DE69820569D1 - Kühlungsgerät - Google Patents

Kühlungsgerät

Info

Publication number
DE69820569D1
DE69820569D1 DE69820569T DE69820569T DE69820569D1 DE 69820569 D1 DE69820569 D1 DE 69820569D1 DE 69820569 T DE69820569 T DE 69820569T DE 69820569 T DE69820569 T DE 69820569T DE 69820569 D1 DE69820569 D1 DE 69820569D1
Authority
DE
Germany
Prior art keywords
cooling device
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69820569T
Other languages
English (en)
Other versions
DE69820569T2 (de
Inventor
Yoshitsugu Torii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Publication of DE69820569D1 publication Critical patent/DE69820569D1/de
Application granted granted Critical
Publication of DE69820569T2 publication Critical patent/DE69820569T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S165/00—Heat exchange
    • Y10S165/908—Fluid jets
DE69820569T 1997-10-31 1998-10-30 Kühlgerät Expired - Fee Related DE69820569T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP9299883A JPH11135973A (ja) 1997-10-31 1997-10-31 冷却装置
JP29988397 1997-10-31

Publications (2)

Publication Number Publication Date
DE69820569D1 true DE69820569D1 (de) 2004-01-29
DE69820569T2 DE69820569T2 (de) 2004-09-23

Family

ID=17878106

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69820569T Expired - Fee Related DE69820569T2 (de) 1997-10-31 1998-10-30 Kühlgerät

Country Status (4)

Country Link
US (1) US6105661A (de)
EP (1) EP0914031B1 (de)
JP (1) JPH11135973A (de)
DE (1) DE69820569T2 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6665185B1 (en) 2002-10-09 2003-12-16 Ltx Corporation Apparatus and method for embedded fluid cooling in printed circuit boards
US8430644B2 (en) * 2005-11-18 2013-04-30 Nuventix, Inc. Synthetic jet ejector for the thermal management of PCI cards
DE102006018709B3 (de) * 2006-04-20 2007-10-11 Nft Nanofiltertechnik Gmbh Wärmetauscher
KR200470868Y1 (ko) * 2012-12-07 2014-01-16 (주)디포그 통신장비 보관용 랙에 구비된 배플플레이트의 구조

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2157094A5 (de) * 1971-10-18 1973-06-01 Thomson Csf
US4226279A (en) * 1978-08-15 1980-10-07 Foster Wheeler Energy Corporation Method of suppressing formation of heat exchange fluid particles into standing waves
US4266602A (en) * 1980-02-21 1981-05-12 Westinghouse Electric Corp. Heat exchanger for cooling electrical power apparatus
US4494171A (en) * 1982-08-24 1985-01-15 Sundstrand Corporation Impingement cooling apparatus for heat liberating device
US4674004A (en) * 1986-07-03 1987-06-16 Burroughs Corporation Parallel-flow air system for cooling electronic equipment
JPS6474798A (en) * 1987-09-16 1989-03-20 Nec Corp Integrated type power amplifier
FR2621376B1 (fr) * 1987-10-01 1989-12-22 Pont A Mousson Garniture d'etancheite pour joints verrouilles telescopiques
JPH01175298A (ja) * 1987-12-28 1989-07-11 Nec Corp 電子回路の冷却構造
JPH0242494A (ja) * 1988-08-02 1990-02-13 Toshiba Corp 音声入力装置
JP2708495B2 (ja) * 1988-09-19 1998-02-04 株式会社日立製作所 半導体冷却装置
JPH031542A (ja) * 1989-05-29 1991-01-08 Matsushita Electric Ind Co Ltd バイポーラトランジスタの製造方法
US5196989A (en) * 1990-04-09 1993-03-23 Trw Inc. Rigid circuit board structure using impingement cooling
JP2811359B2 (ja) * 1990-08-13 1998-10-15 本田技研工業株式会社 バッチ式表面処理ラインにおける緊急退避方法
US5202816A (en) * 1991-05-20 1993-04-13 Dewilde Mark A High density circuit board chassis cooling system
JPH0731028B2 (ja) * 1991-05-24 1995-04-10 株式会社ヒラノテクシード 熱風供給方法、及び放熱装置
JPH05136305A (ja) * 1991-11-08 1993-06-01 Hitachi Ltd 発熱体の冷却装置
CA2088821C (en) * 1992-02-05 1999-09-07 Hironobu Ikeda Cooling structure for integrated circuit
US5428503A (en) * 1992-03-24 1995-06-27 Hitachi, Ltd. Jet cooling apparatus for cooling electronic equipment and computer having the same mounted thereon
KR0160611B1 (ko) * 1992-05-22 1999-01-15 강진구 에어콘의 소음 방지장치
US5592363A (en) * 1992-09-30 1997-01-07 Hitachi, Ltd. Electronic apparatus
JPH08153985A (ja) * 1994-11-28 1996-06-11 Hitachi Ltd 電子装置の局部冷却方式
JPH0964569A (ja) * 1995-08-25 1997-03-07 Hitachi Ltd 電子装置

Also Published As

Publication number Publication date
US6105661A (en) 2000-08-22
EP0914031A3 (de) 1999-09-29
EP0914031A2 (de) 1999-05-06
DE69820569T2 (de) 2004-09-23
EP0914031B1 (de) 2003-12-17
JPH11135973A (ja) 1999-05-21

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee