DE9212760U1 - - Google Patents

Info

Publication number
DE9212760U1
DE9212760U1 DE9212760U DE9212760U DE9212760U1 DE 9212760 U1 DE9212760 U1 DE 9212760U1 DE 9212760 U DE9212760 U DE 9212760U DE 9212760 U DE9212760 U DE 9212760U DE 9212760 U1 DE9212760 U1 DE 9212760U1
Authority
DE
Germany
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE9212760U
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hoechst AG
Original Assignee
Hoechst AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hoechst AG filed Critical Hoechst AG
Priority to DE9212760U priority Critical patent/DE9212760U1/de
Publication of DE9212760U1 publication Critical patent/DE9212760U1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09827—Tapered, e.g. tapered hole, via or groove
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09836—Oblique hole, via or bump
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1509—Horizontally held PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
DE9212760U 1992-09-23 1992-09-23 Expired - Lifetime DE9212760U1 (it)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE9212760U DE9212760U1 (it) 1992-09-23 1992-09-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE9212760U DE9212760U1 (it) 1992-09-23 1992-09-23

Publications (1)

Publication Number Publication Date
DE9212760U1 true DE9212760U1 (it) 1992-11-05

Family

ID=6884020

Family Applications (1)

Application Number Title Priority Date Filing Date
DE9212760U Expired - Lifetime DE9212760U1 (it) 1992-09-23 1992-09-23

Country Status (1)

Country Link
DE (1) DE9212760U1 (it)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2503859A1 (en) * 2009-12-25 2012-09-26 Fujikura, Ltd. Through-wired substrate and manufacturing method therefor
DE102015103724A1 (de) * 2015-03-13 2016-09-15 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Komponententräger mit Verwerfungsstabilisierungsstruktur

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2503859A1 (en) * 2009-12-25 2012-09-26 Fujikura, Ltd. Through-wired substrate and manufacturing method therefor
EP2503859A4 (en) * 2009-12-25 2013-11-20 Fujikura Ltd THREADED THROUGH SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
EP2763514A1 (en) * 2009-12-25 2014-08-06 Fujikura Ltd. Interposer substrate and method of manufacturing the same
DE102015103724A1 (de) * 2015-03-13 2016-09-15 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Komponententräger mit Verwerfungsstabilisierungsstruktur
DE102015103724B4 (de) * 2015-03-13 2021-03-25 At & S Austria Technologie & Systemtechnik Aktiengesellschaft Komponententräger mit Verwerfungsstabilisierungsstruktur und Verfahren zur Herstellung dazu

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