DE69815781D1 - Halbleiter-Dehnungs-Sensor, Vefahren zu dessen Herstellung und Rastersondenmikroskop - Google Patents
Halbleiter-Dehnungs-Sensor, Vefahren zu dessen Herstellung und RastersondenmikroskopInfo
- Publication number
- DE69815781D1 DE69815781D1 DE69815781T DE69815781T DE69815781D1 DE 69815781 D1 DE69815781 D1 DE 69815781D1 DE 69815781 T DE69815781 T DE 69815781T DE 69815781 T DE69815781 T DE 69815781T DE 69815781 D1 DE69815781 D1 DE 69815781D1
- Authority
- DE
- Germany
- Prior art keywords
- production
- strain sensor
- scanning probe
- probe microscope
- semiconductor strain
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000523 sample Substances 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01Q—SCANNING-PROBE TECHNIQUES OR APPARATUS; APPLICATIONS OF SCANNING-PROBE TECHNIQUES, e.g. SCANNING PROBE MICROSCOPY [SPM]
- G01Q20/00—Monitoring the movement or position of the probe
- G01Q20/04—Self-detecting probes, i.e. wherein the probe itself generates a signal representative of its position, e.g. piezoelectric gauge
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
- G01B7/16—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge
- G01B7/18—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge using change in resistance
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Radiology & Medical Imaging (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
- Length Measuring Devices With Unspecified Measuring Means (AREA)
- Pressure Sensors (AREA)
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26676097 | 1997-09-30 | ||
JP26676097 | 1997-09-30 | ||
JP3735098 | 1998-02-19 | ||
JP3735098 | 1998-02-19 | ||
JP25297298 | 1998-09-07 | ||
JP10252972A JPH11304825A (ja) | 1997-09-30 | 1998-09-07 | 半導体歪センサおよびその製造方法ならびに走査型プローブ顕微鏡 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69815781D1 true DE69815781D1 (de) | 2003-07-31 |
DE69815781T2 DE69815781T2 (de) | 2004-02-12 |
Family
ID=27289437
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69815781T Expired - Fee Related DE69815781T2 (de) | 1997-09-30 | 1998-09-30 | Halbleiter-Dehnungs-Sensor, Vefahren zu dessen Herstellung und Rastersondenmikroskop |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP0905475B1 (de) |
JP (1) | JPH11304825A (de) |
DE (1) | DE69815781T2 (de) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6479892B1 (en) * | 2000-10-31 | 2002-11-12 | Motorola, Inc. | Enhanced probe for gathering data from semiconductor devices |
US20030062193A1 (en) * | 2001-09-07 | 2003-04-03 | Jacob Thaysen | Flexible structure with integrated sensor/actuator |
EP1550850A1 (de) * | 2003-12-29 | 2005-07-06 | STMicroelectronics S.r.l. | Lese-/-Schreib-Gerät für Massenspeichergerät und Lese-/-Schreibverfahren dafür |
JP2018044811A (ja) * | 2016-09-13 | 2018-03-22 | 株式会社村田製作所 | ピエゾ抵抗型センサ |
CN115541071B (zh) | 2022-12-01 | 2023-06-16 | 无锡芯感智半导体有限公司 | 双极型晶体管式mems压力传感器及其制备方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4422063A (en) * | 1982-04-01 | 1983-12-20 | Pitney Bowes Inc. | Semiconductor strain gauge |
EP0491973B1 (de) * | 1990-12-21 | 1995-11-02 | International Business Machines Corporation | Integriertes Rastertunnelmikroskop mit pneumatischer und elektrostatischer Steuerung und Verfahren zum Herstellen desselben |
JPH05196458A (ja) * | 1991-01-04 | 1993-08-06 | Univ Leland Stanford Jr | 原子力顕微鏡用ピエゾ抵抗性片持ばり構造体 |
US5444244A (en) * | 1993-06-03 | 1995-08-22 | Park Scientific Instruments Corporation | Piezoresistive cantilever with integral tip for scanning probe microscope |
US5489774A (en) * | 1994-09-20 | 1996-02-06 | The Board Of Trustees Of The Leland Stanford University | Combined atomic force and near field scanning optical microscope with photosensitive cantilever |
US5632841A (en) * | 1995-04-04 | 1997-05-27 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Thin layer composite unimorph ferroelectric driver and sensor |
WO1997009584A1 (en) * | 1995-09-01 | 1997-03-13 | International Business Machines Corporation | Cantilever with integrated deflection sensor |
DE69722702T2 (de) * | 1996-04-18 | 2004-04-29 | Seiko Instruments Inc. | Halbleiterdehnungssensoren mit pn Übergang, Rastersondenmikroskop |
-
1998
- 1998-09-07 JP JP10252972A patent/JPH11304825A/ja active Pending
- 1998-09-30 DE DE69815781T patent/DE69815781T2/de not_active Expired - Fee Related
- 1998-09-30 EP EP98307954A patent/EP0905475B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE69815781T2 (de) | 2004-02-12 |
EP0905475A1 (de) | 1999-03-31 |
EP0905475B1 (de) | 2003-06-25 |
JPH11304825A (ja) | 1999-11-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: SII NANO TECHNOLOGY INC., CHIBA, JP Owner name: IBM CORP., ARMONK, N.Y., US |
|
8339 | Ceased/non-payment of the annual fee |