DE69824372D1 - Vorrichtung zur Exposition der peripheren Fläche eines Halbleiter-Wafers - Google Patents

Vorrichtung zur Exposition der peripheren Fläche eines Halbleiter-Wafers

Info

Publication number
DE69824372D1
DE69824372D1 DE69824372T DE69824372T DE69824372D1 DE 69824372 D1 DE69824372 D1 DE 69824372D1 DE 69824372 T DE69824372 T DE 69824372T DE 69824372 T DE69824372 T DE 69824372T DE 69824372 D1 DE69824372 D1 DE 69824372D1
Authority
DE
Germany
Prior art keywords
exposing
peripheral surface
semiconductor wafer
wafer
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69824372T
Other languages
English (en)
Other versions
DE69824372T2 (de
Inventor
Shinetsu Miura
Yoshiki Mimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ushio Denki KK
Original Assignee
Ushio Denki KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ushio Denki KK filed Critical Ushio Denki KK
Publication of DE69824372D1 publication Critical patent/DE69824372D1/de
Application granted granted Critical
Publication of DE69824372T2 publication Critical patent/DE69824372T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
DE69824372T 1997-11-26 1998-11-25 Vorrichtung zur Exposition der peripheren Fläche eines Halbleiter-Wafers Expired - Lifetime DE69824372T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP32444097 1997-11-26
JP32444097 1997-11-26
JP2714598 1998-02-09
JP02714598A JP3356047B2 (ja) 1997-11-26 1998-02-09 ウエハ周辺露光装置

Publications (2)

Publication Number Publication Date
DE69824372D1 true DE69824372D1 (de) 2004-07-15
DE69824372T2 DE69824372T2 (de) 2005-06-16

Family

ID=26365047

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69824372T Expired - Lifetime DE69824372T2 (de) 1997-11-26 1998-11-25 Vorrichtung zur Exposition der peripheren Fläche eines Halbleiter-Wafers

Country Status (6)

Country Link
US (1) US6052173A (de)
EP (1) EP0920053B1 (de)
JP (1) JP3356047B2 (de)
KR (1) KR19990045608A (de)
DE (1) DE69824372T2 (de)
TW (1) TW392205B (de)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6529274B1 (en) * 1999-05-11 2003-03-04 Micron Technology, Inc. System for processing semiconductor products
US6495312B1 (en) * 2001-02-01 2002-12-17 Lsi Logic Corporation Method and apparatus for removing photoresist edge beads from thin film substrates
KR100597043B1 (ko) * 2001-05-08 2006-07-04 에이에스엠엘 네델란즈 비.브이. 광학적 노광방법, 디바이스제조방법 및 리소그래피투영장치
EP1256848A3 (de) * 2001-05-08 2003-01-02 ASML Netherlands B.V. Optisches Belichtungsverfahren und lithographischer Projektionsapparat
JP4019651B2 (ja) * 2001-05-21 2007-12-12 ウシオ電機株式会社 周辺露光装置
JP3820946B2 (ja) * 2001-09-17 2006-09-13 ウシオ電機株式会社 周辺露光装置
WO2003032081A1 (en) * 2001-10-09 2003-04-17 Ultratech Stepper, Inc. Method and apparatus for optically defining an exposure exclusion region on a photosensitive workpiece
JP3823805B2 (ja) * 2001-10-30 2006-09-20 ウシオ電機株式会社 露光装置
JP4302373B2 (ja) 2002-07-25 2009-07-22 浜松ホトニクス株式会社 導光装置
CN1508631A (zh) * 2002-12-19 2004-06-30 Asml 器件制造方法和所制出的器件以及计算机程序和光刻装置
KR100536596B1 (ko) * 2003-03-25 2005-12-14 삼성전자주식회사 웨이퍼 가장자리 노광 장치
KR100550352B1 (ko) * 2004-07-02 2006-02-08 삼성전자주식회사 반도체 기판의 노광방법 및 이를 이용하는 노광 장치
JPWO2006025386A1 (ja) * 2004-08-31 2008-05-08 株式会社ニコン 位置合わせ方法、処理システム、基板の投入再現性計測方法、位置計測方法、露光方法、基板処理装置、計測方法及び計測装置
US7074710B2 (en) * 2004-11-03 2006-07-11 Lsi Logic Corporation Method of wafer patterning for reducing edge exclusion zone
JP4642543B2 (ja) * 2005-05-09 2011-03-02 東京エレクトロン株式会社 周縁露光装置、塗布、現像装置及び周縁露光方法
US7342642B2 (en) * 2005-06-20 2008-03-11 Asml Netherlands B.V. Pre-aligning a substrate in a lithographic apparatus, device manufacturing method, and device manufactured by the manufacturing method
JP4923936B2 (ja) * 2006-10-13 2012-04-25 東京エレクトロン株式会社 塗布、現像装置及び塗布、現像方法
JP6316082B2 (ja) * 2014-04-30 2018-04-25 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
CN105632971B (zh) * 2014-11-26 2019-06-25 上海微电子装备（集团）股份有限公司 一种硅片处理装置及方法
US9841299B2 (en) * 2014-11-28 2017-12-12 Canon Kabushiki Kaisha Position determining device, position determining method, lithographic apparatus, and method for manufacturing object
JP6308958B2 (ja) * 2015-02-25 2018-04-11 東京エレクトロン株式会社 基板処理装置、基板処理方法、プログラム及びコンピュータ記憶媒体
CN106292195B (zh) * 2015-05-24 2018-08-14 上海微电子装备（集团）股份有限公司 边缘曝光装置和方法
CN108803245B (zh) * 2017-04-28 2020-04-10 上海微电子装备（集团）股份有限公司 硅片处理装置及方法
CN113433799B (zh) * 2020-03-23 2023-01-20 长鑫存储技术有限公司 晶圆边缘曝光方法、晶圆边缘曝光装置及掩膜板
CN115018834B (zh) * 2022-08-08 2022-10-25 山东光岳九州半导体科技有限公司 一种半导体晶片图像对准方法
CN116958143B (zh) * 2023-09-20 2023-12-22 绍兴中芯集成电路制造股份有限公司 一种晶圆风险曝光区域的识别方法、系统和存储介质

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4899195A (en) * 1988-01-29 1990-02-06 Ushio Denki Method of exposing a peripheral part of wafer
US5204224A (en) * 1988-09-26 1993-04-20 Ushio Denki Method of exposing a peripheral part of a wafer
US5289263A (en) * 1989-04-28 1994-02-22 Dainippon Screen Mfg. Co., Ltd. Apparatus for exposing periphery of an object
US5168021A (en) * 1989-09-21 1992-12-01 Ushio Denki Method for exposing predetermined area of peripheral part of wafer
US5229811A (en) * 1990-06-15 1993-07-20 Nikon Corporation Apparatus for exposing peripheral portion of substrate
JP2593831B2 (ja) * 1991-03-20 1997-03-26 ウシオ電機株式会社 ウエハ上の不要レジスト露光装置および露光方法
US5420663A (en) * 1993-03-19 1995-05-30 Nikon Corporation Apparatus for exposing peripheral portion of substrate
JP3023058B2 (ja) * 1994-09-30 2000-03-21 ウシオ電機株式会社 ウエハ上の不要レジスト露光装置
JPH0950951A (ja) * 1995-08-04 1997-02-18 Nikon Corp リソグラフィ方法およびリソグラフィ装置
TW316322B (de) * 1995-10-02 1997-09-21 Ushio Electric Inc
JP3237522B2 (ja) * 1996-02-05 2001-12-10 ウシオ電機株式会社 ウエハ周辺露光方法および装置
KR100257279B1 (ko) * 1996-06-06 2000-06-01 이시다 아키라 주변노광장치 및 방법

Also Published As

Publication number Publication date
JPH11219894A (ja) 1999-08-10
KR19990045608A (ko) 1999-06-25
TW392205B (en) 2000-06-01
US6052173A (en) 2000-04-18
EP0920053A2 (de) 1999-06-02
EP0920053B1 (de) 2004-06-09
DE69824372T2 (de) 2005-06-16
JP3356047B2 (ja) 2002-12-09
EP0920053A3 (de) 2000-03-22

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