DE69938766D1 - Verfahren zur Rückgewinnung von Substratscheiben - Google Patents

Verfahren zur Rückgewinnung von Substratscheiben

Info

Publication number
DE69938766D1
DE69938766D1 DE69938766T DE69938766T DE69938766D1 DE 69938766 D1 DE69938766 D1 DE 69938766D1 DE 69938766 T DE69938766 T DE 69938766T DE 69938766 T DE69938766 T DE 69938766T DE 69938766 D1 DE69938766 D1 DE 69938766D1
Authority
DE
Germany
Prior art keywords
recovery
substrate disks
disks
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69938766T
Other languages
English (en)
Inventor
Yoshihiro Hara
Tetsuo Suzuki
Satoru Takada
Hidetoshi Inoue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kobe Steel Ltd
Kobe Precision Inc
Original Assignee
Kobe Steel Ltd
Kobe Precision Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kobe Steel Ltd, Kobe Precision Inc filed Critical Kobe Steel Ltd
Application granted granted Critical
Publication of DE69938766D1 publication Critical patent/DE69938766D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02032—Preparing bulk and homogeneous wafers by reclaiming or re-processing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Weting (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
DE69938766T 1998-08-28 1999-08-27 Verfahren zur Rückgewinnung von Substratscheiben Expired - Lifetime DE69938766D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24386898 1998-08-28

Publications (1)

Publication Number Publication Date
DE69938766D1 true DE69938766D1 (de) 2008-07-03

Family

ID=17110182

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69938766T Expired - Lifetime DE69938766D1 (de) 1998-08-28 1999-08-27 Verfahren zur Rückgewinnung von Substratscheiben

Country Status (5)

Country Link
US (1) US6451696B1 (de)
EP (1) EP0986097B1 (de)
KR (1) KR20000017512A (de)
DE (1) DE69938766D1 (de)
TW (1) TW416104B (de)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6632292B1 (en) * 1998-03-13 2003-10-14 Semitool, Inc. Selective treatment of microelectronic workpiece surfaces
US20010039101A1 (en) * 2000-04-13 2001-11-08 Wacker Siltronic Gesellschaft Fur Halbleitermaterialien Ag Method for converting a reclaim wafer into a semiconductor wafer
WO2001082354A1 (fr) * 2000-04-24 2001-11-01 Sumitomo Mitsubishi Silicon Corporation Procédé de fabrication d'une plaquette de semi-conducteur
US20020023715A1 (en) * 2000-05-26 2002-02-28 Norio Kimura Substrate polishing apparatus and substrate polishing mehod
US6406923B1 (en) 2000-07-31 2002-06-18 Kobe Precision Inc. Process for reclaiming wafer substrates
GB2368971B (en) * 2000-11-11 2005-01-05 Pure Wafer Ltd Process for Reclaimimg Wafer Substrates
DE10137113A1 (de) * 2001-07-30 2003-02-27 Infineon Technologies Ag Verfahren zum Regenerieren von Halbleiterscheiben
US6554909B1 (en) * 2001-11-08 2003-04-29 Saint-Gobain Ceramics & Plastics, Inc. Process for cleaning components using cleaning media
JP2003243403A (ja) 2002-02-13 2003-08-29 Mitsubishi Electric Corp 半導体ウェハの再生方法
US6884634B2 (en) * 2002-09-27 2005-04-26 Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) Specifying method for Cu contamination processes and detecting method for Cu contamination during reclamation of silicon wafers, and reclamation method of silicon wafers
US6761625B1 (en) 2003-05-20 2004-07-13 Intel Corporation Reclaiming virgin test wafers
DE10326273B4 (de) * 2003-06-11 2008-06-12 Advanced Micro Devices, Inc., Sunnyvale Verfahren zur Reduzierung der Scheibenkontaminierung durch Entfernen von Metallisierungsunterlagenschichten am Scheibenrand
US7699997B2 (en) 2003-10-03 2010-04-20 Kobe Steel, Ltd. Method of reclaiming silicon wafers
JP2005175106A (ja) * 2003-12-10 2005-06-30 Sumitomo Mitsubishi Silicon Corp シリコンウェーハの加工方法
JP4954462B2 (ja) * 2004-10-19 2012-06-13 株式会社フジミインコーポレーテッド 窒化シリコン膜選択的研磨用組成物およびそれを用いる研磨方法
CN100483641C (zh) * 2004-12-20 2009-04-29 斯泰拉化工公司 微细加工处理剂以及使用其的微细加工处理方法
KR100670919B1 (ko) * 2005-01-12 2007-01-19 삼성전자주식회사 저유전율막 제거 방법 및 이를 이용한 웨이퍼 재생 방법
US7452481B2 (en) * 2005-05-16 2008-11-18 Kabushiki Kaisha Kobe Seiko Sho Polishing slurry and method of reclaiming wafers
DE102005060211B4 (de) * 2005-12-14 2007-09-13 Heraeus Quarzglas Gmbh & Co. Kg Verfahren zur Bestimmung der Oberflächenbelegung eines Quarzglasbauteils
CN101370898B (zh) * 2006-02-14 2012-09-12 卡伯特微电子公司 用于氧化铟锡表面的化学机械抛光的组合物及方法
US7666689B2 (en) * 2006-12-12 2010-02-23 International Business Machines Corporation Method to remove circuit patterns from a wafer
US20100022070A1 (en) * 2008-07-22 2010-01-28 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing soi substrate
KR101110135B1 (ko) * 2009-07-31 2012-01-31 주식회사 케이피엠테크 고전도 하이드로겔층이 구비된 전기마스크 장치
JP5805636B2 (ja) * 2010-06-24 2015-11-04 Hoya株式会社 磁気記録媒体
US9120200B2 (en) 2010-12-28 2015-09-01 Saint-Gobain Ceramics & Plastics, Inc. Polishing slurry including zirconia particles and a method of using the polishing slurry
SG188775A1 (en) * 2011-09-30 2013-04-30 Hoya Corp Manufacturing method of glass substrate for magnetic disk, magnetic disk, and magnetic data recording/reproducing device
JP6205619B2 (ja) * 2013-11-07 2017-10-04 株式会社岡本工作機械製作所 再生半導体ウエハの製造方法
KR20160027325A (ko) * 2014-08-28 2016-03-10 전자부품연구원 태양전지 웨이퍼 재자원화를 위한 화학적-기계적 식각 방법
KR20160118546A (ko) 2015-04-02 2016-10-12 주식회사 인프라웨어 전자문서의 보안 방법
CN105185741B (zh) * 2015-07-31 2018-08-28 深圳市万中和科技有限公司 一种coms像素电路基板回收工艺
KR102215839B1 (ko) * 2016-01-22 2021-02-16 한국전자기술연구원 태양전지 웨이퍼 재자원화 방법
US10373818B1 (en) * 2018-01-31 2019-08-06 Taiwan Semiconductor Manufacturing Co., Ltd. Method of wafer recycling
CN112967930B (zh) * 2021-02-07 2023-05-12 西安微电子技术研究所 一种SiC晶圆的金属化层剥离方法
CN113980580B (zh) * 2021-12-24 2022-04-08 绍兴拓邦新能源股份有限公司 一种单晶硅片的碱刻蚀抛光方法
CN116252188B (zh) * 2023-05-15 2023-08-11 苏州焜原光电有限公司 一种锑化镓外延片去除外延层的方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3715842A (en) * 1970-07-02 1973-02-13 Tizon Chem Corp Silica polishing compositions having a reduced tendency to scratch silicon and germanium surfaces
US3923567A (en) * 1974-08-09 1975-12-02 Silicon Materials Inc Method of reclaiming a semiconductor wafer
JPS5655052A (en) * 1979-10-11 1981-05-15 Nippon Telegr & Teleph Corp <Ntt> Mechanical and chemical polishing
US5084071A (en) * 1989-03-07 1992-01-28 International Business Machines Corporation Method of chemical-mechanical polishing an electronic component substrate and polishing slurry therefor
JP2839801B2 (ja) * 1992-09-18 1998-12-16 三菱マテリアル株式会社 ウェーハの製造方法
US5391258A (en) * 1993-05-26 1995-02-21 Rodel, Inc. Compositions and methods for polishing
US5575885A (en) * 1993-12-14 1996-11-19 Kabushiki Kaisha Toshiba Copper-based metal polishing solution and method for manufacturing semiconductor device
US5622875A (en) 1994-05-06 1997-04-22 Kobe Precision, Inc. Method for reclaiming substrate from semiconductor wafers
JP3311203B2 (ja) * 1995-06-13 2002-08-05 株式会社東芝 半導体装置の製造方法及び半導体製造装置、半導体ウェーハの化学的機械的ポリッシング方法
US5855735A (en) * 1995-10-03 1999-01-05 Kobe Precision, Inc. Process for recovering substrates

Also Published As

Publication number Publication date
EP0986097B1 (de) 2008-05-21
EP0986097A3 (de) 2000-05-10
EP0986097A2 (de) 2000-03-15
KR20000017512A (ko) 2000-03-25
US6451696B1 (en) 2002-09-17
TW416104B (en) 2000-12-21

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Legal Events

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8364 No opposition during term of opposition