DE69903045T2 - Eine bewegliche vorrichtung zum selektiven entfernen von brücken und verfahren zum entfernen von brücken gelöteter verbindungen auf gedruckten leiterplatten mittels einer solchen vorrichtung - Google Patents

Eine bewegliche vorrichtung zum selektiven entfernen von brücken und verfahren zum entfernen von brücken gelöteter verbindungen auf gedruckten leiterplatten mittels einer solchen vorrichtung

Info

Publication number
DE69903045T2
DE69903045T2 DE69903045T DE69903045T DE69903045T2 DE 69903045 T2 DE69903045 T2 DE 69903045T2 DE 69903045 T DE69903045 T DE 69903045T DE 69903045 T DE69903045 T DE 69903045T DE 69903045 T2 DE69903045 T2 DE 69903045T2
Authority
DE
Germany
Prior art keywords
solder
bridges
tool
wave soldering
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69903045T
Other languages
English (en)
Other versions
DE69903045D1 (de
Inventor
Lance Larrabee
John Norton
Petrus Willemen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vitronics Soltec BV
Original Assignee
Vitronics Soltec BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/024,086 external-priority patent/US6164515A/en
Application filed by Vitronics Soltec BV filed Critical Vitronics Soltec BV
Publication of DE69903045D1 publication Critical patent/DE69903045D1/de
Application granted granted Critical
Publication of DE69903045T2 publication Critical patent/DE69903045T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B23K1/085—Wave soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/018—Unsoldering; Removal of melted solder or other residues
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
DE69903045T 1998-02-17 1999-02-17 Eine bewegliche vorrichtung zum selektiven entfernen von brücken und verfahren zum entfernen von brücken gelöteter verbindungen auf gedruckten leiterplatten mittels einer solchen vorrichtung Expired - Lifetime DE69903045T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US09/024,086 US6164515A (en) 1998-02-17 1998-02-17 Movable selective debridging apparatus and method of debridging soldered joints on printed circuit boards using same
NL1009177 1998-05-15
NL1010679 1998-11-27
PCT/NL1999/000082 WO1999041036A1 (en) 1998-02-17 1999-02-17 Movable selective debridging apparatus and method of debridging soldered joints on printed circuit boards using same

Publications (2)

Publication Number Publication Date
DE69903045D1 DE69903045D1 (de) 2002-10-24
DE69903045T2 true DE69903045T2 (de) 2003-04-17

Family

ID=27351187

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69903045T Expired - Lifetime DE69903045T2 (de) 1998-02-17 1999-02-17 Eine bewegliche vorrichtung zum selektiven entfernen von brücken und verfahren zum entfernen von brücken gelöteter verbindungen auf gedruckten leiterplatten mittels einer solchen vorrichtung

Country Status (6)

Country Link
US (1) US6168065B1 (de)
EP (1) EP1102655B1 (de)
AT (1) ATE224253T1 (de)
AU (1) AU3278599A (de)
DE (1) DE69903045T2 (de)
WO (1) WO1999041036A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013110731B3 (de) * 2013-09-27 2014-11-06 Ersa Gmbh Trennstreifen-Anordnung für Lötdüse, sowie Lötdüseneinrichtung zum selektiven Wellenlöten

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US6164515A (en) * 1998-02-17 2000-12-26 Soltec B.V. Movable selective debridging apparatus and method of debridging soldered joints on printed circuit boards using same
US6315189B1 (en) * 1998-10-13 2001-11-13 Texas Instruments Incorporated Semiconductor package lead plating method and apparatus
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CN103624359A (zh) * 2012-08-22 2014-03-12 深圳市鑫金桥自动化设备有限公司 一种助焊剂定点喷雾的装置及方法
US9180539B1 (en) * 2014-03-18 2015-11-10 Flextronics Ap, Llc Method of and system for dressing RF shield pads
CN103949747A (zh) * 2014-04-02 2014-07-30 今日机械设备（大连）有限公司 车灯led基板自动插件机器人焊锡机及其工作方法
DE102014110720A1 (de) * 2014-07-29 2016-02-04 Illinois Tool Works Inc. Lötmodul
CN104916374B (zh) * 2015-06-01 2017-01-11 神宇通信科技股份公司 助焊剂涂敷装置
CN104934150B (zh) * 2015-06-01 2017-01-11 神宇通信科技股份公司 带有高质量助焊剂涂敷装置的同轴电缆铜线镀锡生产线
CN104959696B (zh) * 2015-07-13 2017-01-04 深圳市卓茂科技有限公司 一种半自动除锡机
DE102016118789A1 (de) * 2016-10-05 2018-04-05 Ersa Gmbh Lötvorrichtung
US10473712B2 (en) * 2016-12-27 2019-11-12 Infineon Technologies Ag Integrated circuit device testing in an inert gas
JP6849909B2 (ja) * 2017-02-07 2021-03-31 富士通株式会社 はんだ付け方法、はんだ付け装置、及び噴流ノズルのはんだ濡れの保持方法
WO2020044387A1 (ja) * 2018-08-27 2020-03-05 株式会社Ｆｕｊｉ はんだ供給装置
US11059120B2 (en) * 2018-11-01 2021-07-13 International Business Machines Corporation Non-destructive identifying of plating dissolution in soldered, plated through-hole
CN109496081B (zh) * 2018-11-12 2020-03-06 Oppo（重庆）智能科技有限公司 用于固定显示屏柔性电路板的btb连接座的治具
EP3936271A1 (de) * 2020-07-08 2022-01-12 Illinois Tool Works, Inc. Lötdüse, system und verwendung
CN115780957B (zh) * 2023-02-06 2023-05-19 四川省蜀锦工贸有限责任公司 一种引脚焊锡去除装置

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013110731B3 (de) * 2013-09-27 2014-11-06 Ersa Gmbh Trennstreifen-Anordnung für Lötdüse, sowie Lötdüseneinrichtung zum selektiven Wellenlöten

Also Published As

Publication number Publication date
DE69903045D1 (de) 2002-10-24
ATE224253T1 (de) 2002-10-15
WO1999041036A1 (en) 1999-08-19
EP1102655B1 (de) 2002-09-18
US6168065B1 (en) 2001-01-02
AU3278599A (en) 1999-08-30
EP1102655A1 (de) 2001-05-30

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