DK0851041T3 - Indvendigt fortinnet kobberrør og fremgangsmåde til belægning af et kobberrør - Google Patents
Indvendigt fortinnet kobberrør og fremgangsmåde til belægning af et kobberrørInfo
- Publication number
- DK0851041T3 DK0851041T3 DK97122145T DK97122145T DK0851041T3 DK 0851041 T3 DK0851041 T3 DK 0851041T3 DK 97122145 T DK97122145 T DK 97122145T DK 97122145 T DK97122145 T DK 97122145T DK 0851041 T3 DK0851041 T3 DK 0851041T3
- Authority
- DK
- Denmark
- Prior art keywords
- copper pipe
- coating
- internally
- internally tinned
- tinned copper
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
- C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1614—Process or apparatus coating on selected surface areas plating on one side
- C23C18/1616—Process or apparatus coating on selected surface areas plating on one side interior or inner surface
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1675—Process conditions
- C23C18/1676—Heating of the solution
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1675—Process conditions
- C23C18/168—Control of temperature, e.g. temperature of bath, substrate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/54—Contact plating, i.e. electroless electrochemical plating
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16L—PIPES; JOINTS OR FITTINGS FOR PIPES; SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING; MEANS FOR THERMAL INSULATION IN GENERAL
- F16L58/00—Protection of pipes or pipe fittings against corrosion or incrustation
- F16L58/02—Protection of pipes or pipe fittings against corrosion or incrustation by means of internal or external coatings
- F16L58/04—Coatings characterised by the materials used
- F16L58/08—Coatings characterised by the materials used by metal
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Engineering & Computer Science (AREA)
- Electrochemistry (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
- Protection Of Pipes Against Damage, Friction, And Corrosion (AREA)
- Coating With Molten Metal (AREA)
- Laminated Bodies (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19653765A DE19653765A1 (de) | 1996-12-23 | 1996-12-23 | Innen verzinntes Kupferrohr und Verfahren zur Beschichtung eines Kupferrohrs |
Publications (1)
Publication Number | Publication Date |
---|---|
DK0851041T3 true DK0851041T3 (da) | 2002-07-22 |
Family
ID=7815843
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK97122145T DK0851041T3 (da) | 1996-12-23 | 1997-12-16 | Indvendigt fortinnet kobberrør og fremgangsmåde til belægning af et kobberrør |
Country Status (13)
Country | Link |
---|---|
US (1) | US6041828A (pt) |
EP (1) | EP0851041B1 (pt) |
JP (1) | JPH10306379A (pt) |
AR (1) | AR010095A1 (pt) |
AT (1) | ATE215621T1 (pt) |
AU (1) | AU723623B2 (pt) |
BR (1) | BR9705612A (pt) |
CA (1) | CA2225464C (pt) |
DE (2) | DE19653765A1 (pt) |
DK (1) | DK0851041T3 (pt) |
ES (1) | ES2175254T3 (pt) |
PT (1) | PT851041E (pt) |
SI (1) | SI0851041T1 (pt) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19915574A1 (de) * | 1999-03-30 | 2000-10-12 | Sms Demag Ag | Verfahren zur Herstellung des innen- und/oder außen verzinnten Hohlprofiles sowie innenverzinntes Kupferrohr |
DE10003582A1 (de) * | 2000-01-28 | 2001-08-02 | Km Europa Metal Ag | Verfahren zur Erzeugung einer Zinnschicht auf der inneren Oberfläche von Hohlbauteilen aus Kupferlegierungen |
FI20001467A (fi) * | 2000-06-20 | 2001-12-21 | Outokumpu Oy | Menetelmä sisäpuolelta pinnoitettujen kupari- tai kupariseosputkien valmistamiseksi |
DE10213185A1 (de) * | 2002-03-23 | 2003-10-02 | Km Europa Metal Ag | Verfahren zur Verringerung der Kupferlöslichkeit an der inneren Oberfläche eines Kupferrohrs |
FI120268B (fi) * | 2003-12-12 | 2009-08-31 | Cupori Group Oy | Menetelmä putken pinnoittamiseksi |
FR2867198B1 (fr) * | 2004-03-05 | 2007-09-14 | Trefimetaux | Procede d'etamage de pieces tubulaires en cuivre |
JP4880301B2 (ja) * | 2005-12-26 | 2012-02-22 | 石原薬品株式会社 | 無電解スズメッキの後処理方法 |
JP4998704B2 (ja) * | 2007-01-22 | 2012-08-15 | 上村工業株式会社 | 置換錫合金めっき皮膜の形成方法、置換錫合金めっき浴及びめっき性能の維持方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2282511A (en) * | 1940-03-20 | 1942-05-12 | American Brass Co | Coating cupreous surfaces with tin |
US3943616A (en) * | 1972-11-06 | 1976-03-16 | Vaponics, Inc. | Method of coupling, and fitting for, lined tubing |
NL184695C (nl) * | 1978-12-04 | 1989-10-02 | Philips Nv | Bad voor het stroomloos neerslaan van tin op substraten. |
US4234631A (en) * | 1979-07-20 | 1980-11-18 | Amp Incorporated | Method for immersion deposition of tin and tin-lead alloys |
NL8403033A (nl) * | 1984-10-05 | 1986-05-01 | Philips Nv | Werkwijze voor het autokatalytisch vertinnen van voorwerpen van koper of een koperlegering. |
DE3800918A1 (de) * | 1988-01-14 | 1989-07-27 | Siemens Ag | Bad zur stromlosen zinnabscheidung |
JP2787142B2 (ja) * | 1991-03-01 | 1998-08-13 | 上村工業 株式会社 | 無電解錫、鉛又はそれらの合金めっき方法 |
JP2525521B2 (ja) * | 1991-06-25 | 1996-08-21 | 日本リーロナール株式会社 | 無電解スズ―鉛合金めっき浴 |
US5296268A (en) * | 1991-09-03 | 1994-03-22 | Shipley Company Inc. | Pretreatment process of tin lead plating |
JP2804722B2 (ja) * | 1994-10-26 | 1998-09-30 | 株式会社神戸製鋼所 | 銅又は銅合金管内面への錫めっき方法 |
US5769129A (en) * | 1995-03-16 | 1998-06-23 | Kabushiki Kaisha Kobe Seiko Sho | Cold-and hot-water supply copper-alloy pipe with inner-surface protective film, method for manufacturing same, and hot-water supply heat exchanger |
DE69716222T2 (de) * | 1996-06-05 | 2004-09-16 | Sumitomo Light Metal Industries Ltd. | Herstellungsverfahren zum zinnplattieren einer kupferröhre von innen |
-
1996
- 1996-12-23 DE DE19653765A patent/DE19653765A1/de not_active Withdrawn
-
1997
- 1997-12-16 SI SI9730344T patent/SI0851041T1/xx unknown
- 1997-12-16 PT PT97122145T patent/PT851041E/pt unknown
- 1997-12-16 AT AT97122145T patent/ATE215621T1/de not_active IP Right Cessation
- 1997-12-16 EP EP97122145A patent/EP0851041B1/de not_active Expired - Lifetime
- 1997-12-16 DE DE59706853T patent/DE59706853D1/de not_active Expired - Lifetime
- 1997-12-16 DK DK97122145T patent/DK0851041T3/da active
- 1997-12-16 ES ES97122145T patent/ES2175254T3/es not_active Expired - Lifetime
- 1997-12-18 BR BR9705612A patent/BR9705612A/pt not_active IP Right Cessation
- 1997-12-19 JP JP9351781A patent/JPH10306379A/ja active Pending
- 1997-12-19 CA CA002225464A patent/CA2225464C/en not_active Expired - Fee Related
- 1997-12-22 AR ARP970106122A patent/AR010095A1/es unknown
- 1997-12-22 AU AU48548/97A patent/AU723623B2/en not_active Ceased
- 1997-12-23 US US08/996,757 patent/US6041828A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
PT851041E (pt) | 2002-09-30 |
CA2225464C (en) | 2001-07-31 |
BR9705612A (pt) | 1999-05-11 |
ES2175254T3 (es) | 2002-11-16 |
EP0851041A1 (de) | 1998-07-01 |
CA2225464A1 (en) | 1998-06-23 |
AU723623B2 (en) | 2000-08-31 |
DE19653765A1 (de) | 1998-06-25 |
ATE215621T1 (de) | 2002-04-15 |
MX9709937A (es) | 1998-07-31 |
US6041828A (en) | 2000-03-28 |
EP0851041B1 (de) | 2002-04-03 |
DE59706853D1 (de) | 2002-05-08 |
JPH10306379A (ja) | 1998-11-17 |
SI0851041T1 (en) | 2002-10-31 |
AU4854897A (en) | 1998-06-25 |
AR010095A1 (es) | 2000-05-17 |
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