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DE3140061C1 - Method of producing printed circuit boards having rigid and flexible regions - Google Patents

Method of producing printed circuit boards having rigid and flexible regions

Info

Publication number
DE3140061C1
DE3140061C1 DE19813140061 DE3140061A DE3140061C1 DE 3140061 C1 DE3140061 C1 DE 3140061C1 DE 19813140061 DE19813140061 DE 19813140061 DE 3140061 A DE3140061 A DE 3140061A DE 3140061 C1 DE3140061 C1 DE 3140061C1
Authority
DE
Grant status
Grant
Patent type
Prior art keywords
rigid
flexible
layers
circuit
printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE19813140061
Inventor
Eduard Dipl-Chem Dr Grasser
Heinz Hecktor
Herbert Hoeger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Grant date

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4688Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0332Structure of the conductor
    • H05K2201/0335Layered conductors or foils
    • H05K2201/0355Metal foils
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/0909Preformed cutting or breaking line
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107Using laser light
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0017Etching of the substrate by chemical or physical means
    • H05K3/0026Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0035Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom

Abstract

In the production of rigid-flexible printed circuit boards, before the rigid (2) and flexible (1) layers are laminated, the insulation layer (4) of the single-sided copper-clad outer rigid layers (2) is cut through down to the cladding (5) along the rigid-flexible boundary lines (6) using a laser. After lamination, the bridges formed by the cladding across the boundary lines are concomitantly removed during the formation of the conductor tracks etc. on the cladding (5), so that the rigid layers (2) separate from the regions required to be flexible during contour milling of the printed circuit board. <IMAGE>
DE19813140061 1981-10-08 1981-10-08 Method of producing printed circuit boards having rigid and flexible regions Expired DE3140061C1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19813140061 DE3140061C1 (en) 1981-10-08 1981-10-08 Method of producing printed circuit boards having rigid and flexible regions

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19813140061 DE3140061C1 (en) 1981-10-08 1981-10-08 Method of producing printed circuit boards having rigid and flexible regions

Publications (1)

Publication Number Publication Date
DE3140061C1 true DE3140061C1 (en) 1983-02-03

Family

ID=6143707

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19813140061 Expired DE3140061C1 (en) 1981-10-08 1981-10-08 Method of producing printed circuit boards having rigid and flexible regions

Country Status (1)

Country Link
DE (1) DE3140061C1 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3535773C1 (en) * 1985-10-07 1987-04-23 Messerschmitt Boelkow Blohm Method for producing rigid-flexible multilayer circuits
DE4007558A1 (en) * 1989-03-10 1990-09-13 Hitachi Ltd Multi-layer circuit board, method for production thereof and its application
DE4006063A1 (en) * 1989-05-01 1990-11-08 Ibiden Co Ltd A process for producing a circuit board for electronic modules
EP0408773A1 (en) * 1989-07-15 1991-01-23 Firma Carl Freudenberg Process for the production of circuit boards or inner layers of circuit boards containing rigid and flexible parts
CN103491730A (en) * 2013-07-25 2014-01-01 博罗县精汇电子科技有限公司 Shape manufacturing method of soft and hard combined circuit board
CN105472891A (en) * 2015-12-31 2016-04-06 武汉凌云光电科技有限责任公司 Method for carrying out rigid circuit board cutting by laser

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2657212B2 (en) * 1976-12-17 1979-08-09 Schoeller & Co Elektronik Gmbh, 3552 Wetter

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2657212B2 (en) * 1976-12-17 1979-08-09 Schoeller & Co Elektronik Gmbh, 3552 Wetter

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
"Feinwerktechnik und Meßtechnik", H. 7, Okt./Nov. 1976, S.318 bis 320 *

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3535773C1 (en) * 1985-10-07 1987-04-23 Messerschmitt Boelkow Blohm Method for producing rigid-flexible multilayer circuits
DE4007558A1 (en) * 1989-03-10 1990-09-13 Hitachi Ltd Multi-layer circuit board, method for production thereof and its application
DE4006063A1 (en) * 1989-05-01 1990-11-08 Ibiden Co Ltd A process for producing a circuit board for electronic modules
EP0408773A1 (en) * 1989-07-15 1991-01-23 Firma Carl Freudenberg Process for the production of circuit boards or inner layers of circuit boards containing rigid and flexible parts
CN103491730A (en) * 2013-07-25 2014-01-01 博罗县精汇电子科技有限公司 Shape manufacturing method of soft and hard combined circuit board
CN105472891A (en) * 2015-12-31 2016-04-06 武汉凌云光电科技有限责任公司 Method for carrying out rigid circuit board cutting by laser

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Legal Events

Date Code Title Description
8100 Publication of the examined application without publication of unexamined application
D1 Grant (no unexamined application published) patent law 81
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee