DE69927921T2 - Temperatursonde und Messmethode für Niederdruckprozess - Google Patents

Temperatursonde und Messmethode für Niederdruckprozess Download PDF

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Publication number
DE69927921T2
DE69927921T2 DE69927921T DE69927921T DE69927921T2 DE 69927921 T2 DE69927921 T2 DE 69927921T2 DE 69927921 T DE69927921 T DE 69927921T DE 69927921 T DE69927921 T DE 69927921T DE 69927921 T2 DE69927921 T2 DE 69927921T2
Authority
DE
Germany
Prior art keywords
probe head
probe
wafer
holder
fluid transport
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69927921T
Other languages
German (de)
English (en)
Other versions
DE69927921D1 (de
Inventor
Joel Monrovia Penelon
Andre Gil Laurel Cardoso
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Axcelis Technologies Inc
Original Assignee
Axcelis Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Axcelis Technologies Inc filed Critical Axcelis Technologies Inc
Application granted granted Critical
Publication of DE69927921D1 publication Critical patent/DE69927921D1/de
Publication of DE69927921T2 publication Critical patent/DE69927921T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
    • G01K1/143—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations for measuring surface temperatures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/16—Special arrangements for conducting heat from the object to the sensitive element

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Drying Of Semiconductors (AREA)
DE69927921T 1998-12-17 1999-12-13 Temperatursonde und Messmethode für Niederdruckprozess Expired - Fee Related DE69927921T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US213925 1998-12-17
US09/213,925 US6110288A (en) 1998-12-17 1998-12-17 Temperature probe and measurement method for low pressure process

Publications (2)

Publication Number Publication Date
DE69927921D1 DE69927921D1 (de) 2005-12-01
DE69927921T2 true DE69927921T2 (de) 2006-07-27

Family

ID=22797057

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69927921T Expired - Fee Related DE69927921T2 (de) 1998-12-17 1999-12-13 Temperatursonde und Messmethode für Niederdruckprozess

Country Status (4)

Country Link
US (1) US6110288A (cg-RX-API-DMAC7.html)
EP (1) EP1014058B1 (cg-RX-API-DMAC7.html)
JP (1) JP4671142B2 (cg-RX-API-DMAC7.html)
DE (1) DE69927921T2 (cg-RX-API-DMAC7.html)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6594780B1 (en) * 1999-10-19 2003-07-15 Inasoft, Inc. Operating system and data protection
US7080940B2 (en) * 2001-04-20 2006-07-25 Luxtron Corporation In situ optical surface temperature measuring techniques and devices
US6572265B1 (en) 2001-04-20 2003-06-03 Luxtron Corporation In situ optical surface temperature measuring techniques and devices
US20040012808A1 (en) * 2001-06-04 2004-01-22 Payne David M. Network-based technical support and diagnostics
US6796711B2 (en) * 2002-03-29 2004-09-28 Axcelis Technologies, Inc. Contact temperature probe and process
US6695886B1 (en) * 2002-08-22 2004-02-24 Axcelis Technologies, Inc. Optical path improvement, focus length change compensation, and stray light reduction for temperature measurement system of RTP tool
US7183779B2 (en) * 2004-12-28 2007-02-27 Spectrum Technologies, Inc. Soil probe device and method of making same
US7651269B2 (en) * 2007-07-19 2010-01-26 Lam Research Corporation Temperature probes having a thermally isolated tip
JP5591565B2 (ja) * 2010-03-12 2014-09-17 東京エレクトロン株式会社 温度測定用プローブ、温度測定システム及びこれを用いた温度測定方法
US9196516B2 (en) * 2013-03-14 2015-11-24 Qualitau, Inc. Wafer temperature measurement tool
WO2022187343A1 (en) * 2021-03-02 2022-09-09 Applied Materials, Inc. Apparatus for fiber optic temperature probe in processing chambers

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2093045A6 (cg-RX-API-DMAC7.html) * 1970-05-29 1972-01-28 Commissariat Energie Atomique
US4909314A (en) * 1979-12-21 1990-03-20 Varian Associates, Inc. Apparatus for thermal treatment of a wafer in an evacuated environment
US4457359A (en) * 1982-05-25 1984-07-03 Varian Associates, Inc. Apparatus for gas-assisted, solid-to-solid thermal transfer with a semiconductor wafer
JPS59215718A (ja) * 1983-05-23 1984-12-05 Kokusai Electric Co Ltd 半導体基板の赤外線熱処理装置
US4949783A (en) * 1988-05-18 1990-08-21 Veeco Instruments, Inc. Substrate transport and cooling apparatus and method for same
US4907894A (en) * 1988-12-20 1990-03-13 Bnf Metals Technology Centre Surface-temperature sensing method and apparatus
US5755511A (en) * 1994-12-19 1998-05-26 Applied Materials, Inc. Method and apparatus for measuring substrate temperatures
US6140612A (en) * 1995-06-07 2000-10-31 Lam Research Corporation Controlling the temperature of a wafer by varying the pressure of gas between the underside of the wafer and the chuck
US5791782A (en) * 1995-09-21 1998-08-11 Fusion Systems Corporation Contact temperature probe with unrestrained orientation
JP3323927B2 (ja) * 1995-11-02 2002-09-09 株式会社アドバンスト・ディスプレイ 基板表面検査方法および該方法に用いる装置
US5775416A (en) * 1995-11-17 1998-07-07 Cvc Products, Inc. Temperature controlled chuck for vacuum processing
US5761023A (en) * 1996-04-25 1998-06-02 Applied Materials, Inc. Substrate support with pressure zones having reduced contact area and temperature feedback
JPH10239165A (ja) * 1997-02-27 1998-09-11 Sony Corp 基板の温度測定器、基板の温度を測定する方法および基板の加熱方法
US5937541A (en) * 1997-09-15 1999-08-17 Siemens Aktiengesellschaft Semiconductor wafer temperature measurement and control thereof using gas temperature measurement

Also Published As

Publication number Publication date
EP1014058A1 (en) 2000-06-28
JP4671142B2 (ja) 2011-04-13
DE69927921D1 (de) 2005-12-01
JP2000200815A (ja) 2000-07-18
US6110288A (en) 2000-08-29
EP1014058B1 (en) 2005-10-26

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee