DE69836235D1 - System für akustische Oberflächenwelle - Google Patents

System für akustische Oberflächenwelle

Info

Publication number
DE69836235D1
DE69836235D1 DE69836235T DE69836235T DE69836235D1 DE 69836235 D1 DE69836235 D1 DE 69836235D1 DE 69836235 T DE69836235 T DE 69836235T DE 69836235 T DE69836235 T DE 69836235T DE 69836235 D1 DE69836235 D1 DE 69836235D1
Authority
DE
Germany
Prior art keywords
acoustic wave
surface acoustic
wave
acoustic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69836235T
Other languages
English (en)
Other versions
DE69836235T2 (de
Inventor
Eiichi Fukiharu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Publication of DE69836235D1 publication Critical patent/DE69836235D1/de
Application granted granted Critical
Publication of DE69836235T2 publication Critical patent/DE69836235T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/058—Holders; Supports for surface acoustic wave devices
    • H03H9/0585—Holders; Supports for surface acoustic wave devices consisting of an adhesive layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48237—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H2009/0019—Surface acoustic wave multichip

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Transducers For Ultrasonic Waves (AREA)
DE69836235T 1997-01-31 1998-01-23 Akustisches Oberflächenwellenssystem Expired - Lifetime DE69836235T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP9017988A JPH10215143A (ja) 1997-01-31 1997-01-31 弾性表面波装置
JP1798897 1997-01-31

Publications (2)

Publication Number Publication Date
DE69836235D1 true DE69836235D1 (de) 2006-12-07
DE69836235T2 DE69836235T2 (de) 2007-10-04

Family

ID=11959113

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69836235T Expired - Lifetime DE69836235T2 (de) 1997-01-31 1998-01-23 Akustisches Oberflächenwellenssystem

Country Status (4)

Country Link
US (1) US6075307A (de)
EP (1) EP0856944B1 (de)
JP (1) JPH10215143A (de)
DE (1) DE69836235T2 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4817512B2 (ja) * 2001-02-28 2011-11-16 京セラキンセキ株式会社 弾性表面波装置
US20040007940A1 (en) * 2002-07-15 2004-01-15 Asia Pacific Microsystems, Inc. Thin film acoustic wave device and the manufacturing method thereof
CN100555858C (zh) * 2004-03-12 2009-10-28 株式会社村田制作所 表面声波装置
JP4712632B2 (ja) * 2006-07-24 2011-06-29 太陽誘電株式会社 弾性波デバイス及びその製造方法
US8508100B2 (en) * 2008-11-04 2013-08-13 Samsung Electronics Co., Ltd. Surface acoustic wave element, surface acoustic wave device and methods for manufacturing the same

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3701147A (en) * 1969-01-22 1972-10-24 Us Navy Surface wave devices for signal processing
JPS5242626B2 (de) * 1973-06-01 1977-10-25
JPS53145595A (en) * 1977-05-25 1978-12-18 Nippon Telegr & Teleph Corp <Ntt> Elastic surface wave oscillator
GB2100521B (en) * 1981-05-13 1984-09-12 Plessey Co Plc Electrical device package
JPS5943826A (ja) * 1982-09-04 1984-03-12 Sumitomo Metal Ind Ltd 高靭性電縫鋼管の製造方法
JPS6142943A (ja) * 1984-08-06 1986-03-01 Clarion Co Ltd 複合半導体装置の製造方法
JPS6194409A (ja) * 1984-10-15 1986-05-13 Clarion Co Ltd 弾性表面波素子の素子分離構造
JPS62105514A (ja) * 1985-11-01 1987-05-16 Kokusai Denshin Denwa Co Ltd <Kdd> 弾性表面波フイルタバンク
US4931752A (en) * 1987-09-30 1990-06-05 Hewlett-Packard Company Polyimide damper for surface acoustic wave device
JP2894616B2 (ja) * 1988-10-31 1999-05-24 株式会社日立製作所 弾性表面波装置及びこれを用いた機器
JPH0314823A (ja) * 1989-06-13 1991-01-23 Teijin Ltd 重合体成形物
JPH03293808A (ja) * 1990-04-11 1991-12-25 Fujitsu Ltd 弾性表面波素子の製造方法
JPH066175A (ja) * 1992-06-19 1994-01-14 Murata Mfg Co Ltd 圧電部品
US5471178A (en) * 1994-02-03 1995-11-28 Motorola, Inc. Ladder filter and method for producing conjugately matched impedance
JP3308759B2 (ja) * 1995-04-10 2002-07-29 日本電気株式会社 弾性表面波装置
DE69609559T2 (de) * 1995-05-08 2001-04-19 Matsushita Electric Ind Co Ltd Verfahren zur Herstellung eines Verbundsubstrats und eine dieses Substrat benutzende piezoelektrischer Anordnung
TW438155U (en) * 1995-07-27 2001-05-28 Daishinku Corp Multi-mode piezoelectric filter

Also Published As

Publication number Publication date
EP0856944B1 (de) 2006-10-25
JPH10215143A (ja) 1998-08-11
DE69836235T2 (de) 2007-10-04
EP0856944A3 (de) 2000-08-16
US6075307A (en) 2000-06-13
EP0856944A2 (de) 1998-08-05

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Legal Events

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