DK143289B - Fremgangsmaade til metallisering af formstoffer og isaer til fremstilling af trykte kredsloebsplader - Google Patents

Fremgangsmaade til metallisering af formstoffer og isaer til fremstilling af trykte kredsloebsplader Download PDF

Info

Publication number
DK143289B
DK143289B DK375772AA DK375772A DK143289B DK 143289 B DK143289 B DK 143289B DK 375772A A DK375772A A DK 375772AA DK 375772 A DK375772 A DK 375772A DK 143289 B DK143289 B DK 143289B
Authority
DK
Denmark
Prior art keywords
metal
printed circuit
circuit boards
isaes
metalization
Prior art date
Application number
DK375772AA
Other languages
English (en)
Other versions
DK143289C (da
Inventor
J Polichette
E J Leech
F Nuzzi
Original Assignee
Kollmorgen Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Tech Corp filed Critical Kollmorgen Tech Corp
Publication of DK143289B publication Critical patent/DK143289B/da
Application granted granted Critical
Publication of DK143289C publication Critical patent/DK143289C/da

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22Roughening, e.g. by etching
    • C23C18/26Roughening, e.g. by etching using organic liquids
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1603Process or apparatus coating on selected surface areas
    • C23C18/1605Process or apparatus coating on selected surface areas by masking
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073Multistep pretreatment
    • C23C18/2086Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/185Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0783Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12Using specific substances
    • H05K2203/122Organic non-polymeric compounds, e.g. oil, wax, thiol
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/143Electron beam
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/249921Web or sheet containing structurally defined element or component
    • Y10T428/249953Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249987With nonvoid component of specified composition
    • Y10T428/24999Inorganic
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31678Of metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Description

143289
Den foreliggende opfindelse angår en fremgangsmåde til metal' lisering af formstoffer, især til fremstilling af trykte kredsløbsplader, ved hvilken formstofoverfladen især af et på et bæremateriale påført adhæsionsformidlende lag, der indehol-5 der oxidativt nedbrydelige harpiks- eller gummibestanddele i en kunstharpiksblanding, ved en passende forbehandling gøres vedvarende polær, og ved hvilken det på denne formstof-overflade i det mindste i de til metallisering bestemte områder først påføres i det mindste et reducerbart salt af 10 et metal, der virker katalytisk på en strømløs metaludskillelse, nemlig et salt af kobber, nikkel, cobalt eller jern eller en blanding af sådanne salte, hvorefter det påførte metalsalt i det mindste i de til metallisering bestemte områder, fortrinsvis efter tørringen, reduceres til katalytisk 15 virksomme metalkim, der sensibiliserer disse områder for strømløs metaludskillelse, og i tilslutning hertil afsættes der et metallag fra et strømløst metaludskillelsesbad i de således sensibiliserede områder.
Fra USA patentskrift nr.3.524.754 kendes en sådan fremgangs-20 måde, hvor reduktionen af det påførte metalsalt sker i en reducerende opløsning. Dette medfører ikke alene forbrug af reduktionsbad, men der er desuden risiko for, at badet ikke virker lige stærkt i alle de i berøring med badet værende områder, hvorfor en meget omhyggelig overvågning af reduk-25 tionen er nødvendig. Endvidere kræves der en omhyggeligt udført skylning for at få fjernet alle rester af reduktionsbadet, hvorunder der er fare for lokal udvaskning af de reducerede lag. Alt i alt kan denne kendte fremgangsmåde medføre en uensartet tykkelse og/eller afgrænsning af det ved 30 den strømløse metalafsætning fremkomne kredsløbsmønster.
Formålet med den foreliggende opfindelse er at anvise en fremgangsmåde af den nævnte art, hvor disse ulemper er undgået.
Dette opnås med fremgangsmåden ifølge opfindelsen, der er 143289 2 ejendommelig ved, at reduktionen gennemføres ved varmeind-virkning.
Ved passende styring af temperatur og behandlingstid fås der herved en meget ensartet sensibilisering af metalsaltet.
5 Ved fremgangsmåden ifølge opfindelsen har det vist sig hensigtsmæssigt, at den med det reducerbare metalsalt forsynede overflade bringes op på en temperatur på fra 100 til 170°C, som fastholdes, indtil en indtrædende mørkfarvning viser, at der er sket en reduktion til et ikke-strømledende lag, 10 som består af katalytisk virksomme metalkim. Dette betyder, at bærematerialets overflade i det eller de pågældende områder er sensibiliseret for strømløs metaludskillelse.
Ved en særlig foretrukken videreudvikling af fremgangsmåden ifølge opfindelsen bringes den med metalsaltopløsning 15 behandlede overflade i berøring med en anordning, hvis kontaktflade svarer til de områder, som i et efterfølgende procestrin skal metalliseres. Herved opnås en samtidig og ensartet reduktion af det eller de ønskede områder.
I en alternativ udførelsesform bringes en opvarmet stift i 20 kontakt med den med metalsaltopløsning behandlede overflade og føres på en sådan måde, at den successivt kommer i berøring med de områder, der skal metalliseres. Denne fremgangsmåde er især velegnet, hvor det f.eks. drejer sig om kredsløbsplader med gennemgående huller, hvis vægge også 25 skal metalliseres.
I det følgende vil opfindelsen blive nærmere belyst ved hjælp af eksempler.
Eksempel 1.
Den i det foreliggende eksempel beskrevne fremgangsmåde 30 skal tjene til en nærmere belysning af fremstillingen af en 143289 3 trykt kredsløbsplade med såkaldte gennempletterede hulvægge, idet der som bærer anvendes en sådan, som i normaltilstanden har en upolær overflade. En sådan bærer består f.eks. af et epoxid-glas-pressestof. Dette børstes først i 5 våd tilstand, hvorefter det tørres og forsynes med gennemgående huller, hvis vægge skal metalliseres.
Bærepladen foraktiveres derefter ved neddypning i en opløsning. Opløsningen består f.eks. af lige store volumendele dimethylformamid og 1,1,1-trichlorethan. Behandlings-10 tiden andrager ved 23°C ca. 1 minut. Efter lufttørring fås en temporært polær, befugtelig overflade. Denne behandles derefter med en opløsning, som i 1 liter vand indeholder 100 g chromsyre og 300 ml koncentreret svovlsyre. Indvirkningstiden er 5 minutter ved ca. 45°C. Efter at overfladen 15 er blevet afvasket, behandles den i 5 minutter ved 23°C med en egnet reduktionsmiddelopløsning, som f.eks. en sådan, som indeholder 20 g kaliumhydrogensulfit og 1 ml svovlsyre i 1 liter vand, for at fjerne alle rester af oxidationsmidlet.
Efter afskylning fås en permanent polær, befugtelig, mikro-20 porøs overflade.
Derefter behandles den således forbehandlede overflade med en opløsning af et reducerbart metalsalt, hvor denne opløsning f.eks. kan have følgende sammensætning:
Kobber-II-formiat 10 g 25 Dinatriumsaltet af anthra- quinon-2,6-disulfonsyre 2 g
Vand 100 g
Glycerol 1 g
Behandlingen sker ved stuetemperatur, og indvirkningstiden 30 andrager 1-2 minutter.
Det således forberedte bæremateriale opvarmes i 10-20 minutter i en ovn ved 130-140°C for at reducere metalsaltlaget til en belægning af kobberkim. Efter afkøling underkastes 4 143289 overfladen en behandling i et strømløst metaludskillende bad, hvorved der dannes et tyndt sammenhængende metallag, som derefter forsynes med en lystryk-maskelak, hvorefter overfladen belyses gennem et forlag og fremkaldes. Herpå fore-5 tager man en galvanisk udskillelse af mere metal, f.eks. kobber, på de ikke-maskerede dele af den tynde metalfilm, hvorved ledningsmønsteret opbygges. Endelig fjerner man fotolakmasken. Det tynde og indtil da af masken dækkede metallag ætses derefter væk ved hjælp af et passende ætsnings-10 middel.
Eksempel 2.
I det foreliggende eksempel går man ud fra kobber-kascheret epoxidglaspressestof. Først fremstiller man alle de huller, hvis vægge skal metalliseres. Derefter behandles bæreren 15 f.eks. med et varmt alkalisk rensningsmiddel i ca. 1-2 minutter, for til slut at blive neddyppet i en metalsaltopløsning som den i eksempel 1 angivne. Den således forberedte bæreplade opvarmes derefter i 10-20 minutter i en ovn ved 130-140°C, hvorved der dannes et elektrisk ledende lag af katalytisk 20 virksomme kobberkim.Den således for den strømløse metaludskillelse sensibiliserede overflade, incl. hulvægge, forsynes dernæst på kendt måde med et metallag, f.eks. et kobberlag, i et strømløst metaludskillende bad.
Reducerbare metalsaltopløsninger til anvendelse ved frem-25 gangsmåden ifølge den foreliggende opfindelse er sammenstillet i tabel I.
5 U3289 in in + * ^
^ i—! o o in lOOO
ί-Ι ^ CM Γ0 CM
in Η ιΗ Ο rq rq o LO ^ n- m * o o rq H ·
Η Η O rq rq O
in "—i o m ^ ο £ γμ H ' η h o rq rq -1 in ^ mo * o o rq h ' Η η © rq rq °
^ o 1—I
H s 3 " rq m ^ 3 3 m t-> o vo o o
CM O
H rq ” H ο H Id q i—i rq ^ G t" o ·Μ> “
Η O
G r-~ σι ·ντ
G HO
W 4.
Θ. Λη °° h O,00
0 H
Η -P H (MO S'
A * ° § G
Id « l£> (Μ H S
Eh H « jj m m h & <u
g + 00 <U
in Φ Φ «· t5 U^^i1 kOO o & _£j m oomhj. cn(m| 3 +h £ £ ° %u |r,o H S 6 Ό o :3¾ (1)ho ο ό ^ ¢5 C£ Η O § ™ H ?J3
b'b'&ib'b'b'b'bi &i>d M ^ tr> M ^ Cri tn Dn | b> Cn 0i b> (Τ' ¢71 !j!^O
±i b S S jj id . *t-j (Ο Η -Η -Η M *d 4-IHHCH H. ® f- 3 h ti c g> g 4j tfl >i So·· G H-j SS-pS-pSS i* ϋ ^«hh 3 33« 3 8 5 o 2 & & 4J G 8 Q 01 Φ Τί τ) = H +) T3
RpcuH-OHHidgro 0 -Q -y rj b T* S
o rl 0 ί t) £ 2 H E E H TirtT ffnS3 Him 3333333311¾ 3 <u S|i S| |ΐ ti 3 ti ti ti 33η 33,8 ο ΰ £«οο&3™ -83¾ c ° hhg & a a $$33^33J§S 3II8SSIη,§ΰ|.·§-3 331 £3 η ? Β 3 3 ^ c :ζ 3 S S c 3 μ υ υ ςτ + © 6 143289
Fremgangsmåden ifølge den foreliggende opfindelse består således typisk af følgende fremgangsmådetrin: - behandling af en egnet, eller efter forbehandling egnet, overflade med en opløsning af et reducerbart metalsalt, 5 f.eks. med en af de i tabel I anførte opløsninger, og - reduktion af det til overfladen forankrede eller i dennes mikroporer tillejrede metalsalt til en ikke-ledende belægning bestående af metalkim ved hjælp af termisk energi og 10 - fremstilling af en metalbelægning på den ved hjælp af de frembragte katalytisk virksomme metalkim for den strømløse metaludskillelse sensibiliserede overflade ved indvirkning af et strømløst arbejdende metalliseringsbad.
Lagtykkelsen af metallaget er herunder en funktion af opholds-15 tiden i badet. Da det således opbyggede metallag tillejres de fast forankrede metalkim og således i løbet af den strømløse udskillelsesproces fylder mikroporerne ud, opstår der en overordentlig stærk binding mellem bærematerialet og det derpå opbyggede metallag. Om ønsket kan det uden anvendelse af 20 en ydre strømkilde opbyggede metallag videreforarbejdes ved allerede kendte fremgangsmåder, som f.eks. galvanisk metaludskillelse eller neddypningsfortinning.
For bestemte bærematerialers vedkommende har det vist sig at være fordelagtigt først at forsyne disses overflader med 25 et vedhæftningsformidlende lag. En foretrukken vedhæftnings-formidler består af:
Acrylonitril-butadien-copolymer 72 g Phenolharpiks 14 g
Methylethylketon 1200 g 30 Denne blanding kan f.eks. påføres ved neddypning eller valselakering, hvorefter den tørres eller hærdes delvis og behandles med en oxidationsmiddelopløsning for ved en foretrukken nedbrydning af de i vedhæftningsformidlerlaget fint fordelte gummibestanddele at frembringe mikroporer samt ved den almene indvirkning af oxidationsmidlet at fremstille en polær 143289 7 overflade. Efter fjernelsen af behandlingsopløsningerne behandles overfladen med en af de i tabel I anførte opløsninger og tørres derefter ved f.eks. 55-60°C. Herefter fortsættes som ovenfor beskrevet.
DK375772A 1971-07-29 1972-07-28 Fremgangsmaade til metallisering af formstoffer og isaer til fremstilling af trykte kredsloebsplader DK143289C (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US16743271A 1971-07-29 1971-07-29
US16743271 1971-07-29

Publications (2)

Publication Number Publication Date
DK143289B true DK143289B (da) 1981-08-03
DK143289C DK143289C (da) 1981-11-30

Family

ID=22607361

Family Applications (1)

Application Number Title Priority Date Filing Date
DK375772A DK143289C (da) 1971-07-29 1972-07-28 Fremgangsmaade til metallisering af formstoffer og isaer til fremstilling af trykte kredsloebsplader

Country Status (8)

Country Link
US (1) US3772056A (da)
AT (1) AT321668B (da)
CH (1) CH606485A5 (da)
DE (2) DE2265194A1 (da)
DK (1) DK143289C (da)
FR (1) FR2147337B1 (da)
IT (1) IT961766B (da)
NL (1) NL175324C (da)

Families Citing this family (63)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3993802A (en) * 1971-07-29 1976-11-23 Photocircuits Division Of Kollmorgen Corporation Processes and products for making articles for electroless plating
US3994727A (en) * 1971-07-29 1976-11-30 Photocircuits Divison Of Kollmorgen Corporation Formation of metal images using reducible non-noble metal salts and light sensitive reducing agents
US3930963A (en) * 1971-07-29 1976-01-06 Photocircuits Division Of Kollmorgen Corporation Method for the production of radiant energy imaged printed circuit boards
US4748056A (en) * 1972-07-11 1988-05-31 Kollmorgen Corporation Process and composition for sensitizing articles for metallization
US3993845A (en) * 1973-07-30 1976-11-23 Ppg Industries, Inc. Thin films containing metallic copper and silver by replacement without subsequent accelerated oxidation
CA999826A (en) * 1973-12-03 1976-11-16 Derek G.E. Kerfoot Photodeposition of metals on a non-conductive substrate
DE2409251C3 (de) * 1974-02-22 1979-03-15 Kollmorgen Corp., Hartford, Conn. (V.St.A.) Verfahren zum katalytischen Bekeimen nichtmetallischer Oberflächen für eine nachfolgende, stromlose Metallisierung und Badlösungen zur Durchführung des Verfahrens
US3928663A (en) * 1974-04-01 1975-12-23 Amp Inc Modified hectorite for electroless plating
US3958048A (en) * 1974-04-22 1976-05-18 Crown City Plating Company Aqueous suspensions for surface activation of nonconductors for electroless plating
AU8113275A (en) * 1974-07-11 1976-11-18 Kollmorgen Corp Processes and products of sensitizing substrates
US3993848A (en) * 1975-02-18 1976-11-23 Surface Technology, Inc. Catalytic primer
US3993801A (en) * 1975-02-18 1976-11-23 Surface Technology, Inc. Catalytic developer
US4082898A (en) * 1975-06-23 1978-04-04 Ppg Industries, Inc. Electroless deposition of electrically nonconductive copper-boron coatings on nonmetallic substrates
US4087586A (en) * 1975-12-29 1978-05-02 Nathan Feldstein Electroless metal deposition and article
ZA77897B (en) * 1976-04-13 1977-12-28 Kollmorgen Corp Liquid seeders and catalyzation processes for electroless metal deposition
US4084023A (en) * 1976-08-16 1978-04-11 Western Electric Company, Inc. Method for depositing a metal on a surface
US4167601A (en) * 1976-11-15 1979-09-11 Western Electric Company, Inc. Method of depositing a stress-free electroless copper deposit
US4328266A (en) * 1977-06-06 1982-05-04 Surface Technology, Inc. Method for rendering non-platable substrates platable
US4181760A (en) * 1977-06-06 1980-01-01 Surface Technology, Inc. Method for rendering non-platable surfaces platable
US4355083A (en) * 1977-06-06 1982-10-19 Nathan Feldstein Electrolessly metallized silver coated article
US4305997A (en) * 1977-06-06 1981-12-15 Surface Technology, Inc. Electrolessly metallized product of non-catalytic metal or alloy
US4228201A (en) * 1977-06-06 1980-10-14 Nathan Feldstein Method for rendering a non-platable semiconductor substrate platable
US4419390A (en) * 1977-06-06 1983-12-06 Nathan Feldstein Method for rendering non-platable semiconductor substrates platable
US4181750A (en) * 1977-09-09 1980-01-01 Western Electric Company, Inc. Method of depositing a metal on a surface
US4192764A (en) * 1977-11-03 1980-03-11 Western Electric Company, Inc. Stabilizing composition for a metal deposition process
US4133908A (en) * 1977-11-03 1979-01-09 Western Electric Company, Inc. Method for depositing a metal on a surface
US4171240A (en) * 1978-04-26 1979-10-16 Western Electric Company, Inc. Method of removing a cured epoxy from a metal surface
US4322451A (en) * 1978-05-01 1982-03-30 Western Electric Co., Inc. Method of forming a colloidal wetting sensitizer
DE2847298A1 (de) * 1978-10-27 1980-05-08 Schering Ag Verfahren zur herstellung von metallmustern auf einem isolierenden traegerstoff
US4268536A (en) * 1978-12-07 1981-05-19 Western Electric Company, Inc. Method for depositing a metal on a surface
US4379022A (en) * 1979-05-08 1983-04-05 International Business Machines Corporation Method for maskless chemical machining
US4239789A (en) * 1979-05-08 1980-12-16 International Business Machines Corporation Maskless method for electroless plating patterns
US4228213A (en) * 1979-08-13 1980-10-14 Western Electric Company, Inc. Method of depositing a stress-free electroless copper deposit
US4384893A (en) * 1979-09-14 1983-05-24 Western Electric Co., Inc. Method of forming a tin-cuprous colloidal wetting sensitizer
US4255481A (en) * 1979-09-26 1981-03-10 Western Electric Company, Inc. Mask for selectively transmitting therethrough a desired light radiant energy
US4282314A (en) * 1979-09-26 1981-08-04 Western Electric Co., Inc. Mask for selectively transmitting therethrough a desired light radiant energy
US4574094A (en) * 1983-06-09 1986-03-04 Kollmorgen Technologies Corporation Metallization of ceramics
US4604299A (en) * 1983-06-09 1986-08-05 Kollmorgen Technologies Corporation Metallization of ceramics
DE3412447A1 (de) * 1984-03-31 1985-11-28 Schering AG, 1000 Berlin und 4709 Bergkamen Verfahren zur herstellung von gedruckten schaltungen
US4666744A (en) * 1984-05-10 1987-05-19 Kollmorgen Technologies Corporation Process for avoiding blister formation in electroless metallization of ceramic substrates
US4701352A (en) * 1984-05-10 1987-10-20 Kollmorgen Corporation Surface preparation of ceramic substrates for metallization
US4837129A (en) * 1984-09-14 1989-06-06 Kollmorgen Technologies Corp. Process for producing conductor patterns on three dimensional articles
US4647477A (en) * 1984-12-07 1987-03-03 Kollmorgen Technologies Corporation Surface preparation of ceramic substrates for metallization
EP0185967A3 (en) * 1984-12-10 1988-08-03 Kollmorgen Corporation Process for avoiding blister formation in electroless metallization of ceramic substrates
US4910072A (en) * 1986-11-07 1990-03-20 Monsanto Company Selective catalytic activation of polymeric films
US5075037A (en) * 1986-11-07 1991-12-24 Monsanto Company Selective catalytic activation of polymeric films
US5268258A (en) * 1987-01-02 1993-12-07 Marks Alvin M Monomolecular resist and process for beamwriter
US5053280A (en) * 1988-09-20 1991-10-01 Hitachi-Chemical Co., Ltd. Adhesive composition for printed wiring boards with acrylonitrile-butadiene rubber having carboxyl groups and 20 ppm or less metal ionic impurities; an alkyl phenol resin; an epoxy resin; palladium catalyst, and coupling agent
US4960613A (en) * 1988-10-04 1990-10-02 General Electric Company Laser interconnect process
US5254156A (en) * 1989-05-09 1993-10-19 Hitachi Chemical Company, Ltd. Aqueous solution for activation accelerating treatment
US5053318A (en) * 1989-05-18 1991-10-01 Shipley Company Inc. Plasma processing with metal mask integration
US5082734A (en) * 1989-12-21 1992-01-21 Monsanto Company Catalytic, water-soluble polymeric films for metal coatings
US5405656A (en) * 1990-04-02 1995-04-11 Nippondenso Co., Ltd. Solution for catalytic treatment, method of applying catalyst to substrate and method of forming electrical conductor
US5100693A (en) * 1990-06-05 1992-03-31 The Research Foundation Of State University Of New York Photolytic deposition of metal from solution onto a substrate
JP2768390B2 (ja) * 1990-12-11 1998-06-25 インターナショナル・ビジネス・マシーンズ・コーポレイション 無電解金属付着のために基体をコンディショニングする方法
ES2107936B1 (es) * 1994-09-23 1998-07-01 Invest Energet Medioambient Procedimiento de acondicionamiento por metalizacion de grafito radiactivo procedente de instalaciones nucleares o de su desmantelamiento.
US6264851B1 (en) 1998-03-17 2001-07-24 International Business Machines Corporation Selective seed and plate using permanent resist
US6703186B1 (en) * 1999-08-11 2004-03-09 Mitsuboshi Belting Ltd. Method of forming a conductive pattern on a circuit board
US20090053561A1 (en) * 2006-05-08 2009-02-26 Juan Jiang Catalyst layers and related methods
US11107878B2 (en) 2015-03-24 2021-08-31 International Business Machines Corporation High resistivity iron-based, thermally stable magnetic material for on-chip integrated inductors
KR101991082B1 (ko) * 2016-12-28 2019-09-30 코오롱글로텍주식회사 차량의 감성 조명 장치 및 이를 제조하는 방법
CZ309565B6 (cs) * 2022-02-02 2023-04-12 EGO 93 s.r.o Senzibilační roztok a způsob jeho přípravy
EP4223905A1 (en) * 2022-02-08 2023-08-09 Atotech Deutschland GmbH & Co. KG Etching composition and method for etching at least one surface of a sulfur-containing thermoplastic resin-substrate

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3492151A (en) * 1966-04-06 1970-01-27 Du Pont Metallizing process
US3560257A (en) * 1967-01-03 1971-02-02 Kollmorgen Photocircuits Metallization of insulating substrates
US3451813A (en) * 1967-10-03 1969-06-24 Monsanto Co Method of making printed circuits
US3562005A (en) * 1968-04-09 1971-02-09 Western Electric Co Method of generating precious metal-reducing patterns
US3650911A (en) * 1968-08-06 1972-03-21 Hooker Chemical Corp Metallizing substrates
US3658569A (en) * 1969-11-13 1972-04-25 Nasa Selective nickel deposition

Also Published As

Publication number Publication date
CH606485A5 (da) 1978-10-31
DE2238004A1 (de) 1973-02-08
FR2147337B1 (da) 1974-10-25
US3772056A (en) 1973-11-13
DE2265194A1 (de) 1976-09-09
NL175324C (nl) 1984-10-16
DE2238004C3 (de) 1978-03-30
NL175324B (nl) 1984-05-16
IT961766B (it) 1973-12-10
NL7210532A (da) 1973-01-31
FR2147337A1 (da) 1973-03-09
DK143289C (da) 1981-11-30
AT321668B (de) 1975-04-10
DE2238004B2 (de) 1977-08-04
AU4502172A (en) 1974-01-31

Similar Documents

Publication Publication Date Title
DK143289B (da) Fremgangsmaade til metallisering af formstoffer og isaer til fremstilling af trykte kredsloebsplader
DK146780B (da) Fremgangsmaade til additiv fremstilling af ved metaludskillelse frembragte moenstre
JP4996653B2 (ja) 成形回路部品の製造方法
US3808028A (en) Method of improving adhesive properties of a surface comprising a cured epoxy
JPH0114858B2 (da)
DK147800B (da) Fremgangsmaade til fremstilling af metalliserede genstande af isolationsmateriale, fortrinsvis trykte kredsloeb
JPH0533554B2 (da)
JPS60147192A (ja) プリント配線板の製造方法
EP0231795B1 (en) Method for making printed circuit boards
EP0837623B1 (en) Method for the manufacture of printed circuit boards with plated resistors
JPS616892A (ja) プリント回路の製造方法
JP3999834B2 (ja) 成形回路部品などのめっき部品の製法
JP2008235629A (ja) 回路基板及びその製造方法
CA1224276A (en) Process for producing printed circuits
USRE28042E (en) Method of making additive printed circuit boards and product thereof
JPS6337694A (ja) 回路基板の製造方法
JPH0783182B2 (ja) 高密度多層プリント配線板の製造方法
JPS6161489A (ja) プリント配線板の製造方法
JPS6412215B2 (da)
JPH1093225A (ja) プリント配線板の製造方法
JPH01111399A (ja) プリント配線回路網の製法
JP3191686B2 (ja) 印刷配線板の製造方法
JPH09107170A (ja) プリント配線板の製造方法
JP4905318B2 (ja) 回路基板の製造方法
JPH0634443B2 (ja) プリント配線板の製造方法