DE69827147T2 - Verfahren zum herstellen von einem polierkissen - Google Patents

Verfahren zum herstellen von einem polierkissen Download PDF

Info

Publication number
DE69827147T2
DE69827147T2 DE69827147T DE69827147T DE69827147T2 DE 69827147 T2 DE69827147 T2 DE 69827147T2 DE 69827147 T DE69827147 T DE 69827147T DE 69827147 T DE69827147 T DE 69827147T DE 69827147 T2 DE69827147 T2 DE 69827147T2
Authority
DE
Germany
Prior art keywords
features
polishing
areas
pillow
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69827147T
Other languages
German (de)
English (en)
Other versions
DE69827147D1 (de
Inventor
V. John ROBERTS
W. Charles JENKINS
B. David JAMES
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Electronic Materials Holding Inc
Original Assignee
Rohm and Haas Electronic Materials CMP Holdings Inc
Rohm and Haas Electronic Materials LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm and Haas Electronic Materials CMP Holdings Inc, Rohm and Haas Electronic Materials LLC filed Critical Rohm and Haas Electronic Materials CMP Holdings Inc
Publication of DE69827147D1 publication Critical patent/DE69827147D1/de
Application granted granted Critical
Publication of DE69827147T2 publication Critical patent/DE69827147T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/22—Rubbers synthetic or natural
    • B24D3/26—Rubbers synthetic or natural for porous or cellular structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
DE69827147T 1997-08-06 1998-08-05 Verfahren zum herstellen von einem polierkissen Expired - Lifetime DE69827147T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US5490697P 1997-08-06 1997-08-06
US54906P 1997-08-06
PCT/US1998/016289 WO1999007515A1 (en) 1997-08-06 1998-08-05 Improved polishing pads and methods relating thereto

Publications (2)

Publication Number Publication Date
DE69827147D1 DE69827147D1 (de) 2004-11-25
DE69827147T2 true DE69827147T2 (de) 2006-03-02

Family

ID=21994291

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69827147T Expired - Lifetime DE69827147T2 (de) 1997-08-06 1998-08-05 Verfahren zum herstellen von einem polierkissen

Country Status (6)

Country Link
EP (1) EP1011919B1 (enExample)
JP (1) JP2001513450A (enExample)
KR (1) KR100499601B1 (enExample)
CN (1) CN1265618A (enExample)
DE (1) DE69827147T2 (enExample)
WO (1) WO1999007515A1 (enExample)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001518852A (ja) * 1997-04-04 2001-10-16 ローデル ホールディングス インコーポレイテッド 改良研磨パッド及びこれに関連する方法
JP3918359B2 (ja) * 1998-05-15 2007-05-23 Ｊｓｒ株式会社 研磨パッド用重合体組成物および研磨パッド
JP4954377B2 (ja) * 2000-02-04 2012-06-13 東洋ゴム工業株式会社 研磨パッド及びその製造方法
DE60109601T2 (de) * 2000-05-27 2006-02-09 Rohm and Haas Electronic Materials CMP Holdings, Inc., Wilmington Rillen-polierkissen zum chemisch-mechanischen planarisieren
US6477926B1 (en) 2000-09-15 2002-11-12 Ppg Industries Ohio, Inc. Polishing pad
US6679769B2 (en) 2000-09-19 2004-01-20 Rodel Holdings, Inc Polishing pad having an advantageous micro-texture and methods relating thereto
SG131737A1 (en) * 2001-03-28 2007-05-28 Disco Corp Polishing tool and polishing method and apparatus using same
US6568997B2 (en) 2001-04-05 2003-05-27 Rodel Holdings, Inc. CMP polishing composition for semiconductor devices containing organic polymer particles
US7214623B2 (en) * 2003-10-13 2007-05-08 International Business Machines Corporation Planarization system and method using a carbonate containing fluid
US7059936B2 (en) * 2004-03-23 2006-06-13 Cabot Microelectronics Corporation Low surface energy CMP pad
US7204742B2 (en) * 2004-03-25 2007-04-17 Cabot Microelectronics Corporation Polishing pad comprising hydrophobic region and endpoint detection port
US20060089095A1 (en) 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
KR100909605B1 (ko) 2005-03-08 2009-07-27 도요 고무 고교 가부시키가이샤 연마 패드 및 그 제조 방법
KR100949560B1 (ko) 2005-05-17 2010-03-25 도요 고무 고교 가부시키가이샤 연마 패드
JP4884725B2 (ja) 2005-08-30 2012-02-29 東洋ゴム工業株式会社 研磨パッド
JP4898172B2 (ja) * 2005-09-08 2012-03-14 日本ミクロコーティング株式会社 研磨パッド及びその製造方法並びに研磨方法
JP5031236B2 (ja) 2006-01-10 2012-09-19 東洋ゴム工業株式会社 研磨パッド
US20070197145A1 (en) 2006-02-15 2007-08-23 Applied Materials, Inc. Polishing article with window stripe
CN102990530B (zh) 2006-07-14 2016-02-10 圣戈本磨料股份有限公司 无背衬研磨制品
KR101107043B1 (ko) 2006-08-28 2012-01-25 도요 고무 고교 가부시키가이샤 연마 패드
JP5008927B2 (ja) 2006-08-31 2012-08-22 東洋ゴム工業株式会社 研磨パッド
JP5078000B2 (ja) 2007-03-28 2012-11-21 東洋ゴム工業株式会社 研磨パッド
JP5314353B2 (ja) * 2008-08-05 2013-10-16 旭ダイヤモンド工業株式会社 超砥粒チップ及び超砥粒工具
US8512427B2 (en) * 2011-09-29 2013-08-20 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Acrylate polyurethane chemical mechanical polishing layer
FR3025741B1 (fr) * 2014-09-15 2019-05-24 Airbus Group Sas Film adhesif multifonctionnel pour la protection de surface de pieces
CN104889874B (zh) * 2015-06-25 2017-08-04 蓝思科技（长沙）有限公司 一种蓝宝石抛光用吸附垫及其制备方法
JP7066608B2 (ja) * 2015-09-25 2022-05-13 シーエムシー マテリアルズ，インコーポレイティド 化学機械的研磨パッド、基板を化学機械的に研磨する方法、及び化学機械的研磨パッドを製造する方法
JP6380333B2 (ja) * 2015-10-30 2018-08-29 株式会社Sumco ウェーハ研磨装置およびこれに用いる研磨ヘッド
CN105538047B (zh) * 2015-12-11 2017-09-22 中国航空工业集团公司北京航空材料研究院 一种航空有机透明制件的表面研抛方法
US20180134918A1 (en) * 2016-11-11 2018-05-17 Jh Rhodes Company, Inc. Soft polymer-based material polishing media
WO2019012391A1 (en) * 2017-07-11 2019-01-17 3M Innovative Properties Company ABRASIVE ARTICLES COMPRISING ADAPTABLE COATINGS, AND POLISHING SYSTEM MANUFACTURED THEREFROM
CN109794863A (zh) * 2019-03-05 2019-05-24 北京国瑞升精机科技有限公司 一种亲水性抛光膜及其制备方法
CN110744444B (zh) * 2019-10-29 2022-02-15 武汉新芯集成电路制造有限公司 研磨垫及研磨装置
WO2023149434A1 (ja) 2022-02-02 2023-08-10 株式会社クラレ 研磨層、研磨パッド、研磨パッドの製造方法及び研磨方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4129457A (en) * 1977-05-23 1978-12-12 International Business Machines Corporation Post-polishing cleaning of semiconductor surfaces
US4581287A (en) * 1984-06-18 1986-04-08 Creative Products Resource Associates, Ltd. Composite reticulated foam-textile cleaning pad
US4787732A (en) * 1986-04-24 1988-11-29 Nick Siviglia Contact lens and method of making same
US5396737B1 (en) * 1989-01-18 1997-12-23 Minnesota Mining & Mfg Compound glazing or polishing pad
US5007128B1 (en) * 1989-01-18 1993-12-07 Minnesota Mining And Manufacturing Company Compounding,glazing or polishing pad
JP2632738B2 (ja) * 1990-04-27 1997-07-23 信越半導体 株式会社 パッキングパッド、および半導体ウェーハの研磨方法
US5157877A (en) * 1990-04-27 1992-10-27 Shin-Etsu Handotai Co., Ltd. Method for preparing a semiconductor wafer
MY114512A (en) * 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
US5704987A (en) * 1996-01-19 1998-01-06 International Business Machines Corporation Process for removing residue from a semiconductor wafer after chemical-mechanical polishing

Also Published As

Publication number Publication date
EP1011919A1 (en) 2000-06-28
EP1011919A4 (en) 2000-11-02
DE69827147D1 (de) 2004-11-25
EP1011919B1 (en) 2004-10-20
KR100499601B1 (ko) 2005-07-07
JP2001513450A (ja) 2001-09-04
CN1265618A (zh) 2000-09-06
WO1999007515A1 (en) 1999-02-18
KR20010022571A (ko) 2001-03-26

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Legal Events

Date Code Title Description
8327 Change in the person/name/address of the patent owner

Owner name: ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, I

8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, I