DE69512622D1 - Thermoelektrische Kühleinheit - Google Patents

Thermoelektrische Kühleinheit

Info

Publication number
DE69512622D1
DE69512622D1 DE69512622T DE69512622T DE69512622D1 DE 69512622 D1 DE69512622 D1 DE 69512622D1 DE 69512622 T DE69512622 T DE 69512622T DE 69512622 T DE69512622 T DE 69512622T DE 69512622 D1 DE69512622 D1 DE 69512622D1
Authority
DE
Germany
Prior art keywords
cooling unit
thermoelectric cooling
thermoelectric
unit
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69512622T
Other languages
English (en)
Other versions
DE69512622T2 (de
Inventor
Joseph Eskandari
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xerox Corp
Original Assignee
Xerox Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xerox Corp filed Critical Xerox Corp
Publication of DE69512622D1 publication Critical patent/DE69512622D1/de
Application granted granted Critical
Publication of DE69512622T2 publication Critical patent/DE69512622T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
DE69512622T 1994-12-19 1995-12-19 Thermoelektrische Kühleinheit Expired - Fee Related DE69512622T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/358,494 US5522225A (en) 1994-12-19 1994-12-19 Thermoelectric cooler and temperature sensor subassembly with improved temperature control

Publications (2)

Publication Number Publication Date
DE69512622D1 true DE69512622D1 (de) 1999-11-11
DE69512622T2 DE69512622T2 (de) 2000-04-06

Family

ID=23409877

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69512622T Expired - Fee Related DE69512622T2 (de) 1994-12-19 1995-12-19 Thermoelektrische Kühleinheit

Country Status (4)

Country Link
US (1) US5522225A (de)
EP (1) EP0718934B1 (de)
JP (1) JPH08226723A (de)
DE (1) DE69512622T2 (de)

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JPH10187253A (ja) * 1996-12-27 1998-07-14 Ando Electric Co Ltd 光半導体素子の温度制御装置
JP3926424B2 (ja) * 1997-03-27 2007-06-06 セイコーインスツル株式会社 熱電変換素子
JP3982080B2 (ja) 1997-12-05 2007-09-26 松下電工株式会社 熱電モジュールの製造法と熱電モジュール
JPH1154848A (ja) * 1997-07-29 1999-02-26 Ando Electric Co Ltd 光モジュールの温度制御装置
GB2329756A (en) 1997-09-25 1999-03-31 Univ Bristol Assemblies of light emitting diodes
US5941077A (en) * 1998-12-21 1999-08-24 Safyan; Bernard Chill-hot buffet serving tray
US6250085B1 (en) * 1999-05-26 2001-06-26 Eliahou Tousson Temperature self-regulated integrated circuits and devices
DE29909481U1 (de) * 1999-05-31 1999-09-02 Exima Export Import Gmbh Ausschankanlage für Getränke
DE10022726C2 (de) * 1999-08-10 2003-07-10 Matsushita Electric Works Ltd Thermoelektrisches Modul mit verbessertem Wärmeübertragungsvermögen und Verfahren zum Herstellen desselben
JP3255629B2 (ja) * 1999-11-26 2002-02-12 モリックス株式会社 熱電素子
KR20020019786A (ko) * 2000-09-07 2002-03-13 박호군 온도센서가 일체형으로 부착된 열전 모듈.
KR100387035B1 (ko) * 2001-01-30 2003-06-12 삼성전자주식회사 일체형 열전달모듈을 이용한 광소자 모듈
US6556752B2 (en) * 2001-08-15 2003-04-29 Agility Communications, Inc. Dual thermoelectric cooler optoelectronic package and manufacture process
US6809793B1 (en) 2002-01-16 2004-10-26 Advanced Micro Devices, Inc. System and method to monitor reticle heating
AU2003235489A1 (en) * 2002-05-08 2003-11-11 Tom Mcneil High efficiency solid-state light source and methods of use and manufacture
MXPA05001029A (es) * 2002-07-25 2005-09-12 Jonathan S Dahm Metodo y aparato para utilizar diodos emisores de luz para curacion.
WO2004038759A2 (en) 2002-08-23 2004-05-06 Dahm Jonathan S Method and apparatus for using light emitting diodes
US7524085B2 (en) * 2003-10-31 2009-04-28 Phoseon Technology, Inc. Series wiring of highly reliable light sources
WO2005041632A2 (en) * 2003-10-31 2005-05-12 Phoseon Technology, Inc. Collection optics for led array with offset hemispherical or faceted surfaces
WO2005089477A2 (en) 2004-03-18 2005-09-29 Phoseon Technology, Inc. Direct cooling of leds
EP1735844B1 (de) * 2004-03-18 2019-06-19 Phoseon Technology, Inc. Verwendung eines hochdichten leuchtdioden-arrays mit mikro-reflektoren für aushärtungsverfahren
EP1743384B1 (de) * 2004-03-30 2015-08-05 Phoseon Technology, Inc. Led-gruppe mit led-detektoren auf gruppenbasis
ES2363435T3 (es) * 2004-04-12 2011-08-04 Phoseon Technology, Inc. Matriz led de alta densidad.
TWI302756B (en) * 2004-04-19 2008-11-01 Phoseon Technology Inc Imaging semiconductor structures using solid state illumination
ATE553505T1 (de) 2004-06-15 2012-04-15 Data Cloak Llc Elektro-optische hochleistungs-led-anordnung
KR101288758B1 (ko) * 2004-12-30 2013-07-23 포세온 테크날러지 인코퍼레이티드 산업 공정에서 광원을 사용하는 시스템 및 방법
US20060277924A1 (en) * 2005-06-09 2006-12-14 Robert Platkin Cold hot server
CN100570488C (zh) * 2005-11-21 2009-12-16 中国科学院电工研究所 极紫外光刻掩模台静电卡盘冷却器
US7642527B2 (en) * 2005-12-30 2010-01-05 Phoseon Technology, Inc. Multi-attribute light effects for use in curing and other applications involving photoreactions and processing
US8047686B2 (en) 2006-09-01 2011-11-01 Dahm Jonathan S Multiple light-emitting element heat pipe assembly
JP6049489B2 (ja) * 2013-02-15 2016-12-21 三菱電機株式会社 光源モジュール
US10197519B2 (en) 2013-03-15 2019-02-05 H2Scan Corporation Gas sensing systems and methods
AU2015323433A1 (en) * 2014-09-23 2017-05-18 Maytronics Ltd. Multi parameter swimming pool fluid analysis and regulating method and device
US10951005B2 (en) 2019-07-09 2021-03-16 Applied Optoelectronics, Inc. Techniques for attachment and alignment of optical components on a thermoelectric cooler (TEC) and an optical subassembly implementing same
DE102019217054A1 (de) * 2019-11-06 2021-05-06 Robert Bosch Gmbh Temperierungsvorrichtung
JP2022101219A (ja) * 2020-12-24 2022-07-06 株式会社Kelk 熱電発電モジュール実装基板

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Publication number Priority date Publication date Assignee Title
US3264746A (en) * 1964-04-23 1966-08-09 Edwards High Vacuum Int Ltd Freeze-drying
DE2737345C2 (de) * 1976-08-20 1991-07-25 Canon K.K., Tokio/Tokyo Halbleiterlaser-Vorrichtung mit einem Peltier-Element
BR7804514A (pt) * 1978-07-13 1980-01-22 A Holzhacker Ponta de prova para medidores eletronicos de temperatura
US4399541A (en) * 1981-02-17 1983-08-16 Northern Telecom Limited Light emitting device package having combined heater/cooler
US4460802A (en) * 1982-12-15 1984-07-17 Westinghouse Electric Corporation Radially activated thermocouple assembly
JPS59197186A (ja) * 1983-04-25 1984-11-08 Canon Inc 半導体装置
US4803361A (en) * 1986-05-26 1989-02-07 Hitachi, Ltd. Photoelectric device with optical fiber and laser emitting chip
DE4102524C2 (de) * 1990-01-30 2000-05-25 Citizen Watch Co Ltd Infrarotsensor
JP2959678B2 (ja) * 1990-09-25 1999-10-06 富士通株式会社 半導体レーザモジュール及び該モジュールの製造方法
US5197076A (en) * 1991-11-15 1993-03-23 Davis James G Temperature stabilizable laser apparatus
JPH05243621A (ja) * 1992-02-28 1993-09-21 Hamamatsu Photonics Kk 半導体光検出装置

Also Published As

Publication number Publication date
DE69512622T2 (de) 2000-04-06
EP0718934B1 (de) 1999-10-06
EP0718934A1 (de) 1996-06-26
US5522225A (en) 1996-06-04
JPH08226723A (ja) 1996-09-03

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee