DE69918503D1 - Verfahren zum Schleifen von Halbleiterkörpern - Google Patents

Verfahren zum Schleifen von Halbleiterkörpern

Info

Publication number
DE69918503D1
DE69918503D1 DE69918503T DE69918503T DE69918503D1 DE 69918503 D1 DE69918503 D1 DE 69918503D1 DE 69918503 T DE69918503 T DE 69918503T DE 69918503 T DE69918503 T DE 69918503T DE 69918503 D1 DE69918503 D1 DE 69918503D1
Authority
DE
Germany
Prior art keywords
semiconductor bodies
grinding semiconductor
grinding
bodies
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69918503T
Other languages
English (en)
Other versions
DE69918503T2 (de
Inventor
Yukihiro Kaneda
Shuichi Takizawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Application granted granted Critical
Publication of DE69918503D1 publication Critical patent/DE69918503D1/de
Publication of DE69918503T2 publication Critical patent/DE69918503T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/061—Work supports, e.g. adjustable steadies axially supporting turning workpieces, e.g. magnetically, pneumatically
    • B24B41/062—Work supports, e.g. adjustable steadies axially supporting turning workpieces, e.g. magnetically, pneumatically between centres; Dogs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • H10P52/00—
    • H10P54/00—

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
DE1999618503 1998-09-08 1999-08-18 Verfahren zum Schleifen von Halbleiterkörpern Expired - Lifetime DE69918503T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP10253606A JP2000091285A (ja) 1998-09-08 1998-09-08 半導体物品の研削方法
JP25360698 1998-09-08

Publications (2)

Publication Number Publication Date
DE69918503D1 true DE69918503D1 (de) 2004-08-12
DE69918503T2 DE69918503T2 (de) 2004-11-18

Family

ID=17253720

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1999618503 Expired - Lifetime DE69918503T2 (de) 1998-09-08 1999-08-18 Verfahren zum Schleifen von Halbleiterkörpern

Country Status (4)

Country Link
US (1) US6309280B1 (de)
EP (1) EP0985494B1 (de)
JP (1) JP2000091285A (de)
DE (1) DE69918503T2 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4249827B2 (ja) * 1998-12-04 2009-04-08 株式会社ディスコ 半導体ウェーハの製造方法
JP2001196328A (ja) * 2000-01-12 2001-07-19 Disco Abrasive Syst Ltd Ｃｓｐ基板の分割方法
JP4615095B2 (ja) * 2000-06-08 2011-01-19 株式会社ディスコ チップの研削方法
JP2003151920A (ja) * 2001-11-09 2003-05-23 Disco Abrasive Syst Ltd 切削機における被加工物位置合わせ方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL158025B (nl) * 1971-02-05 1978-09-15 Philips Nv Werkwijze voor het vervaardigen van een halfgeleiderinrichting en halfgeleiderinrichting, vervaardigd volgens deze werkwijze.
JPS60101933A (ja) * 1983-11-07 1985-06-06 Nec Corp 半導体スライス研削方法
US4749120A (en) * 1986-12-18 1988-06-07 Matsushita Electric Industrial Co., Ltd. Method of connecting a semiconductor device to a wiring board
JP2833111B2 (ja) * 1989-03-09 1998-12-09 日立化成工業株式会社 回路の接続方法及びそれに用いる接着剤フィルム
JPH04297056A (ja) * 1991-03-08 1992-10-21 Sony Corp 半導体装置の製造方法
JP2982126B2 (ja) * 1991-03-20 1999-11-22 株式会社日立製作所 半導体装置およびその製造方法
JP3351706B2 (ja) * 1997-05-14 2002-12-03 株式会社東芝 半導体装置およびその製造方法
US5920769A (en) * 1997-12-12 1999-07-06 Micron Technology, Inc. Method and apparatus for processing a planar structure

Also Published As

Publication number Publication date
US6309280B1 (en) 2001-10-30
JP2000091285A (ja) 2000-03-31
EP0985494A3 (de) 2003-01-22
DE69918503T2 (de) 2004-11-18
EP0985494B1 (de) 2004-07-07
EP0985494A2 (de) 2000-03-15

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition