DE69918503D1 - Verfahren zum Schleifen von Halbleiterkörpern - Google Patents
Verfahren zum Schleifen von HalbleiterkörpernInfo
- Publication number
- DE69918503D1 DE69918503D1 DE69918503T DE69918503T DE69918503D1 DE 69918503 D1 DE69918503 D1 DE 69918503D1 DE 69918503 T DE69918503 T DE 69918503T DE 69918503 T DE69918503 T DE 69918503T DE 69918503 D1 DE69918503 D1 DE 69918503D1
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor bodies
- grinding semiconductor
- grinding
- bodies
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/061—Work supports, e.g. adjustable steadies axially supporting turning workpieces, e.g. magnetically, pneumatically
- B24B41/062—Work supports, e.g. adjustable steadies axially supporting turning workpieces, e.g. magnetically, pneumatically between centres; Dogs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25360698 | 1998-09-08 | ||
| JP10253606A JP2000091285A (ja) | 1998-09-08 | 1998-09-08 | 半導体物品の研削方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE69918503D1 true DE69918503D1 (de) | 2004-08-12 |
| DE69918503T2 DE69918503T2 (de) | 2004-11-18 |
Family
ID=17253720
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE1999618503 Expired - Lifetime DE69918503T2 (de) | 1998-09-08 | 1999-08-18 | Verfahren zum Schleifen von Halbleiterkörpern |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US6309280B1 (de) |
| EP (1) | EP0985494B1 (de) |
| JP (1) | JP2000091285A (de) |
| DE (1) | DE69918503T2 (de) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4249827B2 (ja) * | 1998-12-04 | 2009-04-08 | 株式会社ディスコ | 半導体ウェーハの製造方法 |
| JP2001196328A (ja) * | 2000-01-12 | 2001-07-19 | Disco Abrasive Syst Ltd | Csp基板の分割方法 |
| JP4615095B2 (ja) * | 2000-06-08 | 2011-01-19 | 株式会社ディスコ | チップの研削方法 |
| JP2003151920A (ja) * | 2001-11-09 | 2003-05-23 | Disco Abrasive Syst Ltd | 切削機における被加工物位置合わせ方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL158025B (nl) * | 1971-02-05 | 1978-09-15 | Philips Nv | Werkwijze voor het vervaardigen van een halfgeleiderinrichting en halfgeleiderinrichting, vervaardigd volgens deze werkwijze. |
| JPS60101933A (ja) * | 1983-11-07 | 1985-06-06 | Nec Corp | 半導体スライス研削方法 |
| US4749120A (en) * | 1986-12-18 | 1988-06-07 | Matsushita Electric Industrial Co., Ltd. | Method of connecting a semiconductor device to a wiring board |
| JP2833111B2 (ja) * | 1989-03-09 | 1998-12-09 | 日立化成工業株式会社 | 回路の接続方法及びそれに用いる接着剤フィルム |
| JPH04297056A (ja) * | 1991-03-08 | 1992-10-21 | Sony Corp | 半導体装置の製造方法 |
| JP2982126B2 (ja) * | 1991-03-20 | 1999-11-22 | 株式会社日立製作所 | 半導体装置およびその製造方法 |
| JP3351706B2 (ja) * | 1997-05-14 | 2002-12-03 | 株式会社東芝 | 半導体装置およびその製造方法 |
| US5920769A (en) * | 1997-12-12 | 1999-07-06 | Micron Technology, Inc. | Method and apparatus for processing a planar structure |
-
1998
- 1998-09-08 JP JP10253606A patent/JP2000091285A/ja active Pending
-
1999
- 1999-08-11 US US09/372,162 patent/US6309280B1/en not_active Expired - Lifetime
- 1999-08-18 DE DE1999618503 patent/DE69918503T2/de not_active Expired - Lifetime
- 1999-08-18 EP EP99116116A patent/EP0985494B1/de not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| EP0985494B1 (de) | 2004-07-07 |
| US6309280B1 (en) | 2001-10-30 |
| EP0985494A2 (de) | 2000-03-15 |
| DE69918503T2 (de) | 2004-11-18 |
| JP2000091285A (ja) | 2000-03-31 |
| EP0985494A3 (de) | 2003-01-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8364 | No opposition during term of opposition |