DE69811739T2 - Thermoelektrische kühlvorrichtung mit dynamischem schalten für die isolierung von wärmetransport - Google Patents

Thermoelektrische kühlvorrichtung mit dynamischem schalten für die isolierung von wärmetransport

Info

Publication number
DE69811739T2
DE69811739T2 DE69811739T DE69811739T DE69811739T2 DE 69811739 T2 DE69811739 T2 DE 69811739T2 DE 69811739 T DE69811739 T DE 69811739T DE 69811739 T DE69811739 T DE 69811739T DE 69811739 T2 DE69811739 T2 DE 69811739T2
Authority
DE
Germany
Prior art keywords
cooling device
heat transport
insulating heat
thermoelectric cooling
dynamic switching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69811739T
Other languages
English (en)
Other versions
DE69811739D1 (de
Inventor
Shyamalindu Ghoshal
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of DE69811739D1 publication Critical patent/DE69811739D1/de
Application granted granted Critical
Publication of DE69811739T2 publication Critical patent/DE69811739T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/38—Cooling arrangements using the Peltier effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/021—Control thereof
    • F25B2321/0212—Control thereof of electric power, current or voltage
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/023—Mounting details thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Control Of Temperature (AREA)
DE69811739T 1997-12-10 1998-11-12 Thermoelektrische kühlvorrichtung mit dynamischem schalten für die isolierung von wärmetransport Expired - Lifetime DE69811739T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/988,621 US5966941A (en) 1997-12-10 1997-12-10 Thermoelectric cooling with dynamic switching to isolate heat transport mechanisms
PCT/GB1998/003412 WO1999030090A1 (en) 1997-12-10 1998-11-12 Thermoelectric cooling apparatus with dynamic switching to isolate heat transport mechanisms

Publications (2)

Publication Number Publication Date
DE69811739D1 DE69811739D1 (de) 2003-04-03
DE69811739T2 true DE69811739T2 (de) 2003-10-23

Family

ID=25534323

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69811739T Expired - Lifetime DE69811739T2 (de) 1997-12-10 1998-11-12 Thermoelektrische kühlvorrichtung mit dynamischem schalten für die isolierung von wärmetransport

Country Status (14)

Country Link
US (1) US5966941A (de)
EP (1) EP1066489B1 (de)
JP (1) JP3672240B2 (de)
KR (1) KR100351650B1 (de)
CN (1) CN1126919C (de)
BR (1) BR9813558A (de)
CZ (1) CZ20002131A3 (de)
DE (1) DE69811739T2 (de)
HK (1) HK1030808A1 (de)
HU (1) HUP0100405A3 (de)
MY (1) MY115607A (de)
PL (1) PL341158A1 (de)
TW (1) TW421984B (de)
WO (1) WO1999030090A1 (de)

Families Citing this family (80)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6161388A (en) * 1998-12-28 2000-12-19 International Business Machines Corporation Enhanced duty cycle design for micro thermoelectromechanical coolers
DE19945434A1 (de) * 1999-09-22 2001-04-05 Infineon Technologies Ag Selektive Kühlung von Teilflächen eines flächigen elektronischen Bauteils
US6222113B1 (en) 1999-12-09 2001-04-24 International Business Machines Corporation Electrically-isolated ultra-thin substrates for thermoelectric coolers
US6282907B1 (en) 1999-12-09 2001-09-04 International Business Machines Corporation Thermoelectric cooling apparatus and method for maximizing energy transport
US6535342B1 (en) 1999-12-09 2003-03-18 International Business Machines Corporation Apparatus, system and method for writing information onto magnetic media field of the invention
US6256996B1 (en) 1999-12-09 2001-07-10 International Business Machines Corporation Nanoscopic thermoelectric coolers
US6614109B2 (en) 2000-02-04 2003-09-02 International Business Machines Corporation Method and apparatus for thermal management of integrated circuits
US6437981B1 (en) 2000-11-30 2002-08-20 Harris Corporation Thermally enhanced microcircuit package and method of forming same
US6608250B2 (en) 2000-12-07 2003-08-19 International Business Machines Corporation Enhanced interface thermoelectric coolers using etched thermoelectric material tips
US6384312B1 (en) 2000-12-07 2002-05-07 International Business Machines Corporation Thermoelectric coolers with enhanced structured interfaces
US6403876B1 (en) 2000-12-07 2002-06-11 International Business Machines Corporation Enhanced interface thermoelectric coolers with all-metal tips
US6467275B1 (en) 2000-12-07 2002-10-22 International Business Machines Corporation Cold point design for efficient thermoelectric coolers
US6588217B2 (en) 2000-12-11 2003-07-08 International Business Machines Corporation Thermoelectric spot coolers for RF and microwave communication integrated circuits
US6597544B2 (en) 2000-12-11 2003-07-22 International Business Machines Corporation Thermoelectric microcoolers for cooling write coils and GMR sensors in magnetic heads for disk drives
US7942010B2 (en) 2001-02-09 2011-05-17 Bsst, Llc Thermoelectric power generating systems utilizing segmented thermoelectric elements
US6539725B2 (en) * 2001-02-09 2003-04-01 Bsst Llc Efficiency thermoelectrics utilizing thermal isolation
US6637210B2 (en) 2001-02-09 2003-10-28 Bsst Llc Thermoelectric transient cooling and heating systems
US7946120B2 (en) 2001-02-09 2011-05-24 Bsst, Llc High capacity thermoelectric temperature control system
US7231772B2 (en) * 2001-02-09 2007-06-19 Bsst Llc. Compact, high-efficiency thermoelectric systems
US6959555B2 (en) * 2001-02-09 2005-11-01 Bsst Llc High power density thermoelectric systems
US6672076B2 (en) 2001-02-09 2004-01-06 Bsst Llc Efficiency thermoelectrics utilizing convective heat flow
US7273981B2 (en) * 2001-02-09 2007-09-25 Bsst, Llc. Thermoelectric power generation systems
US8490412B2 (en) * 2001-08-07 2013-07-23 Bsst, Llc Thermoelectric personal environment appliance
WO2003014634A1 (en) 2001-08-07 2003-02-20 Bsst Llc Thermoelectric personal environment appliance
US6812395B2 (en) 2001-10-24 2004-11-02 Bsst Llc Thermoelectric heterostructure assemblies element
US6712258B2 (en) 2001-12-13 2004-03-30 International Business Machines Corporation Integrated quantum cold point coolers
US20040018729A1 (en) * 2002-02-11 2004-01-29 Ghoshal Uttam Shyamalindu Enhanced interface thermoelectric coolers with all-metal tips
US6494048B1 (en) 2002-04-11 2002-12-17 International Business Machines Corporation Assembly of quantum cold point thermoelectric coolers using magnets
US6588216B1 (en) * 2002-04-19 2003-07-08 International Business Machines Corporation Apparatus and methods for performing switching in magnetic refrigeration systems
WO2004068604A1 (ja) * 2003-01-30 2004-08-12 Matsushita Electric Industrial Co., Ltd. 熱スイッチ素子およびその製造方法
GB2406212B (en) * 2003-09-16 2008-04-23 Agilent Technologies Inc Optoelectronic component with thermoelectric temperature control
US20050150536A1 (en) * 2004-01-13 2005-07-14 Nanocoolers, Inc. Method for forming a monolithic thin-film thermoelectric device including complementary thermoelectric materials
US20050150535A1 (en) * 2004-01-13 2005-07-14 Nanocoolers, Inc. Method for forming a thin-film thermoelectric device including a phonon-blocking thermal conductor
US20050150539A1 (en) * 2004-01-13 2005-07-14 Nanocoolers, Inc. Monolithic thin-film thermoelectric device including complementary thermoelectric materials
US20050150537A1 (en) * 2004-01-13 2005-07-14 Nanocoolers Inc. Thermoelectric devices
US7380586B2 (en) 2004-05-10 2008-06-03 Bsst Llc Climate control system for hybrid vehicles using thermoelectric devices
US20060075758A1 (en) 2004-10-07 2006-04-13 Tigerone Development, Llc; Air-conditioning and heating system utilizing thermo-electric solid state devices
US20060076046A1 (en) * 2004-10-08 2006-04-13 Nanocoolers, Inc. Thermoelectric device structure and apparatus incorporating same
US7743614B2 (en) 2005-04-08 2010-06-29 Bsst Llc Thermoelectric-based heating and cooling system
US7847179B2 (en) 2005-06-06 2010-12-07 Board Of Trustees Of Michigan State University Thermoelectric compositions and process
JP4891318B2 (ja) 2005-06-28 2012-03-07 ビーエスエスティー エルエルシー 中間ループを備えた熱電発電機
US8783397B2 (en) 2005-07-19 2014-07-22 Bsst Llc Energy management system for a hybrid-electric vehicle
US8447234B2 (en) * 2006-01-18 2013-05-21 Qualcomm Incorporated Method and system for powering an electronic device via a wireless link
US9130602B2 (en) 2006-01-18 2015-09-08 Qualcomm Incorporated Method and apparatus for delivering energy to an electrical or electronic device via a wireless link
US7870745B2 (en) * 2006-03-16 2011-01-18 Bsst Llc Thermoelectric device efficiency enhancement using dynamic feedback
US7952015B2 (en) 2006-03-30 2011-05-31 Board Of Trustees Of Michigan State University Pb-Te-compounds doped with tin-antimony-tellurides for thermoelectric generators or peltier arrangements
US20100155018A1 (en) 2008-12-19 2010-06-24 Lakhi Nandlal Goenka Hvac system for a hybrid vehicle
US7779639B2 (en) 2006-08-02 2010-08-24 Bsst Llc HVAC system for hybrid vehicles using thermoelectric devices
US9774086B2 (en) 2007-03-02 2017-09-26 Qualcomm Incorporated Wireless power apparatus and methods
CN101720414B (zh) 2007-05-25 2015-01-21 Bsst有限责任公司 分配式热电加热和冷却的系统和方法
US9124120B2 (en) 2007-06-11 2015-09-01 Qualcomm Incorporated Wireless power system and proximity effects
CN101842962B (zh) 2007-08-09 2014-10-08 高通股份有限公司 增加谐振器的q因数
KR20100063756A (ko) * 2007-09-13 2010-06-11 퀄컴 인코포레이티드 무선 전력 자기 공진기로부터 산출된 전력의 최대화
WO2009039113A1 (en) * 2007-09-17 2009-03-26 Nigel Power, Llc Transmitters and receivers for wireless energy transfer
WO2009049281A2 (en) 2007-10-11 2009-04-16 Nigel Power, Llc Wireless power transfer using magneto mechanical systems
US8629576B2 (en) 2008-03-28 2014-01-14 Qualcomm Incorporated Tuning and gain control in electro-magnetic power systems
US20090277608A1 (en) * 2008-05-07 2009-11-12 Kamins Theodore I Thermal Control Via Adjustable Thermal Links
US8701422B2 (en) 2008-06-03 2014-04-22 Bsst Llc Thermoelectric heat pump
US9447994B2 (en) 2008-10-23 2016-09-20 Gentherm Incorporated Temperature control systems with thermoelectric devices
US20100101239A1 (en) 2008-10-23 2010-04-29 Lagrandeur John Multi-mode hvac system with thermoelectric device
US9555686B2 (en) 2008-10-23 2017-01-31 Gentherm Incorporated Temperature control systems with thermoelectric devices
KR102218137B1 (ko) 2009-05-18 2021-02-22 젠썸 인코포레이티드 열전기 가열 및 냉각 시스템
CN102576232B (zh) 2009-05-18 2015-05-06 Bsst有限责任公司 带有热电装置的温度控制系统
US8193439B2 (en) * 2009-06-23 2012-06-05 Laird Technologies, Inc. Thermoelectric modules and related methods
TWI426219B (zh) * 2010-10-15 2014-02-11 Grand Mate Co Ltd Power supply system and its method for storm type gas appliance
US8904809B2 (en) * 2011-03-17 2014-12-09 The Aerospace Corporation Methods and systems for solid state heat transfer
EP2505913B1 (de) * 2011-03-30 2016-03-23 Nxp B.V. Aktive Wärmeverwaltungsvorrichtung und Wärmeverwaltungsverfahren
WO2012170443A2 (en) 2011-06-06 2012-12-13 Amerigon Incorporated Cartridge-based thermoelectric systems
US9006557B2 (en) 2011-06-06 2015-04-14 Gentherm Incorporated Systems and methods for reducing current and increasing voltage in thermoelectric systems
DE112012002935T5 (de) 2011-07-11 2014-05-15 Gentherm Inc. Auf Thermoelektrik basierendes Wärmemanagement elektrischer Vorrichtungen
US9010409B2 (en) * 2011-11-18 2015-04-21 Palo Alto Research Center Incorporated Thermal switch using moving droplets
US8659903B2 (en) * 2011-12-06 2014-02-25 Palo Alto Research Center Incorporated Heat switch array for thermal hot spot cooling
JP2015524894A (ja) 2012-08-01 2015-08-27 ゲンサーム インコーポレイテッド 高効率熱電発電
JP6637765B2 (ja) 2013-01-30 2020-01-29 ジェンサーム インコーポレイテッドＧｅｎｔｈｅｒｍ Ｉｎｃｏｒｐｏｒａｔｅｄ 熱電ベースの熱管理システム
US9601267B2 (en) 2013-07-03 2017-03-21 Qualcomm Incorporated Wireless power transmitter with a plurality of magnetic oscillators
GB2521354A (en) * 2013-12-17 2015-06-24 Ibm Thermoelectric device
ES2610507B1 (es) * 2017-02-23 2018-02-08 Nabla Thermoelectrics, S.L. Generador termoeléctrico y aparato de calefacción que comprende dicho generador termoeléctrico
US20200035898A1 (en) 2018-07-30 2020-01-30 Gentherm Incorporated Thermoelectric device having circuitry that facilitates manufacture
US11152557B2 (en) 2019-02-20 2021-10-19 Gentherm Incorporated Thermoelectric module with integrated printed circuit board
CN112333978B (zh) * 2020-10-19 2023-06-06 Oppo广东移动通信有限公司 散热组件及电子设备、散热控制方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4304294A (en) * 1978-08-17 1981-12-08 Ford Aerospace & Communications Corp. Thermal energy switch
JPH05168846A (ja) * 1990-10-30 1993-07-02 Nippondenso Co Ltd 除湿装置
US5130276A (en) * 1991-05-16 1992-07-14 Motorola Inc. Method of fabricating surface micromachined structures
JPH0539966A (ja) * 1991-08-07 1993-02-19 Matsushita Electric Ind Co Ltd ヒートポンプデバイス
JP2924369B2 (ja) * 1991-11-20 1999-07-26 松下電器産業株式会社 ヒートポンプデバイス
RU2034207C1 (ru) * 1992-11-05 1995-04-30 Товарищество с ограниченной ответственностью компании "Либрация" Способ охлаждения объекта каскадной термоэлектрической батареей
AU6859294A (en) * 1993-05-25 1994-12-20 Industrial Research Limited A peltier device
US5720171A (en) * 1996-06-11 1998-02-24 Atoma International, Inc. Device for heating and cooling a beverage

Also Published As

Publication number Publication date
JP3672240B2 (ja) 2005-07-20
HK1030808A1 (en) 2001-05-18
MY115607A (en) 2003-07-31
WO1999030090A1 (en) 1999-06-17
KR100351650B1 (ko) 2002-09-05
HUP0100405A2 (hu) 2001-06-28
PL341158A1 (en) 2001-03-26
JP2001526374A (ja) 2001-12-18
CZ20002131A3 (cs) 2001-12-12
EP1066489B1 (de) 2003-02-26
EP1066489A1 (de) 2001-01-10
CN1281545A (zh) 2001-01-24
CN1126919C (zh) 2003-11-05
HUP0100405A3 (en) 2001-08-28
DE69811739D1 (de) 2003-04-03
TW421984B (en) 2001-02-11
US5966941A (en) 1999-10-19
KR20010032740A (ko) 2001-04-25
BR9813558A (pt) 2000-10-10

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