DE69805399T2 - Integrierte kissen-und bandeinheit für chemisch-mechanisches polieren - Google Patents

Integrierte kissen-und bandeinheit für chemisch-mechanisches polieren

Info

Publication number
DE69805399T2
DE69805399T2 DE69805399T DE69805399T DE69805399T2 DE 69805399 T2 DE69805399 T2 DE 69805399T2 DE 69805399 T DE69805399 T DE 69805399T DE 69805399 T DE69805399 T DE 69805399T DE 69805399 T2 DE69805399 T2 DE 69805399T2
Authority
DE
Germany
Prior art keywords
belt
polishing
disk
integrated
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69805399T
Other languages
German (de)
English (en)
Other versions
DE69805399D1 (de
Inventor
Saket Chadda
Rahul Jairath
C. Krusell
Kamal Mishra
K. Pant
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Application granted granted Critical
Publication of DE69805399D1 publication Critical patent/DE69805399D1/de
Publication of DE69805399T2 publication Critical patent/DE69805399T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/06—Connecting the ends of materials, e.g. for making abrasive belts

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
DE69805399T 1997-02-14 1998-02-11 Integrierte kissen-und bandeinheit für chemisch-mechanisches polieren Expired - Fee Related DE69805399T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/800,373 US6328642B1 (en) 1997-02-14 1997-02-14 Integrated pad and belt for chemical mechanical polishing
PCT/US1998/002690 WO1998035785A1 (en) 1997-02-14 1998-02-11 Integrated pad and belt for chemical mechanical polishing

Publications (2)

Publication Number Publication Date
DE69805399D1 DE69805399D1 (de) 2002-06-20
DE69805399T2 true DE69805399T2 (de) 2002-11-21

Family

ID=25178228

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69805399T Expired - Fee Related DE69805399T2 (de) 1997-02-14 1998-02-11 Integrierte kissen-und bandeinheit für chemisch-mechanisches polieren

Country Status (8)

Country Link
US (3) US6328642B1 (enExample)
EP (1) EP0966338B1 (enExample)
JP (1) JP2001511714A (enExample)
KR (1) KR100506235B1 (enExample)
AU (3) AU6568098A (enExample)
DE (1) DE69805399T2 (enExample)
TW (1) TW363218B (enExample)
WO (3) WO1998035786A1 (enExample)

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US6569004B1 (en) * 1999-12-30 2003-05-27 Lam Research Polishing pad and method of manufacture
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US7670468B2 (en) 2000-02-17 2010-03-02 Applied Materials, Inc. Contact assembly and method for electrochemical mechanical processing
US7125477B2 (en) 2000-02-17 2006-10-24 Applied Materials, Inc. Contacts for electrochemical processing
US7303662B2 (en) 2000-02-17 2007-12-04 Applied Materials, Inc. Contacts for electrochemical processing
US6991528B2 (en) 2000-02-17 2006-01-31 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
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US6962524B2 (en) 2000-02-17 2005-11-08 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7029365B2 (en) 2000-02-17 2006-04-18 Applied Materials Inc. Pad assembly for electrochemical mechanical processing
US7678245B2 (en) 2000-02-17 2010-03-16 Applied Materials, Inc. Method and apparatus for electrochemical mechanical processing
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US7374644B2 (en) 2000-02-17 2008-05-20 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US6979248B2 (en) 2002-05-07 2005-12-27 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7303462B2 (en) 2000-02-17 2007-12-04 Applied Materials, Inc. Edge bead removal by an electro polishing process
US6884153B2 (en) * 2000-02-17 2005-04-26 Applied Materials, Inc. Apparatus for electrochemical processing
US7066800B2 (en) 2000-02-17 2006-06-27 Applied Materials Inc. Conductive polishing article for electrochemical mechanical polishing
US20030213703A1 (en) * 2002-05-16 2003-11-20 Applied Materials, Inc. Method and apparatus for substrate polishing
US6706139B1 (en) * 2000-04-19 2004-03-16 Micron Technology, Inc. Method and apparatus for cleaning a web-based chemical mechanical planarization system
US6495464B1 (en) 2000-06-30 2002-12-17 Lam Research Corporation Method and apparatus for fixed abrasive substrate preparation and use in a cluster CMP tool
US6503129B1 (en) 2000-10-06 2003-01-07 Lam Research Corporation Activated slurry CMP system and methods for implementing the same
US6561889B1 (en) * 2000-12-27 2003-05-13 Lam Research Corporation Methods for making reinforced wafer polishing pads and apparatuses implementing the same
JP2004524676A (ja) * 2000-12-27 2004-08-12 ラム　リサーチ　コーポレーション 強化ウエハ研磨パッドの製造方法および同パッドを実装した装置
US6572463B1 (en) 2000-12-27 2003-06-03 Lam Research Corp. Methods for making reinforced wafer polishing pads utilizing direct casting and apparatuses implementing the same
US6609961B2 (en) 2001-01-09 2003-08-26 Lam Research Corporation Chemical mechanical planarization belt assembly and method of assembly
US6991512B2 (en) * 2001-03-30 2006-01-31 Lam Research Corporation Apparatus for edge polishing uniformity control
US7137879B2 (en) 2001-04-24 2006-11-21 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7344432B2 (en) 2001-04-24 2008-03-18 Applied Materials, Inc. Conductive pad with ion exchange membrane for electrochemical mechanical polishing
US8602851B2 (en) * 2003-06-09 2013-12-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Controlled penetration subpad
US6887338B1 (en) * 2002-06-28 2005-05-03 Lam Research Corporation 300 mm platen and belt configuration
US6752898B1 (en) * 2002-12-20 2004-06-22 Lam Research Corporation Method and apparatus for an air bearing platen with raised topography
US6843444B2 (en) * 2002-12-24 2005-01-18 The Goodyear Tire & Rubber Company Tracking means for precision cord length on two drums
US7435161B2 (en) * 2003-06-17 2008-10-14 Cabot Microelectronics Corporation Multi-layer polishing pad material for CMP
US6884156B2 (en) * 2003-06-17 2005-04-26 Cabot Microelectronics Corporation Multi-layer polishing pad material for CMP
US7018273B1 (en) 2003-06-27 2006-03-28 Lam Research Corporation Platen with diaphragm and method for optimizing wafer polishing
US7654885B2 (en) * 2003-10-03 2010-02-02 Applied Materials, Inc. Multi-layer polishing pad
US20050173259A1 (en) * 2004-02-06 2005-08-11 Applied Materials, Inc. Endpoint system for electro-chemical mechanical polishing
US8066552B2 (en) 2003-10-03 2011-11-29 Applied Materials, Inc. Multi-layer polishing pad for low-pressure polishing
US7186164B2 (en) 2003-12-03 2007-03-06 Applied Materials, Inc. Processing pad assembly with zone control
US7419421B2 (en) * 2004-05-04 2008-09-02 Seagate Technology Llc Slider having rounded corners and edges, and method for producing the same
US8075372B2 (en) * 2004-09-01 2011-12-13 Cabot Microelectronics Corporation Polishing pad with microporous regions
US7084064B2 (en) 2004-09-14 2006-08-01 Applied Materials, Inc. Full sequence metal and barrier layer electrochemical mechanical processing
US7520968B2 (en) 2004-10-05 2009-04-21 Applied Materials, Inc. Conductive pad design modification for better wafer-pad contact
US7427340B2 (en) 2005-04-08 2008-09-23 Applied Materials, Inc. Conductive pad
US20070197147A1 (en) * 2006-02-15 2007-08-23 Applied Materials, Inc. Polishing system with spiral-grooved subpad
US9108293B2 (en) * 2012-07-30 2015-08-18 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method for chemical mechanical polishing layer pretexturing
JP7317532B2 (ja) * 2019-03-19 2023-07-31 キオクシア株式会社 研磨装置及び研磨方法
KR102753436B1 (ko) 2019-10-22 2025-01-13 삼성디스플레이 주식회사 연마 헤드 유닛, 이를 포함하는 기판 처리 장치, 그리고 이를 이용하는 기판 처리 방법

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Also Published As

Publication number Publication date
US20050118936A1 (en) 2005-06-02
AU6159198A (en) 1998-09-08
US6656025B2 (en) 2003-12-02
US6328642B1 (en) 2001-12-11
TW363218B (en) 1999-07-01
EP0966338A1 (en) 1999-12-29
AU6472498A (en) 1998-09-08
KR100506235B1 (ko) 2005-08-05
EP0966338B1 (en) 2002-05-15
DE69805399D1 (de) 2002-06-20
WO1998035785A1 (en) 1998-08-20
KR20000071015A (ko) 2000-11-25
JP2001511714A (ja) 2001-08-14
WO1998035786A1 (en) 1998-08-20
US20020031988A1 (en) 2002-03-14
AU6568098A (en) 1998-09-08
WO1998036442A2 (en) 1998-08-20

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Legal Events

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8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee