DK546677A - PROCEDURE FOR MANUFACTURE OF FIXED FLEXIBLE CONDUCTOR PLATES - Google Patents

PROCEDURE FOR MANUFACTURE OF FIXED FLEXIBLE CONDUCTOR PLATES

Info

Publication number
DK546677A
DK546677A DK546677A DK546677A DK546677A DK 546677 A DK546677 A DK 546677A DK 546677 A DK546677 A DK 546677A DK 546677 A DK546677 A DK 546677A DK 546677 A DK546677 A DK 546677A
Authority
DK
Denmark
Prior art keywords
procedure
manufacture
flexible conductor
conductor plates
fixed flexible
Prior art date
Application number
DK546677A
Other languages
Danish (da)
Other versions
DK142475C (en
DK142475B (en
Inventor
H Kober
Original Assignee
Schoeller & Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schoeller & Co filed Critical Schoeller & Co
Publication of DK546677A publication Critical patent/DK546677A/en
Publication of DK142475B publication Critical patent/DK142475B/en
Application granted granted Critical
Publication of DK142475C publication Critical patent/DK142475C/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/0909—Preformed cutting or breaking line

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Insulated Conductors (AREA)
DK546677A 1976-12-17 1977-12-08 PROCEDURE FOR MANUFACTURING MANUFACTURING PLATES WITH FIXED AND FLEXIBLE AREAS DK142475C (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE2657212 1976-12-17
DE19762657212 DE2657212C3 (en) 1976-12-17 1976-12-17 Process for the production of rigid and flexible areas having printed circuit boards

Publications (3)

Publication Number Publication Date
DK546677A true DK546677A (en) 1978-06-18
DK142475B DK142475B (en) 1980-11-03
DK142475C DK142475C (en) 1981-03-30

Family

ID=5995786

Family Applications (1)

Application Number Title Priority Date Filing Date
DK546677A DK142475C (en) 1976-12-17 1977-12-08 PROCEDURE FOR MANUFACTURING MANUFACTURING PLATES WITH FIXED AND FLEXIBLE AREAS

Country Status (10)

Country Link
BE (1) BE861966A (en)
CH (1) CH630202A5 (en)
DE (1) DE2657212C3 (en)
DK (1) DK142475C (en)
FR (1) FR2374818A1 (en)
GB (1) GB1561620A (en)
IE (1) IE46109B1 (en)
IT (1) IT1091374B (en)
NL (1) NL180294C (en)
SE (1) SE424132B (en)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2946726C2 (en) * 1979-11-20 1982-05-19 Ruwel-Werke Spezialfabrik für Leiterplatten GmbH, 4170 Geldern Printed circuit board with rigid and flexible areas and process for their manufacture
DE3047197C1 (en) * 1980-12-15 1982-05-27 Siemens AG, 1000 Berlin und 8000 München Process for the production of printed circuit boards which have sections which are relatively rigid and, on the other hand, relatively flexible areas
DE3119884C1 (en) * 1981-05-19 1982-11-04 Fritz Wittig Herstellung gedruckter Schaltungen, 8000 München Process for the production of rigid and flexible printed circuit boards
DE3140061C1 (en) * 1981-10-08 1983-02-03 Siemens AG, 1000 Berlin und 8000 München Method of producing printed circuit boards having rigid and flexible regions
DE3318717C1 (en) * 1983-05-21 1984-05-30 Grundig E.M.V. Elektro-Mechanische Versuchsanstalt Max Grundig & Co KG, 8510 Fürth Process for manufacturing printed circuit boards with rigid and flexible areas
DE3434672C2 (en) * 1984-09-21 1986-09-11 Fa. Carl Freudenberg, 6940 Weinheim Process for the production of flexible printed circuit boards for high bending stress
DE3535773C1 (en) * 1985-10-07 1987-04-23 Messerschmitt Boelkow Blohm Method for producing rigid-flexible multilayer circuits
DE3624718A1 (en) * 1986-07-22 1988-01-28 Schoeller & Co Elektronik MULTI-LAYER, RIGID AND FLEXIBLE AREAS HAVING PCB
DE3624719A1 (en) * 1986-07-22 1988-01-28 Schoeller & Co Elektronik PRELAMINATE FOR RIGID-FLEXIBLE PCB
JP2631287B2 (en) * 1987-06-30 1997-07-16 日本メクトロン 株式会社 Manufacturing method of hybrid multilayer circuit board
DE3723414A1 (en) * 1987-07-15 1989-01-26 Leitron Leiterplatten METHOD FOR PRODUCING PRINTED CIRCUITS IN RIGID OR RIGID-FLEXIBLE MULTIPLE-LAYER TECHNOLOGY
JP2676112B2 (en) * 1989-05-01 1997-11-12 イビデン株式会社 Manufacturing method of electronic component mounting board
ATE91377T1 (en) * 1989-07-15 1993-07-15 Freudenberg Carl Fa PROCESS FOR THE MANUFACTURE OF RIGID AND FLEXIBLE AREAS OF PCBS OR INNER LAYERS OF PCBS.
DE4003344C1 (en) * 1990-02-05 1991-06-13 Fa. Carl Freudenberg, 6940 Weinheim, De
DE4003345C1 (en) * 1990-02-05 1991-08-08 Fa. Carl Freudenberg, 6940 Weinheim, De
DE4131934A1 (en) * 1991-09-25 1993-04-08 Degussa Mfg. circuit board with flexible section - using blank with cut=out regions and joining by forming thin laminate of same material as main section
DE4206746C1 (en) * 1992-03-04 1993-06-24 Degussa Ag, 6000 Frankfurt, De Manufacture of circuit board with rigid and flexible sections - has flexible sections created by having non-bonding insert of insulation broken away
US6298013B1 (en) 1993-11-15 2001-10-02 Siemens Aktiengesellschaft Device for monitoring the travel time of mail shipments
DE10248112B4 (en) * 2002-09-09 2007-01-04 Ruwel Ag Process for the production of printed electrical circuits
DE20221189U1 (en) * 2002-09-19 2005-05-19 Ruwel Ag Printed circuit board with at least one rigid area and at least one flexible area
DE10258090B4 (en) * 2002-09-19 2009-01-29 Ruwel Ag Method for producing rigid-flexible printed circuit boards and printed circuit boards with at least one rigid area and at least one flexible area
DE10243637B4 (en) 2002-09-19 2007-04-26 Ruwel Ag Printed circuit board with at least one rigid and at least one flexible region and method for producing rigid-flexible printed circuit boards
CN113286437B (en) * 2021-06-11 2021-10-01 四川英创力电子科技股份有限公司 Auxiliary device for processing rigid-flex board and using method thereof

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3459626A (en) * 1964-11-06 1969-08-05 Morgan Adhesives Co Label carrier and release laminate
FR1481461A (en) * 1965-06-01 1967-05-19 Philips Nv Printed wiring plate
AT256275B (en) * 1965-06-01 1967-08-10 Philips Nv Circuit board which can be divided into at least two circuit board parts along a break line or break lines defined by a perforation, notches or the like

Also Published As

Publication number Publication date
FR2374818B1 (en) 1982-05-21
BE861966A (en) 1978-06-16
DE2657212B2 (en) 1979-08-09
DK142475C (en) 1981-03-30
DE2657212C3 (en) 1982-09-02
CH630202A5 (en) 1982-05-28
IT1091374B (en) 1985-07-06
NL180294C (en) 1987-02-02
DK142475B (en) 1980-11-03
DE2657212A1 (en) 1978-06-22
GB1561620A (en) 1980-02-27
FR2374818A1 (en) 1978-07-13
SE7714310L (en) 1978-06-18
IE46109L (en) 1978-06-17
NL180294B (en) 1986-09-01
NL7713431A (en) 1978-06-20
SE424132B (en) 1982-06-28
IE46109B1 (en) 1983-02-23

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