DK142475B - PROCEDURE FOR MANUFACTURING MANUFACTURING PLATES WITH FIXED AND FLEXIBLE AREAS - Google Patents
PROCEDURE FOR MANUFACTURING MANUFACTURING PLATES WITH FIXED AND FLEXIBLE AREAS Download PDFInfo
- Publication number
- DK142475B DK142475B DK546677A DK546677A DK142475B DK 142475 B DK142475 B DK 142475B DK 546677 A DK546677 A DK 546677A DK 546677 A DK546677 A DK 546677A DK 142475 B DK142475 B DK 142475B
- Authority
- DK
- Denmark
- Prior art keywords
- flexible
- fixed
- manufacturing
- layers
- coupling
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/0909—Preformed cutting or breaking line
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
- Insulated Conductors (AREA)
- Combinations Of Printed Boards (AREA)
Description
i 142475in 142475
Opfindelsen angår en fremgangsmåde til fremstilling af lederplader med faste og fleksible områder og omfattende et eller flere enkeltlag ved sammenpresning af faste og fleksible enkeltlag ved hjælp af bindefolier, 5 der er udsparet i de områder, som ønskes fleksible, hvorhos kun det ene eller begge yderlag består af faste lag, og fjernelse af de faste yderlag i de områder, der ønskes fleksible.BACKGROUND OF THE INVENTION 1. Field of the Invention The invention relates to a method for producing conductive sheets having fixed and flexible regions and comprising one or more single layers by compression of solid and flexible single layers by means of adhesive sheets, which are recessed in the areas which are desired to be flexible, with only one or both outer layers. consists of fixed layers, and removal of the fixed outer layers in the areas that are desired to be flexible.
Den hurtige udvikling indenfor lederpladeteknolo-10 gien har ført fra ensidige lederplader til den tosidige, gennemkontakterede lederplade, til flerlagskoblingen og til den fleksible kobling. Efter hinanden afstemte faste og fleksible bærematerialer sammenpresset med bindefolier muliggør på det seneste ved områdevis fjer-15 nelse af de faste bæredele fremstilling af trykte kredsløb med faste og fleksible områder som en koblingsenhed, uafhængigt af antallet af koblingsplaner.The rapid development of conductor plate technology has led from one-sided conductor plates to the two-sided, through-contacted conductor plate, to the multilayer coupling and to the flexible coupling. Tailored solid and flexible carriers compressed with binder foils lately allow, by area removal of the solid carriers, printed circuits with fixed and flexible regions as a coupling unit, independent of the number of coupling planes.
Lederpladen med faste og fleksible områder er opbygget af faste og fleksible enkeltlag, der ved hjælp 20 af bindefolier sammenklæbes fast til hinanden. Der er her tale om bøjelige og ubøjelige isolationsbærere med ensidig eller tosidig kobberbelægning. Formen af de faste lag fastlægger den faste del af koblingen. De fleksible lag fører ud af den faste del og danner de 25 fleksible koblingsområder, der forbinder yderligere dele af koblingen med hinanden eller etablerer forbindelsen til eksterne komponentgrupper. Den elektriske forbindelse mellem de enkelte lag etableres i form af metalliserede boringer. Fremstillingen af sådanne le-30 derplader er eksempelvis beskrevet i "Feinwerktechnik & Messtechnik, 84 (1976), siderne 317-320".The guide plate with fixed and flexible areas is made up of solid and flexible single layers, which are bonded together by means of 20 foil foils. These are flexible and rigid insulation carriers with one-sided or double-sided copper coating. The shape of the fixed layers determines the fixed part of the coupling. The flexible layers extend out of the fixed portion and form the 25 flexible coupling regions that connect additional portions of the coupling to each other or establish the connection to external component groups. The electrical connection between the individual layers is established in the form of metallized bores. The preparation of such leather plates is described, for example, in "Feinwerktechnik & Messtechnik, 84 (1976), pages 317-320".
Lederplader med faste og fleksible områder er hidtil blevet fremstillet således, at der før lamineringen af enkeltlagene til den samlede kobling i de faste yder-35 lag blev frembragt en udbrydning med en størrelse og beliggenhed svarende til den ønskede beliggenhed af den fleksible del af lederpladen. Efter lamineringen skal disse udbrydninger tildækkes hermetisk under den fort- 142475 2 satte fremstillingsproces for at forhindre metalliseringer på den fleksible del og på overgangen til den faste del. Denne tildækning er besværlig og kostbar, og på trods af stor omhu kan der optræde fejl, som fører til 5 en irreparabel skade, idet en mangelfuld aftætning samt beliggenhedsfejl af afdækningen ikke kan udelukkes. Det påførte kobbers ringe vedhæftningsevne til afdækningen kan derudover genere yderligere fremstillingstrin betydeligt som følge af løse partikler.Conductor plates with fixed and flexible regions have so far been manufactured such that before the lamination of the single layers to the total coupling in the fixed outer layers, a breakout of a size and position corresponding to the desired location of the flexible part of the conductor plate was produced. After lamination, these breakouts must be hermetically covered during the continued manufacturing process to prevent metallization on the flexible part and on the transition to the solid part. This cover is cumbersome and costly, and despite great care, errors may occur that lead to irreparable damage, as a faulty seal and location error of the cover cannot be ruled out. In addition, the poor adhesion of the applied copper to the cover may significantly incur additional manufacturing steps due to loose particles.
10 Maskinel bestykning og lodning forudsætter alminde ligvis faste lederplader. Til viderebearbejdningen af lederplader med faste og fleksible områder har man derfor hidtil almindeligvis for hver koblingstype skullet anvende specielle indretninger. Desuden anbefales det 15 også at dække den fleksible del under loddeprocessen.10 Mechanical casting and brazing usually requires fixed conductor plates. Therefore, for the further processing of conductor plates with fixed and flexible regions, special devices have to be used so far for each type of coupling. In addition, it is also recommended to cover the flexible part during the soldering process.
Opfindelsen tager derfor sigte på at angive en fremgangsmåde til fremstilling af lederplader med faste og fleksible områder og med et eller flere enkeltlag, som muliggør en sikker og rationel tildækning af den 20 fleksible del ved de yderligere fremstillingstrin og at udelukke ukontrollerbare beliggenhedsfejl af afdækningen .The invention therefore aims to provide a method for manufacturing guide plates having fixed and flexible regions and with one or more single layers, which enable a safe and rational coverage of the flexible part at the further manufacturing steps and to exclude uncontrollable location errors of the cover.
Denne opgave løses med en fremgangsmåde af den indledningsvis omhandlede art ifølge opfindelsen ved, at 25 der til fjernelse af de faste yderlag i disse områder langs skillelinierne mellem faste og fleksible dele af lederpladen frembringes noter på de faste yderlags inderside før sammenpresningen og på deres yderside efter udformningen af lederbillederne, og at områderne mellem 30 noterne brydes ud.This task is solved by a method of the invention according to the invention in that, for removing the solid outer layers in these areas along the dividing lines between solid and flexible parts of the conductor plate, notes are produced on the inside of the fixed outer layer before compression and on their outside after the layout of the lead images and the areas between the 30 notes breaking out.
Før sammenpresningen af enkeltlagene bliver der i de faste yderlag på den mod det fleksible lag vendende side (indersiden) langs skillelinien mellem koblingens faste og fleksible del frembragt en not, idet notdybden 35 vælges således, at disse lags ydersider ikke beskadiges. Bindefolien, ved hjælp af hvilken enkeltlagene sammen-klæbes, udskæres over koblingens fleksible del, således at der ikke sker nogen klæbning af det faste yderlag 3 142475 over den del, der skal være fleksibel. Ved anvendelse af klæbefolier, der flyder under sammenpresningen, kan man på fordelagtig måde undgå klæbemiddeludflydning på den fleksible del ved indlægning af skillefolier i bin-5 defoliens udbrydninger. Orienteringen af enkeltlagene i forhold til hinanden og af lederbillederne i forhold til noten sker ved hjælp af positioneringsstifter.Prior to the compression of the single layers, a groove is formed in the fixed outer layers on the side (inner side) facing the flexible layer along the dividing line between the fixed and flexible part of the coupling, the groove depth 35 being chosen so that the outer sides of these layers are not damaged. The binder foil, by means of which the single layers are bonded together, is cut over the flexible part of the coupling, so that there is no adhesion of the fixed outer layer 3 over the part which must be flexible. Advantageously, by using adhesive foils flowing during compression, adhesive effluent on the flexible portion can be avoided by inserting separator foils into the bins of the binder. The orientation of the individual layers relative to each other and of the leader images relative to the note is done by positioning pins.
Enkeltlagene i de efter denne fremgangsmåde laminerede emner er bortset fra koblingens fleksible del 10 sammenklæbet overalt, specielt i randzonerne. Den fleksible del er således hermetisk indesluttet, og emnet udviser en sluttet overflade af yderlagene, som gør det muligt at viderebearbejde emnerne på den samme økonomiske måde, som er almindelig ved fremstillingen af 15 faste lederplader.The single layers of the laminated articles according to this method, apart from the flexible part 10 of the coupling, are glued everywhere, especially in the peripheral zones. Thus, the flexible portion is hermetically enclosed and the blank exhibits a closed surface of the outer layers which allows the blanks to be further worked in the same economical manner as is common in the manufacture of 15 solid conductor sheets.
Efter udformningen af lederbillederne på yderlagene bliver der til etablering af en ren overgang mellem koblingens faste og fleksible del igen frembragt noter langs skillelinierne mellem den faste og den fleksible 20 del. Da der på indersiden af de faste yderlag på dette sted allerede findes en not, kan notdybden indstilles således, at en beskadigelse af det fleksible lag med sikkerhed kan udelukkes. Efter konturskæringen af koblingen falder den faste del af yderlaget over den flek-25 sible del ud, eller den kan let trækkes af den fleksible del.After designing the conductor images on the outer layers, notes are again created along the dividing lines between the fixed and flexible parts for establishing a clean transition between the fixed and flexible part of the coupling. Since there is already a groove on the inside of the fixed outer layers at this location, the depth of the groove can be adjusted so that damage to the flexible layer can be safely excluded. After the contour cut of the coupling, the fixed portion of the outer layer falls over the flexible portion or it can be easily pulled by the flexible portion.
Ved en fordelagtig videreudvikling af opfindelsen gennembrydes yderlaget ikke fuldstændigt ved notdannelsen på ydersiden, og den over den fleksible del belig-30 gende del af det faste yderlag forbliver forbundet med koblingens faste del ved hjælp af mellemliggende dele subsidiært ved hjælp af det tilbageværende lag af yderbæreren. Yderlaget over den fleksible del tjener da som afdækning og afstivning af lederpladen, der derved kan 35 bestykkes og loddes uden særlige indretninger.In an advantageous further development of the invention, the outer layer is not completely pierced by the groove formation on the outside, and the part of the fixed outer layer lying over the flexible part remains connected to the fixed part of the coupling by means of intermediate parts or alternatively by the remaining layer of the outer support. . The outer layer over the flexible part then serves as the covering and stiffening of the conductor plate, which can thereby be cast and soldered without special devices.
Afdækningen kan let udbrydes eller løsnes ved perforeringen.The cover can be easily broken or loosened during the perforation.
Fremgangsmåden ifølge opfindelsen forklares i det 142475 4 følgende nærmere på grundlag af et udførelseseksempel under henvisning til tegningen, hvor fig, 1 viser et skematisk planbillede af en lederplade, 5 fig. 2 et skematisk længdesnit i en lederplade før udformningen af lederbillederne, fig. 3 et skematisk planbillede af en lederplade, fig. 4 et skematisk længdesnit i en lederplade efter udformningen af lederbillederne, hvilken lederplade 10 kun har ét fast yderlag, og figurerne 5 og 6 analogt en lederplade med to faste yderlag.The method according to the invention is explained in the following in more detail on the basis of an exemplary embodiment with reference to the drawing, in which fig. 1 shows a schematic plan view of a conductor plate; 2 is a schematic longitudinal section of a conductor plate prior to forming the conductor images; FIG. 3 is a schematic plan view of a conductor plate; FIG. 4 is a schematic longitudinal sectional view of a conductor plate according to the design of the conductor images, said conductor plate 10 having only one fixed outer layer, and figures 5 and 6 analogously a conductor plate having two fixed outer layers.
Den i figurerne 1 og 2 viste lagopbygning af emnet har et på den ene side med en kobberfolie 8 belagt 15 fast yderlag 3 med en skillenot 4 på indersiden, en i koblingens fleksible del udsparet bindefolie 2 og et på den ene side med en kobberfolie 10 belagt fleksibelt yderlag 1. Figurerne 3 og 4 viser emnet efter udformningen af lederbillederne og skillenoten 5 20 på ydersiden af det faste yderlag 3. Efter kontursnittet forbliver lederpladen 7, og den faste del 6 kan løsgøres over den fleksible del, eller den forbliver som afstivning, indtil loddeprocessen på den fleksible del er afsluttet. Positioneringsboringer 9 tje-25 ner til orientering af lederbillederne.The layer structure of the blank shown in figures 1 and 2 has a fixed outer layer 3 coated on one side with a copper foil 8 with a separating note 4 on the inside, a binding foil 2 cut into the flexible part of the coupling and a copper foil 10 on one side. coated flexible outer layer 1. Figures 3 and 4 show the workpiece after the design of the conductor images and the separator 5 20 on the outside of the fixed outer layer 3. After the contour cut, the conductor plate 7 remains and the fixed part 6 can be detached over the flexible part or it remains as a stiffener. until the soldering process on the flexible part is completed. Positioning bores 9 teeth for orientation of the conductor images.
Figurerne 5 og 6 viser et udførelseseksempel med to faste yderlag 13. I udskæringen i bindefolien 12 er der yderligere indlagt en skillefolie 18 med henblik på at forhindre en eventuel klæbemiddeludflydning 30 på den fleksible del. Lederbillederne 16 på inderla-gene udformes før sammenpresningen. Orienteringen af lederbillederne 16 i forhold til hinanden og til noterne 14 og 15 sker ved hjælp af positioneringsboringer 19. Det dobbeltsidede fleksible lag 11 er yder-35 ligere forsynet med dækfolier.Figures 5 and 6 show an exemplary embodiment with two fixed outer layers 13. In the cutout in the binder foil 12, a separating foil 18 is further inserted in order to prevent any adhesive flow 30 on the flexible part. The conductor images 16 on the inner layers are formed prior to compression. The orientation of the conductor images 16 relative to each other and to the grooves 14 and 15 is accomplished by positioning bores 19. The double-sided flexible layer 11 is further provided with cover foils.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2657212 | 1976-12-17 | ||
DE19762657212 DE2657212C3 (en) | 1976-12-17 | 1976-12-17 | Process for the production of rigid and flexible areas having printed circuit boards |
Publications (3)
Publication Number | Publication Date |
---|---|
DK546677A DK546677A (en) | 1978-06-18 |
DK142475B true DK142475B (en) | 1980-11-03 |
DK142475C DK142475C (en) | 1981-03-30 |
Family
ID=5995786
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK546677A DK142475C (en) | 1976-12-17 | 1977-12-08 | PROCEDURE FOR MANUFACTURING MANUFACTURING PLATES WITH FIXED AND FLEXIBLE AREAS |
Country Status (10)
Country | Link |
---|---|
BE (1) | BE861966A (en) |
CH (1) | CH630202A5 (en) |
DE (1) | DE2657212C3 (en) |
DK (1) | DK142475C (en) |
FR (1) | FR2374818A1 (en) |
GB (1) | GB1561620A (en) |
IE (1) | IE46109B1 (en) |
IT (1) | IT1091374B (en) |
NL (1) | NL180294C (en) |
SE (1) | SE424132B (en) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2946726C2 (en) * | 1979-11-20 | 1982-05-19 | Ruwel-Werke Spezialfabrik für Leiterplatten GmbH, 4170 Geldern | Printed circuit board with rigid and flexible areas and process for their manufacture |
DE3047197C1 (en) * | 1980-12-15 | 1982-05-27 | Siemens AG, 1000 Berlin und 8000 München | Process for the production of printed circuit boards which have sections which are relatively rigid and, on the other hand, relatively flexible areas |
DE3119884C1 (en) * | 1981-05-19 | 1982-11-04 | Fritz Wittig Herstellung gedruckter Schaltungen, 8000 München | Process for the production of rigid and flexible printed circuit boards |
DE3140061C1 (en) * | 1981-10-08 | 1983-02-03 | Siemens AG, 1000 Berlin und 8000 München | Method of producing printed circuit boards having rigid and flexible regions |
DE3318717C1 (en) * | 1983-05-21 | 1984-05-30 | Grundig E.M.V. Elektro-Mechanische Versuchsanstalt Max Grundig & Co KG, 8510 Fürth | Process for manufacturing printed circuit boards with rigid and flexible areas |
DE3434672C2 (en) * | 1984-09-21 | 1986-09-11 | Fa. Carl Freudenberg, 6940 Weinheim | Process for the production of flexible printed circuit boards for high bending stress |
DE3535773C1 (en) * | 1985-10-07 | 1987-04-23 | Messerschmitt Boelkow Blohm | Method for producing rigid-flexible multilayer circuits |
DE3624719A1 (en) * | 1986-07-22 | 1988-01-28 | Schoeller & Co Elektronik | PRELAMINATE FOR RIGID-FLEXIBLE PCB |
DE3624718A1 (en) * | 1986-07-22 | 1988-01-28 | Schoeller & Co Elektronik | MULTI-LAYER, RIGID AND FLEXIBLE AREAS HAVING PCB |
JP2631287B2 (en) * | 1987-06-30 | 1997-07-16 | 日本メクトロン 株式会社 | Manufacturing method of hybrid multilayer circuit board |
DE3723414A1 (en) * | 1987-07-15 | 1989-01-26 | Leitron Leiterplatten | METHOD FOR PRODUCING PRINTED CIRCUITS IN RIGID OR RIGID-FLEXIBLE MULTIPLE-LAYER TECHNOLOGY |
JP2676112B2 (en) * | 1989-05-01 | 1997-11-12 | イビデン株式会社 | Manufacturing method of electronic component mounting board |
EP0408773B1 (en) * | 1989-07-15 | 1993-07-07 | Firma Carl Freudenberg | Process for the production of circuit boards or inner layers of circuit boards containing rigid and flexible parts |
DE4003344C1 (en) * | 1990-02-05 | 1991-06-13 | Fa. Carl Freudenberg, 6940 Weinheim, De | |
DE4003345C1 (en) * | 1990-02-05 | 1991-08-08 | Fa. Carl Freudenberg, 6940 Weinheim, De | |
DE4131934A1 (en) * | 1991-09-25 | 1993-04-08 | Degussa | Mfg. circuit board with flexible section - using blank with cut=out regions and joining by forming thin laminate of same material as main section |
DE4206746C1 (en) * | 1992-03-04 | 1993-06-24 | Degussa Ag, 6000 Frankfurt, De | Manufacture of circuit board with rigid and flexible sections - has flexible sections created by having non-bonding insert of insulation broken away |
US6298013B1 (en) | 1993-11-15 | 2001-10-02 | Siemens Aktiengesellschaft | Device for monitoring the travel time of mail shipments |
DE10248112B4 (en) * | 2002-09-09 | 2007-01-04 | Ruwel Ag | Process for the production of printed electrical circuits |
DE10258090B4 (en) * | 2002-09-19 | 2009-01-29 | Ruwel Ag | Method for producing rigid-flexible printed circuit boards and printed circuit boards with at least one rigid area and at least one flexible area |
DE10243637B4 (en) | 2002-09-19 | 2007-04-26 | Ruwel Ag | Printed circuit board with at least one rigid and at least one flexible region and method for producing rigid-flexible printed circuit boards |
DE20221189U1 (en) * | 2002-09-19 | 2005-05-19 | Ruwel Ag | Printed circuit board with at least one rigid area and at least one flexible area |
CN113286437B (en) * | 2021-06-11 | 2021-10-01 | 四川英创力电子科技股份有限公司 | Auxiliary device for processing rigid-flex board and using method thereof |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3459626A (en) * | 1964-11-06 | 1969-08-05 | Morgan Adhesives Co | Label carrier and release laminate |
FR1481461A (en) * | 1965-06-01 | 1967-05-19 | Philips Nv | Printed wiring plate |
AT256275B (en) * | 1965-06-01 | 1967-08-10 | Philips Nv | Circuit board which can be divided into at least two circuit board parts along a break line or break lines defined by a perforation, notches or the like |
-
1976
- 1976-12-17 DE DE19762657212 patent/DE2657212C3/en not_active Expired
-
1977
- 1977-11-28 GB GB4940477A patent/GB1561620A/en not_active Expired
- 1977-12-05 NL NL7713431A patent/NL180294C/en not_active IP Right Cessation
- 1977-12-08 DK DK546677A patent/DK142475C/en active
- 1977-12-15 IE IE254977A patent/IE46109B1/en not_active IP Right Cessation
- 1977-12-15 SE SE7714310A patent/SE424132B/en unknown
- 1977-12-16 BE BE6046268A patent/BE861966A/en not_active IP Right Cessation
- 1977-12-16 IT IT6982677A patent/IT1091374B/en active
- 1977-12-16 CH CH1554277A patent/CH630202A5/en not_active IP Right Cessation
- 1977-12-19 FR FR7738326A patent/FR2374818A1/en active Granted
Also Published As
Publication number | Publication date |
---|---|
BE861966A (en) | 1978-06-16 |
DE2657212B2 (en) | 1979-08-09 |
SE424132B (en) | 1982-06-28 |
NL180294C (en) | 1987-02-02 |
NL7713431A (en) | 1978-06-20 |
FR2374818A1 (en) | 1978-07-13 |
SE7714310L (en) | 1978-06-18 |
IT1091374B (en) | 1985-07-06 |
IE46109L (en) | 1978-06-17 |
DE2657212C3 (en) | 1982-09-02 |
IE46109B1 (en) | 1983-02-23 |
FR2374818B1 (en) | 1982-05-21 |
CH630202A5 (en) | 1982-05-28 |
DK546677A (en) | 1978-06-18 |
GB1561620A (en) | 1980-02-27 |
NL180294B (en) | 1986-09-01 |
DE2657212A1 (en) | 1978-06-22 |
DK142475C (en) | 1981-03-30 |
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