge den foreliggende opfindelse består således typisk af følgende fremgangsmådetrin: - behandling af en egnet, eller efter forbehandling egnet, overflade med en opløsning af et reducerbart metalsalt, 5 f.eks. med en af de i tabel I anførte opløsninger, og - reduktion af det til overfladen forankrede eller i dennes mikroporer tillejrede metalsalt til en ikke-ledende belægning bestående af metalkim ved hjælp af termisk energi og 10 - fremstilling af en metalbelægning på den ved hjælp af de frembragte katalytisk virksomme metalkim for den strømløse metaludskillelse sensibiliserede overflade ved indvirkning af et strømløst arbejdende metalliseringsbad.
Lagtykkelsen af metallaget er herunder en funktion af opholds-15 tiden i badet. Da det således opbyggede metallag tillejres de fast forankrede metalkim og således i løbet af den strømløse udskillelsesproces fylder mikroporerne ud, opstår der en overordentlig stærk binding mellem bærematerialet og det derpå opbyggede metallag. Om ønsket kan det uden anvendelse af 20 en ydre strømkilde opbyggede metallag videreforarbejdes ved allerede kendte fremgangsmåder, som f.eks. galvanisk metaludskillelse eller neddypningsfortinning.
For bestemte bærematerialers vedkommende har det vist sig at være fordelagtigt først at forsyne disses overflader med 25 et vedhæftningsformidlende lag. En foretrukken vedhæftnings-formidler består af:
Acrylonitril-butadien-copolymer 72 g Phenolharpiks 14 g
Methylethylketon 1200 g 30 Denne blanding kan f.eks. påføres ved neddypning eller valselakering, hvorefter den tørres eller hærdes delvis og behandles med en oxidationsmiddelopløsning for ved en foretrukken nedbrydning af de i vedhæftningsformidlerlaget fint fordelte gummibestanddele at frembringe mikroporer samt ved den almene indvirkning af oxidationsmidlet at fremstille en polær 143289 7 overflade. Efter fjernelsen af behandlingsopløsningerne behandles overfladen med en af de i tabel I anførte opløsninger og tørres derefter ved f.eks. 55-60°C. Herefter fortsættes som ovenfor beskrevet.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US16743271A | 1971-07-29 | 1971-07-29 | |
US16743271 | 1971-07-29 |
Publications (2)
Publication Number | Publication Date |
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DK143289B true DK143289B (da) | 1981-08-03 |
DK143289C DK143289C (da) | 1981-11-30 |
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Application Number | Title | Priority Date | Filing Date |
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DK375772A DK143289C (da) | 1971-07-29 | 1972-07-28 | Fremgangsmaade til metallisering af formstoffer og isaer til fremstilling af trykte kredsloebsplader |
Country Status (8)
Country | Link |
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US (1) | US3772056A (da) |
AT (1) | AT321668B (da) |
CH (1) | CH606485A5 (da) |
DE (2) | DE2265194A1 (da) |
DK (1) | DK143289C (da) |
FR (1) | FR2147337B1 (da) |
IT (1) | IT961766B (da) |
NL (1) | NL175324C (da) |
Families Citing this family (63)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3993802A (en) * | 1971-07-29 | 1976-11-23 | Photocircuits Division Of Kollmorgen Corporation | Processes and products for making articles for electroless plating |
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JP2768390B2 (ja) * | 1990-12-11 | 1998-06-25 | インターナショナル・ビジネス・マシーンズ・コーポレイション | 無電解金属付着のために基体をコンディショニングする方法 |
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US20090053561A1 (en) * | 2006-05-08 | 2009-02-26 | Juan Jiang | Catalyst layers and related methods |
US11107878B2 (en) | 2015-03-24 | 2021-08-31 | International Business Machines Corporation | High resistivity iron-based, thermally stable magnetic material for on-chip integrated inductors |
KR101991082B1 (ko) * | 2016-12-28 | 2019-09-30 | 코오롱글로텍주식회사 | 차량의 감성 조명 장치 및 이를 제조하는 방법 |
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Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3492151A (en) * | 1966-04-06 | 1970-01-27 | Du Pont | Metallizing process |
US3560257A (en) * | 1967-01-03 | 1971-02-02 | Kollmorgen Photocircuits | Metallization of insulating substrates |
US3451813A (en) * | 1967-10-03 | 1969-06-24 | Monsanto Co | Method of making printed circuits |
US3562005A (en) * | 1968-04-09 | 1971-02-09 | Western Electric Co | Method of generating precious metal-reducing patterns |
US3650911A (en) * | 1968-08-06 | 1972-03-21 | Hooker Chemical Corp | Metallizing substrates |
US3658569A (en) * | 1969-11-13 | 1972-04-25 | Nasa | Selective nickel deposition |
-
1971
- 1971-07-29 US US3772056D patent/US3772056A/en not_active Expired - Lifetime
-
1972
- 1972-07-25 AT AT638972A patent/AT321668B/de not_active IP Right Cessation
- 1972-07-28 DE DE19722265194 patent/DE2265194A1/de active Pending
- 1972-07-28 DE DE2238004A patent/DE2238004C3/de not_active Expired
- 1972-07-28 CH CH1125572A patent/CH606485A5/xx not_active IP Right Cessation
- 1972-07-28 DK DK375772A patent/DK143289C/da active
- 1972-07-29 IT IT5185972A patent/IT961766B/it active
- 1972-07-31 NL NL7210532A patent/NL175324C/xx not_active IP Right Cessation
- 1972-07-31 FR FR7227533A patent/FR2147337B1/fr not_active Expired
Also Published As
Publication number | Publication date |
---|---|
CH606485A5 (da) | 1978-10-31 |
DE2238004A1 (de) | 1973-02-08 |
FR2147337B1 (da) | 1974-10-25 |
US3772056A (en) | 1973-11-13 |
DE2265194A1 (de) | 1976-09-09 |
NL175324C (nl) | 1984-10-16 |
DE2238004C3 (de) | 1978-03-30 |
NL175324B (nl) | 1984-05-16 |
IT961766B (it) | 1973-12-10 |
NL7210532A (da) | 1973-01-31 |
FR2147337A1 (da) | 1973-03-09 |
DK143289C (da) | 1981-11-30 |
AT321668B (de) | 1975-04-10 |
DE2238004B2 (de) | 1977-08-04 |
AU4502172A (en) | 1974-01-31 |
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