DE69940159D1 - Verfahren und vorrichtung zur herstellung von schichten aus polysilizium oder amorphem silizium - Google Patents

Verfahren und vorrichtung zur herstellung von schichten aus polysilizium oder amorphem silizium

Info

Publication number
DE69940159D1
DE69940159D1 DE69940159T DE69940159T DE69940159D1 DE 69940159 D1 DE69940159 D1 DE 69940159D1 DE 69940159 T DE69940159 T DE 69940159T DE 69940159 T DE69940159 T DE 69940159T DE 69940159 D1 DE69940159 D1 DE 69940159D1
Authority
DE
Germany
Prior art keywords
polysilicty
producing layers
amorphic silicon
amorphic
silicon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69940159T
Other languages
English (en)
Inventor
Shulin Wang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Application granted granted Critical
Publication of DE69940159D1 publication Critical patent/DE69940159D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45502—Flow conditions in reaction chamber
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/24—Deposition of silicon only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02367—Substrates
    • H01L21/0237—Materials
    • H01L21/02373—Group 14 semiconducting materials
    • H01L21/02381—Silicon, silicon germanium, germanium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02367—Substrates
    • H01L21/0237—Materials
    • H01L21/02387—Group 13/15 materials
    • H01L21/02395—Arsenides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/02521—Materials
    • H01L21/02524—Group 14 semiconducting materials
    • H01L21/02532—Silicon, silicon germanium, germanium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/0257—Doping during depositing
    • H01L21/02573—Conductivity type
    • H01L21/02579—P-type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02656—Special treatments
    • H01L21/02658—Pretreatments
    • H01L21/02661—In-situ cleaning

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)
DE69940159T 1998-09-29 1999-09-28 Verfahren und vorrichtung zur herstellung von schichten aus polysilizium oder amorphem silizium Expired - Lifetime DE69940159D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/163,594 US6410090B1 (en) 1998-09-29 1998-09-29 Method and apparatus for forming insitu boron doped polycrystalline and amorphous silicon films
PCT/US1999/022627 WO2000018982A1 (en) 1998-09-29 1999-09-28 Method and apparatus for forming polycrystalline and amorphous silicon films

Publications (1)

Publication Number Publication Date
DE69940159D1 true DE69940159D1 (de) 2009-02-05

Family

ID=22590709

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69940159T Expired - Lifetime DE69940159D1 (de) 1998-09-29 1999-09-28 Verfahren und vorrichtung zur herstellung von schichten aus polysilizium oder amorphem silizium

Country Status (6)

Country Link
US (2) US6410090B1 (de)
EP (1) EP1117854B1 (de)
JP (1) JP2002525886A (de)
DE (1) DE69940159D1 (de)
TW (1) TW426880B (de)
WO (1) WO2000018982A1 (de)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001298020A (ja) * 2000-04-18 2001-10-26 Nhk Spring Co Ltd セラミックヒータ及びそれを用いた成膜処理装置
US6737361B2 (en) * 2001-04-06 2004-05-18 Wafermaster, Inc Method for H2 Recycling in semiconductor processing system
US6559039B2 (en) * 2001-05-15 2003-05-06 Applied Materials, Inc. Doped silicon deposition process in resistively heated single wafer chamber
US20030011018A1 (en) * 2001-07-13 2003-01-16 Hurley Kelly T. Flash floating gate using epitaxial overgrowth
US7148570B2 (en) * 2001-08-13 2006-12-12 Sandisk 3D Llc Low resistivity titanium silicide on heavily doped semiconductor
US6830996B2 (en) * 2003-03-24 2004-12-14 Taiwan Semiconductor Manufacturing Company, Ltd. Device performance improvement by heavily doped pre-gate and post polysilicon gate clean
US6815077B1 (en) * 2003-05-20 2004-11-09 Matrix Semiconductor, Inc. Low temperature, low-resistivity heavily doped p-type polysilicon deposition
JP3929939B2 (ja) * 2003-06-25 2007-06-13 株式会社東芝 処理装置、製造装置、処理方法及び電子装置の製造方法
US6933157B2 (en) * 2003-11-13 2005-08-23 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor wafer manufacturing methods employing cleaning delay period
JP4143584B2 (ja) * 2004-09-01 2008-09-03 株式会社東芝 半導体装置の製造方法
WO2007026762A1 (ja) * 2005-08-31 2007-03-08 Tokyo Electron Limited クリーニング方法
DE102007010563A1 (de) * 2007-02-22 2008-08-28 IHP GmbH - Innovations for High Performance Microelectronics/Institut für innovative Mikroelektronik Selektives Wachstum von polykristallinem siliziumhaltigen Halbleitermaterial auf siliziumhaltiger Halbleiteroberfläche
US9499905B2 (en) * 2011-07-22 2016-11-22 Applied Materials, Inc. Methods and apparatus for the deposition of materials on a substrate
CN104253031B (zh) * 2013-06-28 2017-07-28 上海华虹宏力半导体制造有限公司 进行再沉积制程时改善掺杂多晶硅片电阻阻值差异的方法
KR101489306B1 (ko) * 2013-10-21 2015-02-11 주식회사 유진테크 어모퍼스 실리콘막의 증착 방법 및 증착 장치
KR101507381B1 (ko) 2014-02-26 2015-03-30 주식회사 유진테크 폴리실리콘 막의 성막 방법
US20160282886A1 (en) * 2015-03-27 2016-09-29 Applied Materials, Inc. Upper dome temperature closed loop control
KR101706747B1 (ko) * 2015-05-08 2017-02-15 주식회사 유진테크 비정질 박막의 형성방법
KR102253546B1 (ko) * 2016-09-19 2021-05-18 어플라이드 머티어리얼스, 인코포레이티드 도핑된 게르마늄 형성 방법
CN106876401B (zh) * 2017-03-07 2018-10-30 长江存储科技有限责任公司 存储器件的形成方法
US10593543B2 (en) 2017-06-05 2020-03-17 Applied Materials, Inc. Method of depositing doped amorphous silicon films with enhanced defect control, reduced substrate sensitivity to in-film defects and bubble-free film growth
US11009455B2 (en) * 2018-07-31 2021-05-18 Applied Materials, Inc. Precursor delivery system and methods related thereto
US11145509B2 (en) 2019-05-24 2021-10-12 Applied Materials, Inc. Method for forming and patterning a layer and/or substrate
CN114830294A (zh) * 2019-11-01 2022-07-29 应用材料公司 抗结晶的基于非晶硅的膜
JP2023500375A (ja) 2019-11-08 2023-01-05 アプライド マテリアルズ インコーポレイテッド 材料の表面粗さを減少させる方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4696702A (en) * 1985-01-24 1987-09-29 Chronar Corp. Method of depositing wide bandgap amorphous semiconductor materials
JPS62229826A (ja) * 1986-03-29 1987-10-08 Canon Inc 堆積膜形成法
JP3149468B2 (ja) * 1991-09-03 2001-03-26 株式会社日立製作所 Ｃｖｄ装置
JP3201492B2 (ja) * 1992-03-27 2001-08-20 キヤノン株式会社 非晶質シリコン膜の製造方法、非晶質窒化シリコン膜の製造方法、微結晶シリコン膜の製造方法、及び非単結晶半導体装置
JPH07307300A (ja) * 1994-03-15 1995-11-21 Toshiba Corp 凹部内に膜を形成する方法
JPH08222519A (ja) * 1994-10-11 1996-08-30 Canon Inc 高周波プラズマｃｖｄ法による堆積膜形成方法
JPH08181079A (ja) * 1994-12-26 1996-07-12 Mitsui Toatsu Chem Inc 非晶質半導体薄膜形成方法
JPH08306632A (ja) * 1995-04-27 1996-11-22 Shin Etsu Handotai Co Ltd 気相エピタキシャル成長装置
US5863598A (en) * 1996-04-12 1999-01-26 Applied Materials, Inc. Method of forming doped silicon in high aspect ratio openings
DE69710655T2 (de) 1996-08-07 2002-10-31 Concept Systems Design Inc Gaseinleitsystem für CVD Reaktoren

Also Published As

Publication number Publication date
EP1117854A4 (de) 1999-11-15
EP1117854B1 (de) 2008-12-24
US20020162505A1 (en) 2002-11-07
EP1117854A1 (de) 2001-07-25
US6410090B1 (en) 2002-06-25
WO2000018982A1 (en) 2000-04-06
TW426880B (en) 2001-03-21
US6488776B2 (en) 2002-12-03
JP2002525886A (ja) 2002-08-13

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