DE9404717U1 - Kühlelement - Google Patents

Kühlelement

Info

Publication number
DE9404717U1
DE9404717U1 DE9404717U DE9404717U DE9404717U1 DE 9404717 U1 DE9404717 U1 DE 9404717U1 DE 9404717 U DE9404717 U DE 9404717U DE 9404717 U DE9404717 U DE 9404717U DE 9404717 U1 DE9404717 U1 DE 9404717U1
Authority
DE
Germany
Prior art keywords
cooling element
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE9404717U
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TBS GmbH
Original Assignee
TBS GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TBS GmbH filed Critical TBS GmbH
Priority to DE9404717U priority Critical patent/DE9404717U1/de
Publication of DE9404717U1 publication Critical patent/DE9404717U1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
DE9404717U 1994-03-22 1994-03-22 Kühlelement Expired - Lifetime DE9404717U1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE9404717U DE9404717U1 (de) 1994-03-22 1994-03-22 Kühlelement

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE9404717U DE9404717U1 (de) 1994-03-22 1994-03-22 Kühlelement

Publications (1)

Publication Number Publication Date
DE9404717U1 true DE9404717U1 (de) 1995-05-04

Family

ID=6906260

Family Applications (1)

Application Number Title Priority Date Filing Date
DE9404717U Expired - Lifetime DE9404717U1 (de) 1994-03-22 1994-03-22 Kühlelement

Country Status (1)

Country Link
DE (1) DE9404717U1 (de)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1189277A1 (de) * 2000-09-15 2002-03-20 Alstom Elektronikschaltungssubstrat und Elektronikmodul damit
FR2814280A1 (fr) * 2000-09-15 2002-03-22 Alstom Substrat pour circuit electronique de puissance et module electronique de puissance utilisant un tel substrat
WO2002025698A2 (de) * 2000-09-19 2002-03-28 Boston Cooltec Corporation Kühlkörper zur kühlung insbesondere elektronischer bauelemente
EP1239515A1 (de) * 2001-03-08 2002-09-11 Alstom Substrat für elektronische Leistungsschaltung und elektronisches Leistungsmodul mit diesem

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1189277A1 (de) * 2000-09-15 2002-03-20 Alstom Elektronikschaltungssubstrat und Elektronikmodul damit
FR2814280A1 (fr) * 2000-09-15 2002-03-22 Alstom Substrat pour circuit electronique de puissance et module electronique de puissance utilisant un tel substrat
WO2002025698A2 (de) * 2000-09-19 2002-03-28 Boston Cooltec Corporation Kühlkörper zur kühlung insbesondere elektronischer bauelemente
WO2002025698A3 (de) * 2000-09-19 2004-03-25 Boston Cooltec Corp Kühlkörper zur kühlung insbesondere elektronischer bauelemente
EP1239515A1 (de) * 2001-03-08 2002-09-11 Alstom Substrat für elektronische Leistungsschaltung und elektronisches Leistungsmodul mit diesem
US6586783B2 (en) 2001-03-08 2003-07-01 Alstom Substrate for an electronic power circuit, and an electronic power module using such a substrate

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