KR100506235B1 - 화학적, 기계적 폴리싱을 위한 통합된 패드와 벨트 - Google Patents

화학적, 기계적 폴리싱을 위한 통합된 패드와 벨트 Download PDF

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Publication number
KR100506235B1
KR100506235B1 KR10-1999-7007281A KR19997007281A KR100506235B1 KR 100506235 B1 KR100506235 B1 KR 100506235B1 KR 19997007281 A KR19997007281 A KR 19997007281A KR 100506235 B1 KR100506235 B1 KR 100506235B1
Authority
KR
South Korea
Prior art keywords
belt
polishing
pad
integrated
semiconductor wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR10-1999-7007281A
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English (en)
Korean (ko)
Other versions
KR20000071015A (ko
Inventor
애닐케이. 팬트
라훌 재라쓰
카말 미쉬라
사켓 차다
윌버씨. 크루셀
Original Assignee
램 리서치 코포레이션
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Publication date
Application filed by 램 리서치 코포레이션 filed Critical 램 리서치 코포레이션
Publication of KR20000071015A publication Critical patent/KR20000071015A/ko
Application granted granted Critical
Publication of KR100506235B1 publication Critical patent/KR100506235B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/06—Connecting the ends of materials, e.g. for making abrasive belts

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
KR10-1999-7007281A 1997-02-14 1998-02-11 화학적, 기계적 폴리싱을 위한 통합된 패드와 벨트 Expired - Fee Related KR100506235B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US08/800,373 1997-02-14
US08/800,373 US6328642B1 (en) 1997-02-14 1997-02-14 Integrated pad and belt for chemical mechanical polishing
US8/800,373 1997-02-14
PCT/US1998/002690 WO1998035785A1 (en) 1997-02-14 1998-02-11 Integrated pad and belt for chemical mechanical polishing

Publications (2)

Publication Number Publication Date
KR20000071015A KR20000071015A (ko) 2000-11-25
KR100506235B1 true KR100506235B1 (ko) 2005-08-05

Family

ID=25178228

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-1999-7007281A Expired - Fee Related KR100506235B1 (ko) 1997-02-14 1998-02-11 화학적, 기계적 폴리싱을 위한 통합된 패드와 벨트

Country Status (8)

Country Link
US (3) US6328642B1 (enExample)
EP (1) EP0966338B1 (enExample)
JP (1) JP2001511714A (enExample)
KR (1) KR100506235B1 (enExample)
AU (3) AU6568098A (enExample)
DE (1) DE69805399T2 (enExample)
TW (1) TW363218B (enExample)
WO (3) WO1998035786A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100882045B1 (ko) * 2006-02-15 2009-02-09 어플라이드 머티어리얼스, 인코포레이티드 그루브형 서브패드를 구비한 폴리싱 장치
US11919122B2 (en) 2019-10-22 2024-03-05 Samsung Display Co., Ltd. Polishing head, substrate processing apparatus including the same and processing method of substrate using the same

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US6561889B1 (en) * 2000-12-27 2003-05-13 Lam Research Corporation Methods for making reinforced wafer polishing pads and apparatuses implementing the same
JP2004524676A (ja) * 2000-12-27 2004-08-12 ラム　リサーチ　コーポレーション 強化ウエハ研磨パッドの製造方法および同パッドを実装した装置
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US6991512B2 (en) * 2001-03-30 2006-01-31 Lam Research Corporation Apparatus for edge polishing uniformity control
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US8602851B2 (en) * 2003-06-09 2013-12-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Controlled penetration subpad
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US6843444B2 (en) * 2002-12-24 2005-01-18 The Goodyear Tire & Rubber Company Tracking means for precision cord length on two drums
US7435161B2 (en) * 2003-06-17 2008-10-14 Cabot Microelectronics Corporation Multi-layer polishing pad material for CMP
US6884156B2 (en) * 2003-06-17 2005-04-26 Cabot Microelectronics Corporation Multi-layer polishing pad material for CMP
US7018273B1 (en) 2003-06-27 2006-03-28 Lam Research Corporation Platen with diaphragm and method for optimizing wafer polishing
US7654885B2 (en) * 2003-10-03 2010-02-02 Applied Materials, Inc. Multi-layer polishing pad
US20050173259A1 (en) * 2004-02-06 2005-08-11 Applied Materials, Inc. Endpoint system for electro-chemical mechanical polishing
US8066552B2 (en) 2003-10-03 2011-11-29 Applied Materials, Inc. Multi-layer polishing pad for low-pressure polishing
US7186164B2 (en) 2003-12-03 2007-03-06 Applied Materials, Inc. Processing pad assembly with zone control
US7419421B2 (en) * 2004-05-04 2008-09-02 Seagate Technology Llc Slider having rounded corners and edges, and method for producing the same
US8075372B2 (en) * 2004-09-01 2011-12-13 Cabot Microelectronics Corporation Polishing pad with microporous regions
US7084064B2 (en) 2004-09-14 2006-08-01 Applied Materials, Inc. Full sequence metal and barrier layer electrochemical mechanical processing
US7520968B2 (en) 2004-10-05 2009-04-21 Applied Materials, Inc. Conductive pad design modification for better wafer-pad contact
US7427340B2 (en) 2005-04-08 2008-09-23 Applied Materials, Inc. Conductive pad
US9108293B2 (en) * 2012-07-30 2015-08-18 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method for chemical mechanical polishing layer pretexturing
JP7317532B2 (ja) * 2019-03-19 2023-07-31 キオクシア株式会社 研磨装置及び研磨方法

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100882045B1 (ko) * 2006-02-15 2009-02-09 어플라이드 머티어리얼스, 인코포레이티드 그루브형 서브패드를 구비한 폴리싱 장치
US11919122B2 (en) 2019-10-22 2024-03-05 Samsung Display Co., Ltd. Polishing head, substrate processing apparatus including the same and processing method of substrate using the same

Also Published As

Publication number Publication date
DE69805399T2 (de) 2002-11-21
US20050118936A1 (en) 2005-06-02
AU6159198A (en) 1998-09-08
US6656025B2 (en) 2003-12-02
US6328642B1 (en) 2001-12-11
TW363218B (en) 1999-07-01
EP0966338A1 (en) 1999-12-29
AU6472498A (en) 1998-09-08
EP0966338B1 (en) 2002-05-15
DE69805399D1 (de) 2002-06-20
WO1998035785A1 (en) 1998-08-20
KR20000071015A (ko) 2000-11-25
JP2001511714A (ja) 2001-08-14
WO1998035786A1 (en) 1998-08-20
US20020031988A1 (en) 2002-03-14
AU6568098A (en) 1998-09-08
WO1998036442A2 (en) 1998-08-20

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