DE69934408T2 - Scheibenträger und verfahren zur beförderung von scheiben mit minimalem kontakt - Google Patents

Scheibenträger und verfahren zur beförderung von scheiben mit minimalem kontakt Download PDF

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Publication number
DE69934408T2
DE69934408T2 DE69934408T DE69934408T DE69934408T2 DE 69934408 T2 DE69934408 T2 DE 69934408T2 DE 69934408 T DE69934408 T DE 69934408T DE 69934408 T DE69934408 T DE 69934408T DE 69934408 T2 DE69934408 T2 DE 69934408T2
Authority
DE
Germany
Prior art keywords
wafer
carrier
handling device
wafer handling
support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69934408T
Other languages
German (de)
English (en)
Other versions
DE69934408D1 (de
Inventor
R. Paul Gilbert CARR
T. Paul Phoenix JACOBSON
F. James Fountain Hills KUSBEL
S. James Gilbert ROUNDY
K. Ravinder Gilbert AGGARWAL
Ivo Bilthoven 3723 HD RAAIJMAKERS
Rod Tempe LENZ
Nilesh Peoria RAJBHARTI
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASM America Inc
Original Assignee
ASM America Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/113,441 external-priority patent/US6158951A/en
Application filed by ASM America Inc filed Critical ASM America Inc
Application granted granted Critical
Publication of DE69934408D1 publication Critical patent/DE69934408D1/de
Publication of DE69934408T2 publication Critical patent/DE69934408T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7611—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/18—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] characterised by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7606—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7608—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7621—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting two or more semiconductor substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE69934408T 1998-07-10 1999-07-08 Scheibenträger und verfahren zur beförderung von scheiben mit minimalem kontakt Expired - Fee Related DE69934408T2 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US256743 1981-04-23
US113441 1993-08-27
US09/113,441 US6158951A (en) 1998-07-10 1998-07-10 Wafer carrier and method for handling of wafers with minimal contact
US09/256,743 US6318957B1 (en) 1998-07-10 1999-02-24 Method for handling of wafers with minimal contact
PCT/US1999/015593 WO2000003467A2 (en) 1998-07-10 1999-07-08 Wafer carrier and method for handling of wafers with minimal contact

Publications (2)

Publication Number Publication Date
DE69934408D1 DE69934408D1 (de) 2007-01-25
DE69934408T2 true DE69934408T2 (de) 2007-10-31

Family

ID=26811068

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69934408T Expired - Fee Related DE69934408T2 (de) 1998-07-10 1999-07-08 Scheibenträger und verfahren zur beförderung von scheiben mit minimalem kontakt

Country Status (6)

Country Link
US (1) US6318957B1 (https=)
EP (1) EP1098830B1 (https=)
JP (1) JP2002520860A (https=)
KR (1) KR20010071819A (https=)
DE (1) DE69934408T2 (https=)
WO (1) WO2000003467A2 (https=)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6162299A (en) * 1998-07-10 2000-12-19 Asm America, Inc. Multi-position load lock chamber
US7380272B2 (en) 2000-05-17 2008-05-27 Deep Nines Incorporated System and method for detecting and eliminating IP spoofing in a data transmission network
DE10052724B4 (de) * 2000-10-24 2012-08-02 Pac Tech-Packaging Technologies Gmbh Behandlungseinrichtung für Wafer
KR100376963B1 (ko) * 2001-03-15 2003-03-26 주성엔지니어링(주) 배치방식 웨이퍼 이송장치
US7048316B1 (en) * 2002-07-12 2006-05-23 Novellus Systems, Inc. Compound angled pad end-effector
TWI220786B (en) * 2002-09-11 2004-09-01 Au Optronics Corp Supporting structure
JP2005209954A (ja) 2004-01-23 2005-08-04 Kawasaki Heavy Ind Ltd 基板保持装置
US7396412B2 (en) 2004-12-22 2008-07-08 Sokudo Co., Ltd. Coat/develop module with shared dispense
US7798764B2 (en) 2005-12-22 2010-09-21 Applied Materials, Inc. Substrate processing sequence in a cartesian robot cluster tool
US20060236941A1 (en) * 2005-04-20 2006-10-26 Applied Materials, Inc. Passive wafer support for particle free wafer acceleration
TWI476855B (zh) * 2006-05-03 2015-03-11 吉恩股份有限公司 基板傳輸設備、和使用該設備的高速基板處理系統
JP5743437B2 (ja) * 2009-07-09 2015-07-01 キヤノン株式会社 露光装置、露光方法、搬送方法及びデバイスの製造方法
DE202012013639U1 (de) 2011-12-01 2018-12-06 solar-semi GmbH Vorrichtung zum Bearbeiten eines Substrats
CN103199050B (zh) * 2012-01-05 2015-05-13 沈阳新松机器人自动化股份有限公司 晶圆预对准装置
DE102012111167A1 (de) 2012-11-20 2014-05-22 Aixtron Se Vorrichtung zum Ausrichten eines Wafers auf einem Waferträger
US20140361800A1 (en) * 2013-06-05 2014-12-11 Qualcomm Incorporated Method and apparatus for high volume system level testing of logic devices with pop memory
DE102014106728A1 (de) 2014-05-13 2015-11-19 Aixtron Se Vorrichtung zum Ausrichten eines Wafers auf einem Waferträger
TWI615917B (zh) * 2015-04-27 2018-02-21 Ｓｕｍｃｏ股份有限公司 承托器及磊晶生長裝置
US10829866B2 (en) 2017-04-03 2020-11-10 Infineon Technologies Americas Corp. Wafer carrier and method
US10522381B2 (en) 2017-04-07 2019-12-31 Applied Materials, Inc. Aligner apparatus and methods
US10456920B2 (en) 2017-08-24 2019-10-29 Samsung Electronics Co., Ltd. Proximity robot blade detection and auto retraction
US10109517B1 (en) * 2018-01-10 2018-10-23 Lam Research Corporation Rotational indexer with additional rotational axes
TWI735115B (zh) * 2019-12-24 2021-08-01 力成科技股份有限公司 晶圓儲存裝置及晶圓承載盤
CN119446991B (zh) * 2024-10-08 2025-07-18 晶通(高邮)集成电路有限公司 一种晶圆搬运装置

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4306731A (en) 1979-12-21 1981-12-22 Varian Associates, Inc. Wafer support assembly
US4473455A (en) 1981-12-21 1984-09-25 At&T Bell Laboratories Wafer holding apparatus and method
US4779877A (en) 1986-04-22 1988-10-25 Varian Associates, Inc. Wafer support assembly
DE3919611A1 (de) 1989-06-15 1990-12-20 Wacker Chemitronic Haltevorrichtung zur aufnahme von scheibenfoermigen gegenstaenden, insbesondere halbleiterscheiben, und verfahren zu deren behandlung
US5046909A (en) 1989-06-29 1991-09-10 Applied Materials, Inc. Method and apparatus for handling semiconductor wafers
DE4024973C2 (de) * 1990-08-07 1994-11-03 Ibm Anordnung zum Lagern, Transportieren und Einschleusen von Substraten
US5668056A (en) * 1990-12-17 1997-09-16 United Microelectronics Corporation Single semiconductor wafer transfer method and manufacturing system
US5275521A (en) * 1991-07-03 1994-01-04 Tokyo Electron Sagami Limited Wafer transfer device
US5256204A (en) * 1991-12-13 1993-10-26 United Microelectronics Corporation Single semiconductor water transfer method and manufacturing system
JP3401803B2 (ja) * 1992-07-29 2003-04-28 ソニー株式会社 ウェーハ移載方法、ウェーハ保持用キャリアステージ、ウェーハ移載装置、及び半導体
ATE129361T1 (de) * 1992-08-04 1995-11-15 Ibm Fertigungsstrasse architektur mit vollautomatisierten und rechnergesteuerten fördereinrichtungen geeignet für abdichtbaren tragbaren unter druck stehenden behältern.
ES2079829T3 (es) * 1992-08-04 1996-01-16 Ibm Aparato de enlace a presion para transferir una rebanada semiconductora entre un recipiente transportable estanco a presion y un equipo de tratamiento.
EP0634787B1 (en) * 1993-07-15 1997-05-02 Applied Materials, Inc. Subsrate tray and ceramic blade for semiconductor processing apparatus
EP0634784A1 (en) 1993-07-16 1995-01-18 Applied Materials, Inc. Variable speed wafer exchange robot
RU2075135C1 (ru) * 1995-01-13 1997-03-10 Акционерное общество Научно-производственная фирма "А3" Установка для плазмоструйной обработки пластин
US5679404A (en) * 1995-06-07 1997-10-21 Saint-Gobain/Norton Industrial Ceramics Corporation Method for depositing a substance with temperature control
JP3552178B2 (ja) * 1995-09-27 2004-08-11 大日本スクリーン製造株式会社 基板収納カセット、インターフェイス機構および基板処理装置
US5669644A (en) * 1995-11-13 1997-09-23 Kokusai Electric Co., Ltd. Wafer transfer plate
DE19630932A1 (de) * 1996-07-31 1998-02-05 Wacker Siltronic Halbleitermat Träger für eine Halbleiterscheibe und Verwendung des Trägers
JPH10107114A (ja) 1996-09-27 1998-04-24 Kokusai Electric Co Ltd 基板搬送装置
JP3673958B2 (ja) * 1996-11-09 2005-07-20 コマツ電子金属株式会社 半導体ウェーハ外観検査用トレー
US6068441A (en) * 1997-11-21 2000-05-30 Asm America, Inc. Substrate transfer system for semiconductor processing equipment
WO1999036336A1 (en) * 1998-01-16 1999-07-22 Pri Automation, Inc. Semiconductor wafer cassette positioning and detection mechanism
US6158951A (en) * 1998-07-10 2000-12-12 Asm America, Inc. Wafer carrier and method for handling of wafers with minimal contact
US6162299A (en) * 1998-07-10 2000-12-19 Asm America, Inc. Multi-position load lock chamber

Also Published As

Publication number Publication date
WO2000003467A3 (en) 2000-02-24
JP2002520860A (ja) 2002-07-09
KR20010071819A (ko) 2001-07-31
EP1098830A2 (en) 2001-05-16
WO2000003467A2 (en) 2000-01-20
DE69934408D1 (de) 2007-01-25
US6318957B1 (en) 2001-11-20
EP1098830B1 (en) 2006-12-13

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Legal Events

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8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee