DE69908110D1 - Verfahren und vorrichtung zur schichtdickenbestimmung beim wafertransportsystem - Google Patents

Verfahren und vorrichtung zur schichtdickenbestimmung beim wafertransportsystem

Info

Publication number
DE69908110D1
DE69908110D1 DE69908110T DE69908110T DE69908110D1 DE 69908110 D1 DE69908110 D1 DE 69908110D1 DE 69908110 T DE69908110 T DE 69908110T DE 69908110 T DE69908110 T DE 69908110T DE 69908110 D1 DE69908110 D1 DE 69908110D1
Authority
DE
Germany
Prior art keywords
determining
film thickness
layer thickness
transport system
cluster tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69908110T
Other languages
English (en)
Other versions
DE69908110T2 (de
Inventor
Michael Labunsky
Andrew Nagengast
Anil Pant
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of DE69908110D1 publication Critical patent/DE69908110D1/de
Application granted granted Critical
Publication of DE69908110T2 publication Critical patent/DE69908110T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
DE69908110T 1998-03-31 1999-03-22 Verfahren und vorrichtung zur schichtdickenbestimmung beim wafertransportsystem Expired - Fee Related DE69908110T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/052,148 US6132289A (en) 1998-03-31 1998-03-31 Apparatus and method for film thickness measurement integrated into a wafer load/unload unit
PCT/US1999/006241 WO1999050025A1 (en) 1998-03-31 1999-03-22 Apparatus and method for film thickness measurement integrated into a wafer load/unload unit

Publications (2)

Publication Number Publication Date
DE69908110D1 true DE69908110D1 (de) 2003-06-26
DE69908110T2 DE69908110T2 (de) 2003-11-27

Family

ID=21975774

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69908110T Expired - Fee Related DE69908110T2 (de) 1998-03-31 1999-03-22 Verfahren und vorrichtung zur schichtdickenbestimmung beim wafertransportsystem

Country Status (7)

Country Link
US (1) US6132289A (de)
EP (1) EP1068047B1 (de)
JP (1) JP2002510149A (de)
KR (1) KR100602285B1 (de)
AT (1) ATE240817T1 (de)
DE (1) DE69908110T2 (de)
WO (1) WO1999050025A1 (de)

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US20020162996A1 (en) * 2001-05-02 2002-11-07 Chia-Lin Hsu Chemical mechanical polishing system and method for planarizing substrates in fabricating semiconductor devices
JP2002343756A (ja) * 2001-05-21 2002-11-29 Tokyo Seimitsu Co Ltd ウェーハ平面加工装置
US6462409B1 (en) * 2001-06-06 2002-10-08 Advanced Micro Devices, Inc. Semiconductor wafer polishing apparatus
US6842659B2 (en) 2001-08-24 2005-01-11 Applied Materials Inc. Method and apparatus for providing intra-tool monitoring and control
US7112812B2 (en) * 2001-12-28 2006-09-26 Applied Materials, Inc. Optical measurement apparatus
US6514865B1 (en) * 2002-01-11 2003-02-04 Advanced Micro Devices, Inc. Method of reducing interlayer dielectric thickness variation feeding into a planarization process
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JP4090247B2 (ja) * 2002-02-12 2008-05-28 株式会社荏原製作所 基板処理装置
JP4197103B2 (ja) * 2002-04-15 2008-12-17 株式会社荏原製作所 ポリッシング装置
US20040011462A1 (en) * 2002-06-28 2004-01-22 Lam Research Corporation Method and apparatus for applying differential removal rates to a surface of a substrate
US7128803B2 (en) * 2002-06-28 2006-10-31 Lam Research Corporation Integration of sensor based metrology into semiconductor processing tools
US7309618B2 (en) * 2002-06-28 2007-12-18 Lam Research Corporation Method and apparatus for real time metal film thickness measurement
US6932558B2 (en) 2002-07-03 2005-08-23 Kung Chris Wu Wafer aligner
TWI246952B (en) * 2002-11-22 2006-01-11 Applied Materials Inc Methods and apparatus for polishing control
AU2003220252A1 (en) * 2003-03-14 2004-10-11 Midwest Research Institute Wafer characteristics via reflectometry
JP2005156546A (ja) * 2003-10-30 2005-06-16 Matsushita Electric Ind Co Ltd 薄板材の測定装置および測定方法
US7195535B1 (en) * 2004-07-22 2007-03-27 Applied Materials, Inc. Metrology for chemical mechanical polishing
KR100716935B1 (ko) * 2005-11-25 2007-05-14 두산디앤디 주식회사 반도체 웨이퍼의 화학기계적 연마장치용 로딩디바이스
US8628376B2 (en) * 2008-11-07 2014-01-14 Applied Materials, Inc. In-line wafer thickness sensing
KR101698615B1 (ko) 2008-12-10 2017-01-20 램 리써치 코포레이션 실리콘 전극 연마를 용이하게 하는 플래튼 및 어댑터 어셈블리
KR101033855B1 (ko) * 2010-09-02 2011-05-16 노바테크 (주) 유리기판의 두께 측정 및 이차원 코드 검출 시스템과 그 방법
US20130017762A1 (en) * 2011-07-15 2013-01-17 Infineon Technologies Ag Method and Apparatus for Determining a Measure of a Thickness of a Polishing Pad of a Polishing Machine
US9240042B2 (en) 2013-10-24 2016-01-19 Globalfoundries Inc. Wafer slip detection during CMP processing
US10099339B2 (en) * 2016-06-02 2018-10-16 Semiconductor Manufacturing International (Shanghai) Corporation Chemical mechanical polishing (CMP) apparatus and method
JP6920849B2 (ja) * 2017-03-27 2021-08-18 株式会社荏原製作所 基板処理方法および装置

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Also Published As

Publication number Publication date
ATE240817T1 (de) 2003-06-15
DE69908110T2 (de) 2003-11-27
KR20010042086A (ko) 2001-05-25
KR100602285B1 (ko) 2006-07-14
US6132289A (en) 2000-10-17
EP1068047A1 (de) 2001-01-17
WO1999050025A1 (en) 1999-10-07
EP1068047B1 (de) 2003-05-21
JP2002510149A (ja) 2002-04-02

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee