DE29620019U1 - Wärmeableitungsvorrichtung für Halbleiter-Bausteine - Google Patents

Wärmeableitungsvorrichtung für Halbleiter-Bausteine

Info

Publication number
DE29620019U1
DE29620019U1 DE29620019U DE29620019U DE29620019U1 DE 29620019 U1 DE29620019 U1 DE 29620019U1 DE 29620019 U DE29620019 U DE 29620019U DE 29620019 U DE29620019 U DE 29620019U DE 29620019 U1 DE29620019 U1 DE 29620019U1
Authority
DE
Germany
Prior art keywords
heat dissipation
semiconductor devices
dissipation device
semiconductor
devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE29620019U
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitac International Corp
Original Assignee
Mitac International Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitac International Corp filed Critical Mitac International Corp
Publication of DE29620019U1 publication Critical patent/DE29620019U1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S165/00—Heat exchange
    • Y10S165/903—Convection

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE29620019U 1996-07-19 1996-11-18 Wärmeableitungsvorrichtung für Halbleiter-Bausteine Expired - Lifetime DE29620019U1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW085211095U TW313277U (en) 1996-07-19 1996-07-19 Transmission interface bridge device

Publications (1)

Publication Number Publication Date
DE29620019U1 true DE29620019U1 (de) 1997-01-09

Family

ID=21625941

Family Applications (1)

Application Number Title Priority Date Filing Date
DE29620019U Expired - Lifetime DE29620019U1 (de) 1996-07-19 1996-11-18 Wärmeableitungsvorrichtung für Halbleiter-Bausteine

Country Status (3)

Country Link
US (1) US5778970A (de)
DE (1) DE29620019U1 (de)
TW (1) TW313277U (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6130818A (en) * 1999-05-27 2000-10-10 Hamilton Sundstrand Corporation Electronic assembly with fault tolerant cooling
US7124806B1 (en) 2001-12-10 2006-10-24 Ncr Corp. Heat sink for enhanced heat dissipation
US20090065174A1 (en) * 2007-09-10 2009-03-12 Yu-Jen Lai Heat sink for an electrical device and method of manufacturing the same
US10098259B2 (en) * 2015-08-14 2018-10-09 Microsoft Technology Licensing, Llc Heat dissipation in electronics
CN205213228U (zh) * 2015-10-30 2016-05-04 比亚迪股份有限公司 散热器底板以及具有其的散热器和igbt模组
CN113048812A (zh) * 2021-04-25 2021-06-29 珠海格力电器股份有限公司 散热器及制冷设备

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4149218A (en) * 1977-12-30 1979-04-10 International Business Machines Corporation Minimum delay module assembly
US4277816A (en) * 1979-05-29 1981-07-07 International Business Machines Corporation Electronic circuit module cooling
US4296455A (en) * 1979-11-23 1981-10-20 International Business Machines Corporation Slotted heat sinks for high powered air cooled modules
AT384343B (de) * 1985-04-16 1987-10-27 Siemens Ag Oesterreich Gehaeuseanordnung fuer belueftete geraete, vorzugsweise der leistungselektronik
US4674004A (en) * 1986-07-03 1987-06-16 Burroughs Corporation Parallel-flow air system for cooling electronic equipment
JPH0258900A (ja) * 1988-08-25 1990-02-28 Fanuc Ltd 電子機器ユニットの冷却装置
US4953058A (en) * 1989-09-01 1990-08-28 General Dynamics Corporation, Space Systems Div. Modular segment adapted to provide a passively cooled housing for heat generating electronic modules
US5218513A (en) * 1992-08-04 1993-06-08 Digital Equipment Corporation Plenum for air-impingement cooling of electronic components
US5535094A (en) * 1995-04-26 1996-07-09 Intel Corporation Integrated circuit package with an integral heat sink and fan

Also Published As

Publication number Publication date
US5778970A (en) 1998-07-14
TW313277U (en) 1997-08-11

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Legal Events

Date Code Title Description
R207 Utility model specification

Effective date: 19970220

R150 Utility model maintained after payment of first maintenance fee after three years

Effective date: 20000118

R151 Utility model maintained after payment of second maintenance fee after six years

Effective date: 20030110

R152 Utility model maintained after payment of third maintenance fee after eight years

Effective date: 20050124

R071 Expiry of right