DK1303828T3 - Sensorchip, specielt til fingeraftrykssensorer - Google Patents

Sensorchip, specielt til fingeraftrykssensorer

Info

Publication number
DK1303828T3
DK1303828T3 DK01938853T DK01938853T DK1303828T3 DK 1303828 T3 DK1303828 T3 DK 1303828T3 DK 01938853 T DK01938853 T DK 01938853T DK 01938853 T DK01938853 T DK 01938853T DK 1303828 T3 DK1303828 T3 DK 1303828T3
Authority
DK
Denmark
Prior art keywords
sensor chip
chip
fingerprint sensors
substrate
sensor
Prior art date
Application number
DK01938853T
Other languages
English (en)
Inventor
Jon Nysaether
Bjoern Erik Seeberg
Mathiassen Svein
Ovidiu Vermesan
Original Assignee
Idex Asa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Idex Asa filed Critical Idex Asa
Application granted granted Critical
Publication of DK1303828T3 publication Critical patent/DK1303828T3/da

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L24/17—Structure, shape, material or disposition of the bump connectors after the connecting process of a plurality of bump connectors
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/1335—Combining adjacent partial images (e.g. slices) to create a composite input or reference pattern; Tracking a sweeping finger movement
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16235—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a via metallisation of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15192—Resurf arrangement of the internal vias
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
    • H01L2924/15321—Connection portion the connection portion being formed on the die mounting surface of the substrate being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides

Landscapes

  • Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Multimedia (AREA)
  • Theoretical Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
  • Image Input (AREA)
  • Thin Film Transistor (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Measuring Pulse, Heart Rate, Blood Pressure Or Blood Flow (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
DK01938853T 2000-06-09 2001-06-08 Sensorchip, specielt til fingeraftrykssensorer DK1303828T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NO20003004A NO315017B1 (no) 2000-06-09 2000-06-09 Sensorbrikke, s¶rlig for måling av strukturer i en fingeroverflate
PCT/NO2001/000238 WO2001099035A2 (en) 2000-06-09 2001-06-08 Sensor unit, especially for fingerprint sensors

Publications (1)

Publication Number Publication Date
DK1303828T3 true DK1303828T3 (da) 2008-05-19

Family

ID=19911250

Family Applications (1)

Application Number Title Priority Date Filing Date
DK01938853T DK1303828T3 (da) 2000-06-09 2001-06-08 Sensorchip, specielt til fingeraftrykssensorer

Country Status (12)

Country Link
US (2) US7251351B2 (da)
EP (1) EP1303828B1 (da)
JP (1) JP4708671B2 (da)
AT (1) ATE384306T1 (da)
AU (1) AU2001264429A1 (da)
CY (1) CY1107257T1 (da)
DE (1) DE60132460T2 (da)
DK (1) DK1303828T3 (da)
ES (1) ES2299488T3 (da)
NO (1) NO315017B1 (da)
PT (1) PT1303828E (da)
WO (1) WO2001099035A2 (da)

Families Citing this family (107)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NO315016B1 (no) * 2000-06-09 2003-06-23 Idex Asa Miniatyrisert sensor
NO315017B1 (no) * 2000-06-09 2003-06-23 Idex Asa Sensorbrikke, s¶rlig for måling av strukturer i en fingeroverflate
US7099496B2 (en) * 2000-12-05 2006-08-29 Validity Sensors, Inc. Swiped aperture capacitive fingerprint sensing systems and methods
JP4702586B2 (ja) * 2001-09-10 2011-06-15 日本電気株式会社 指紋センサ及び指紋センサ実装構造並びに該指紋センサを備えた指紋検出器
US6941004B2 (en) * 2001-12-06 2005-09-06 Motorola, Inc. Method and apparatus for asperity sensing and storage
DE10206187B4 (de) * 2002-02-14 2007-03-08 Infineon Technologies Ag Bildgebender, elektronischer Sensor
NO316796B1 (no) * 2002-03-01 2004-05-10 Idex Asa Sensormodul for maling av strukturer i en overflate, saerlig en fingeroverflate
KR100447141B1 (ko) * 2002-03-09 2004-09-07 (주)멜파스 차폐수단을 포함하는 반도체 지문감지장치
FI20030102A0 (fi) 2003-01-22 2003-01-22 Nokia Corp Henkilön varmennusjärjestely
FI115109B (fi) * 2003-01-22 2005-02-28 Nokia Corp Tunnistusjärjestely ja tunnistusjärjestelyn käsittävä matkaviestin
WO2004077340A1 (en) * 2003-02-28 2004-09-10 Idex Asa Substrate multiplexing with active switches
US7697729B2 (en) 2004-01-29 2010-04-13 Authentec, Inc. System for and method of finger initiated actions
WO2005093637A1 (de) * 2004-03-29 2005-10-06 Hoffmann Andre Verfahren und system zur identifikation, verifikation, erkennung und wiedererkennung
US8229184B2 (en) 2004-04-16 2012-07-24 Validity Sensors, Inc. Method and algorithm for accurate finger motion tracking
US7463756B2 (en) * 2004-04-16 2008-12-09 Validity Sensors, Inc. Finger position sensing methods and apparatus
US8131026B2 (en) 2004-04-16 2012-03-06 Validity Sensors, Inc. Method and apparatus for fingerprint image reconstruction
US8165355B2 (en) 2006-09-11 2012-04-24 Validity Sensors, Inc. Method and apparatus for fingerprint motion tracking using an in-line array for use in navigation applications
US8447077B2 (en) 2006-09-11 2013-05-21 Validity Sensors, Inc. Method and apparatus for fingerprint motion tracking using an in-line array
US8358815B2 (en) * 2004-04-16 2013-01-22 Validity Sensors, Inc. Method and apparatus for two-dimensional finger motion tracking and control
US8175345B2 (en) 2004-04-16 2012-05-08 Validity Sensors, Inc. Unitized ergonomic two-dimensional fingerprint motion tracking device and method
WO2005106774A2 (en) * 2004-04-23 2005-11-10 Validity Sensors, Inc. Methods and apparatus for acquiring a swiped fingerprint image
EP1617473A1 (en) * 2004-07-13 2006-01-18 Koninklijke Philips Electronics N.V. Electronic device comprising an ESD device
WO2006041780A1 (en) * 2004-10-04 2006-04-20 Validity Sensors, Inc. Fingerprint sensing assemblies comprising a substrate
US7831070B1 (en) 2005-02-18 2010-11-09 Authentec, Inc. Dynamic finger detection mechanism for a fingerprint sensor
US8231056B2 (en) 2005-04-08 2012-07-31 Authentec, Inc. System for and method of protecting an integrated circuit from over currents
US7460697B2 (en) * 2005-07-19 2008-12-02 Validity Sensors, Inc. Electronic fingerprint sensor with differential noise cancellation
WO2007017848A2 (en) 2005-08-11 2007-02-15 N-Trig Ltd. Apparatus for object information detection and methods of using same
FR2894049B1 (fr) * 2005-11-25 2008-01-04 Atmel Grenoble Soc Par Actions Dispositif de reactivation d'un appareil place en mode de veille
US7656392B2 (en) * 2006-03-24 2010-02-02 Synaptics Incorporated Touch sensor effective area enhancement
KR100792670B1 (ko) 2006-06-13 2008-01-09 주식회사 애트랩 반도체 장치 및 접촉센서 장치
JP4943807B2 (ja) * 2006-10-18 2012-05-30 日本電信電話株式会社 インピーダンス検出装置、インピーダンス検出方法、生体認識装置、および指紋認証装置
US7705613B2 (en) * 2007-01-03 2010-04-27 Abhay Misra Sensitivity capacitive sensor
US8107212B2 (en) 2007-04-30 2012-01-31 Validity Sensors, Inc. Apparatus and method for protecting fingerprint sensing circuitry from electrostatic discharge
US8290150B2 (en) 2007-05-11 2012-10-16 Validity Sensors, Inc. Method and system for electronically securing an electronic device using physically unclonable functions
US20110002461A1 (en) * 2007-05-11 2011-01-06 Validity Sensors, Inc. Method and System for Electronically Securing an Electronic Biometric Device Using Physically Unclonable Functions
US20080297174A1 (en) * 2007-05-31 2008-12-04 Sarangan Narasimhan Capacitive sensing devices
US8204281B2 (en) 2007-12-14 2012-06-19 Validity Sensors, Inc. System and method to remove artifacts from fingerprint sensor scans
US8276816B2 (en) 2007-12-14 2012-10-02 Validity Sensors, Inc. Smart card system with ergonomic fingerprint sensor and method of using
US20110178619A1 (en) * 2007-12-21 2011-07-21 Searete Llc, A Limited Liability Corporation Of The State Of Delaware Security-activated robotic tasks
US8005276B2 (en) 2008-04-04 2011-08-23 Validity Sensors, Inc. Apparatus and method for reducing parasitic capacitive coupling and noise in fingerprint sensing circuits
US8116540B2 (en) 2008-04-04 2012-02-14 Validity Sensors, Inc. Apparatus and method for reducing noise in fingerprint sensing circuits
DE112009001794T5 (de) 2008-07-22 2012-01-26 Validity Sensors, Inc. System, Vorrichtung und Verfahren zum Sichern einer Vorrichtungskomponente
NO20083766L (no) * 2008-09-01 2010-03-02 Idex Asa Overflatesensor
US8391568B2 (en) 2008-11-10 2013-03-05 Validity Sensors, Inc. System and method for improved scanning of fingerprint edges
US8227889B2 (en) * 2008-12-08 2012-07-24 United Microelectronics Corp. Semiconductor device
US8600122B2 (en) 2009-01-15 2013-12-03 Validity Sensors, Inc. Apparatus and method for culling substantially redundant data in fingerprint sensing circuits
US8278946B2 (en) 2009-01-15 2012-10-02 Validity Sensors, Inc. Apparatus and method for detecting finger activity on a fingerprint sensor
US20100176892A1 (en) * 2009-01-15 2010-07-15 Validity Sensors, Inc. Ultra Low Power Oscillator
US20100180136A1 (en) * 2009-01-15 2010-07-15 Validity Sensors, Inc. Ultra Low Power Wake-On-Event Mode For Biometric Systems
US8374407B2 (en) 2009-01-28 2013-02-12 Validity Sensors, Inc. Live finger detection
US20100208953A1 (en) * 2009-02-17 2010-08-19 Validity Sensors, Inc. Illuminated Fingerprint Sensor and Method
US9274553B2 (en) 2009-10-30 2016-03-01 Synaptics Incorporated Fingerprint sensor and integratable electronic display
US9336428B2 (en) 2009-10-30 2016-05-10 Synaptics Incorporated Integrated fingerprint sensor and display
US9400911B2 (en) 2009-10-30 2016-07-26 Synaptics Incorporated Fingerprint sensor and integratable electronic display
NO20093601A1 (no) * 2009-12-29 2011-06-30 Idex Asa Overflatesensor
US8791792B2 (en) 2010-01-15 2014-07-29 Idex Asa Electronic imager using an impedance sensor grid array mounted on or about a switch and method of making
US8421890B2 (en) 2010-01-15 2013-04-16 Picofield Technologies, Inc. Electronic imager using an impedance sensor grid array and method of making
US8866347B2 (en) 2010-01-15 2014-10-21 Idex Asa Biometric image sensing
US9666635B2 (en) 2010-02-19 2017-05-30 Synaptics Incorporated Fingerprint sensing circuit
US8716613B2 (en) 2010-03-02 2014-05-06 Synaptics Incoporated Apparatus and method for electrostatic discharge protection
US9001040B2 (en) 2010-06-02 2015-04-07 Synaptics Incorporated Integrated fingerprint sensor and navigation device
US8331096B2 (en) 2010-08-20 2012-12-11 Validity Sensors, Inc. Fingerprint acquisition expansion card apparatus
US8594393B2 (en) 2011-01-26 2013-11-26 Validity Sensors System for and method of image reconstruction with dual line scanner using line counts
US8538097B2 (en) 2011-01-26 2013-09-17 Validity Sensors, Inc. User input utilizing dual line scanner apparatus and method
GB2489100A (en) 2011-03-16 2012-09-19 Validity Sensors Inc Wafer-level packaging for a fingerprint sensor
US10043052B2 (en) 2011-10-27 2018-08-07 Synaptics Incorporated Electronic device packages and methods
JP5913906B2 (ja) * 2011-10-28 2016-04-27 日立オートモティブシステムズ株式会社 湿度検出装置
US9195877B2 (en) 2011-12-23 2015-11-24 Synaptics Incorporated Methods and devices for capacitive image sensing
US9785299B2 (en) 2012-01-03 2017-10-10 Synaptics Incorporated Structures and manufacturing methods for glass covered electronic devices
WO2013109698A1 (en) 2012-01-17 2013-07-25 Apple Inc. Fingerprint sensor having pixel sensing circuitry for coupling electrodes and pixel sensing traces and related method
US9251329B2 (en) 2012-03-27 2016-02-02 Synaptics Incorporated Button depress wakeup and wakeup strategy
US9137438B2 (en) 2012-03-27 2015-09-15 Synaptics Incorporated Biometric object sensor and method
US9268991B2 (en) 2012-03-27 2016-02-23 Synaptics Incorporated Method of and system for enrolling and matching biometric data
US9600709B2 (en) 2012-03-28 2017-03-21 Synaptics Incorporated Methods and systems for enrolling biometric data
US9152838B2 (en) 2012-03-29 2015-10-06 Synaptics Incorporated Fingerprint sensor packagings and methods
EP2958052B1 (en) 2012-04-10 2020-10-07 Idex Asa Biometric sensing
US9030440B2 (en) 2012-05-18 2015-05-12 Apple Inc. Capacitive sensor packaging
US9651513B2 (en) 2012-10-14 2017-05-16 Synaptics Incorporated Fingerprint sensor and button combinations and methods of making same
US9411474B2 (en) * 2012-11-15 2016-08-09 Nokia Technologies Oy Shield electrode overlying portions of capacitive sensor electrodes
US9665762B2 (en) 2013-01-11 2017-05-30 Synaptics Incorporated Tiered wakeup strategy
NO340311B1 (no) * 2013-02-22 2017-03-27 Idex Asa Integrert fingeravtrykksensor
NO20131423A1 (no) 2013-02-22 2014-08-25 Idex Asa Integrert fingeravtrykksensor
US9883822B2 (en) 2013-06-05 2018-02-06 Apple Inc. Biometric sensor chip having distributed sensor and control circuitry
NL2012891B1 (en) * 2013-06-05 2016-06-21 Apple Inc Biometric sensor chip having distributed sensor and control circuitry.
NO336318B1 (no) 2013-07-12 2015-08-03 Idex Asa Overflatesensor
US9984270B2 (en) 2013-08-05 2018-05-29 Apple Inc. Fingerprint sensor in an electronic device
US9460332B1 (en) 2013-09-09 2016-10-04 Apple Inc. Capacitive fingerprint sensor including an electrostatic lens
US10296773B2 (en) 2013-09-09 2019-05-21 Apple Inc. Capacitive sensing array having electrical isolation
US9697409B2 (en) 2013-09-10 2017-07-04 Apple Inc. Biometric sensor stack structure
US10095906B2 (en) 2014-02-21 2018-10-09 Idex Asa Sensor employing overlapping grid lines and conductive probes for extending a sensing surface from the grid lines
CN104102902B (zh) * 2014-07-04 2017-07-04 京东方科技集团股份有限公司 一种半导体指纹识别传感器及其制造方法
US9779280B2 (en) 2014-12-24 2017-10-03 Idex Asa Fingerprint sensor employing an integrated noise rejection structure
WO2016118683A1 (en) * 2015-01-23 2016-07-28 Corning Incorporated Coated substrate for use in sensors
USD776664S1 (en) * 2015-05-20 2017-01-17 Chaya Coleena Hendrick Smart card
KR102626033B1 (ko) 2015-06-23 2024-01-18 이덱스 바이오메트릭스 아사 양면 지문 센서
KR20170019581A (ko) 2015-08-12 2017-02-22 삼성전자주식회사 지문 감지 센서, 이를 포함하는 전자 장치 및 지문 감지 센서의 동작 방법
WO2017038196A1 (ja) * 2015-09-04 2017-03-09 シャープ株式会社 集積回路センサおよびセンサ基板
KR20170041010A (ko) * 2015-10-06 2017-04-14 삼성전기주식회사 지문센서용 기판, 지문센서 및 지문센서용 기판의 제조방법
CN105184287B (zh) * 2015-10-29 2019-10-01 京东方科技集团股份有限公司 一种电极结构、指纹识别模组及其制备方法、显示装置
US9898645B2 (en) 2015-11-17 2018-02-20 Taiwan Semiconductor Manufacturing Company, Ltd. Fingerprint sensor device and method
US9875388B2 (en) 2016-02-26 2018-01-23 Taiwan Semiconductor Manufacturing Company, Ltd. Fingerprint sensor device and method
JP7329448B2 (ja) 2017-04-04 2023-08-18 コーニング インコーポレイテッド 多層構造およびその製造方法
WO2019004906A1 (en) * 2017-06-28 2019-01-03 Fingerprint Cards Ab METHOD FOR MANUFACTURING DIGITAL FOOTPRINT SENSOR MODULE
US10713461B2 (en) 2017-09-19 2020-07-14 IDEX Biometrtics ASA Double sided sensor module suitable for integration into electronic devices
FR3111215B1 (fr) * 2020-06-04 2022-08-12 Linxens Holding Module de capteur biométrique pour carte à puce et procédé de fabrication d’un tel module
KR20220013230A (ko) 2020-07-24 2022-02-04 삼성전자주식회사 지문 센서 패키지 및 이를 포함하는 스마트 카드
US11320935B1 (en) 2020-11-25 2022-05-03 Idex Biometrics Asa Touch sensors with multi-state electrodes

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63310087A (ja) * 1987-06-12 1988-12-19 Enitsukusu:Kk 接触式指紋入力装置
US5399898A (en) * 1992-07-17 1995-03-21 Lsi Logic Corporation Multi-chip semiconductor arrangements using flip chip dies
JPH04104377A (ja) * 1990-08-24 1992-04-06 Fujitsu Denso Ltd 指紋照合装置
US5371404A (en) * 1993-02-04 1994-12-06 Motorola, Inc. Thermally conductive integrated circuit package with radio frequency shielding
JP2871381B2 (ja) * 1993-03-30 1999-03-17 本田技研工業株式会社 圧力センサー
JP3550237B2 (ja) * 1994-12-26 2004-08-04 株式会社東芝 個人認証装置
FR2739977B1 (fr) * 1995-10-17 1998-01-23 France Telecom Capteur monolithique d'empreintes digitales
US5963679A (en) * 1996-01-26 1999-10-05 Harris Corporation Electric field fingerprint sensor apparatus and related methods
US5956415A (en) * 1996-01-26 1999-09-21 Harris Corporation Enhanced security fingerprint sensor package and related methods
FR2749955B1 (fr) * 1996-06-14 1998-09-11 Thomson Csf Systeme de lecture d'empreintes digitales
US6020749A (en) * 1996-11-12 2000-02-01 Hewlett-Packard Company Method and apparatus for performing testing of double-sided ball grid array devices
US6259804B1 (en) * 1997-05-16 2001-07-10 Authentic, Inc. Fingerprint sensor with gain control features and associated methods
US5920640A (en) * 1997-05-16 1999-07-06 Harris Corporation Fingerprint sensor and token reader and associated methods
NO304766B1 (no) * 1997-06-16 1999-02-08 Sintef Fingeravtrykksensor
JP2959532B2 (ja) * 1997-06-30 1999-10-06 日本電気株式会社 静電容量検出方式の指紋画像入力装置
US6483931B2 (en) * 1997-09-11 2002-11-19 Stmicroelectronics, Inc. Electrostatic discharge protection of a capacitve type fingerprint sensing array
JP3102395B2 (ja) 1997-11-27 2000-10-23 日本電気株式会社 指紋検出装置
NO307065B1 (no) * 1998-02-26 2000-01-31 Idex As Fingeravtrykksensor
JP3400347B2 (ja) * 1998-05-18 2003-04-28 日本電信電話株式会社 表面形状認識用センサおよびその製造方法
US6026564A (en) * 1998-04-10 2000-02-22 Ang Technologies Inc. Method of making a high density multilayer wiring board
DE60032286T8 (de) * 1999-06-10 2007-09-27 Nippon Telegraph And Telephone Corp. Gerät zur Erkennung von Oberflächengestalten
JP2001141411A (ja) * 1999-11-12 2001-05-25 Sony Corp 指紋認識用半導体装置
JP2001208509A (ja) * 2000-01-24 2001-08-03 Sony Corp 表面形状認識用半導体装置およびその製造方法
NO315016B1 (no) * 2000-06-09 2003-06-23 Idex Asa Miniatyrisert sensor
NO315017B1 (no) * 2000-06-09 2003-06-23 Idex Asa Sensorbrikke, s¶rlig for måling av strukturer i en fingeroverflate
JP3971674B2 (ja) * 2002-07-10 2007-09-05 富士通株式会社 接触型センサ内蔵半導体装置及びその製造方法
JP3775601B2 (ja) * 2003-04-17 2006-05-17 セイコーエプソン株式会社 静電容量検出装置及びその駆動方法、指紋センサ並びにバイオメトリクス認証装置
JP3858864B2 (ja) * 2003-08-29 2006-12-20 セイコーエプソン株式会社 静電容量検出装置
KR100564915B1 (ko) * 2004-02-10 2006-03-30 한국과학기술원 정전용량방식 지문센서 및 이를 이용한 지문 센싱방법

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ATE384306T1 (de) 2008-02-15
EP1303828A2 (en) 2003-04-23
NO20003004D0 (no) 2000-06-09
US20030161512A1 (en) 2003-08-28
JP4708671B2 (ja) 2011-06-22
JP2003536085A (ja) 2003-12-02
US20080002867A1 (en) 2008-01-03
NO315017B1 (no) 2003-06-23
DE60132460T2 (de) 2009-01-15
PT1303828E (pt) 2008-03-25
US7251351B2 (en) 2007-07-31
WO2001099035A2 (en) 2001-12-27
EP1303828B1 (en) 2008-01-16
AU2001264429A1 (en) 2002-01-02
US7848550B2 (en) 2010-12-07
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CY1107257T1 (el) 2012-11-21
NO20003004L (no) 2001-12-10

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