DE8909244U1 - - Google Patents

Info

Publication number
DE8909244U1
DE8909244U1 DE19898909244 DE8909244U DE8909244U1 DE 8909244 U1 DE8909244 U1 DE 8909244U1 DE 19898909244 DE19898909244 DE 19898909244 DE 8909244 U DE8909244 U DE 8909244U DE 8909244 U1 DE8909244 U1 DE 8909244U1
Authority
DE
Germany
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE19898909244
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE19898909244 priority Critical patent/DE8909244U1/de
Publication of DE8909244U1 publication Critical patent/DE8909244U1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
DE19898909244 1989-07-31 1989-07-31 Expired DE8909244U1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19898909244 DE8909244U1 (de) 1989-07-31 1989-07-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19898909244 DE8909244U1 (de) 1989-07-31 1989-07-31

Publications (1)

Publication Number Publication Date
DE8909244U1 true DE8909244U1 (de) 1989-09-21

Family

ID=6841576

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19898909244 Expired DE8909244U1 (de) 1989-07-31 1989-07-31

Country Status (1)

Country Link
DE (1) DE8909244U1 (de)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202015102948U1 (de) 2015-06-08 2015-06-24 Abb Technology Ag Halbleiterbauelement
EP3007220A1 (de) 2014-10-10 2016-04-13 ABB Technology AG Leistungshalbleiterbauelement mit Schutz vor Explosion oder Bruch
WO2016184590A1 (en) 2015-05-19 2016-11-24 Abb Schweiz Ag Semiconductor device
WO2021018957A1 (en) 2019-07-31 2021-02-04 Abb Power Grids Switzerland Ag Power semiconductor device

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1251442B (de) * 1962-08-18
DE1033783B (de) * 1953-12-12 1958-07-10 Philips Nv Elektrodensystem mit mindestens einem halbleitenden Koerper, insbesondere Kristalldiode oder Transistor
GB1030520A (en) * 1962-11-08 1966-05-25 Siemens Ag A semi-conductor arrangement
DE1242297B (de) * 1958-09-16 1967-06-15 Philips Nv Halbleiteranordnung mit wenigstens einem pn-UEbergang und Verfahren zu ihrer Herstellung
US3943547A (en) * 1970-12-26 1976-03-09 Hitachi, Ltd. Semiconductor device
DE2652348A1 (de) * 1976-10-27 1978-05-03 Bbc Brown Boveri & Cie Anordnung fuer halbleiter-hochleistungsbauelemente
US4099201A (en) * 1977-04-11 1978-07-04 General Electric Company Semiconductor rectifier assembly having an insulating material therein that evolves gases when exposed to an arc
DE2831153A1 (de) * 1978-06-30 1980-01-10 Bbc Brown Boveri & Cie Gehaeuse fuer halbleiter-hochleistungsbauelemente
DE2936780A1 (de) * 1979-09-12 1981-03-26 eupec Europäische Gesellschaft für Leistungshalbleiter mbH + Co.KG, 59581 Warstein Halbleiterbauelement fuer leistungselektronische anwendungen
DE3503709A1 (de) * 1984-02-23 1985-08-29 Mitsubishi Denki K.K., Tokio/Tokyo Verfahren zur befestigung einer einsatzelektrodenplatte in eine druckgebondete halbleitereinrichtung

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1033783B (de) * 1953-12-12 1958-07-10 Philips Nv Elektrodensystem mit mindestens einem halbleitenden Koerper, insbesondere Kristalldiode oder Transistor
DE1242297B (de) * 1958-09-16 1967-06-15 Philips Nv Halbleiteranordnung mit wenigstens einem pn-UEbergang und Verfahren zu ihrer Herstellung
DE1251442B (de) * 1962-08-18
GB1030520A (en) * 1962-11-08 1966-05-25 Siemens Ag A semi-conductor arrangement
US3943547A (en) * 1970-12-26 1976-03-09 Hitachi, Ltd. Semiconductor device
DE2652348A1 (de) * 1976-10-27 1978-05-03 Bbc Brown Boveri & Cie Anordnung fuer halbleiter-hochleistungsbauelemente
US4099201A (en) * 1977-04-11 1978-07-04 General Electric Company Semiconductor rectifier assembly having an insulating material therein that evolves gases when exposed to an arc
DE2831153A1 (de) * 1978-06-30 1980-01-10 Bbc Brown Boveri & Cie Gehaeuse fuer halbleiter-hochleistungsbauelemente
DE2936780A1 (de) * 1979-09-12 1981-03-26 eupec Europäische Gesellschaft für Leistungshalbleiter mbH + Co.KG, 59581 Warstein Halbleiterbauelement fuer leistungselektronische anwendungen
DE2936780C2 (de) * 1979-09-12 1985-02-07 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Halbleiterbauelement
DE3503709A1 (de) * 1984-02-23 1985-08-29 Mitsubishi Denki K.K., Tokio/Tokyo Verfahren zur befestigung einer einsatzelektrodenplatte in eine druckgebondete halbleitereinrichtung

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3007220A1 (de) 2014-10-10 2016-04-13 ABB Technology AG Leistungshalbleiterbauelement mit Schutz vor Explosion oder Bruch
WO2016184590A1 (en) 2015-05-19 2016-11-24 Abb Schweiz Ag Semiconductor device
US10192800B2 (en) 2015-05-19 2019-01-29 Abb Schweiz Ag Semiconductor device
DE202015102948U1 (de) 2015-06-08 2015-06-24 Abb Technology Ag Halbleiterbauelement
WO2021018957A1 (en) 2019-07-31 2021-02-04 Abb Power Grids Switzerland Ag Power semiconductor device

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