DE69728805T2 - Integrierte Schaltung mit Gate-Array-Verbindungen, die über das Speichergebiet geführt werden - Google Patents
Integrierte Schaltung mit Gate-Array-Verbindungen, die über das Speichergebiet geführt werden Download PDFInfo
- Publication number
- DE69728805T2 DE69728805T2 DE69728805T DE69728805T DE69728805T2 DE 69728805 T2 DE69728805 T2 DE 69728805T2 DE 69728805 T DE69728805 T DE 69728805T DE 69728805 T DE69728805 T DE 69728805T DE 69728805 T2 DE69728805 T2 DE 69728805T2
- Authority
- DE
- Germany
- Prior art keywords
- integrated circuit
- storage area
- gate array
- connections routed
- array connections
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/5222—Capacitive arrangements or effects of, or between wiring layers
- H01L23/5225—Shielding layers formed together with wiring layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
- H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
- H01L27/118—Masterslice integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8034635A JPH09232435A (ja) | 1996-02-22 | 1996-02-22 | 半導体集積回路 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69728805D1 DE69728805D1 (de) | 2004-06-03 |
DE69728805T2 true DE69728805T2 (de) | 2005-04-21 |
Family
ID=12419876
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69728805T Expired - Fee Related DE69728805T2 (de) | 1996-02-22 | 1997-02-13 | Integrierte Schaltung mit Gate-Array-Verbindungen, die über das Speichergebiet geführt werden |
Country Status (7)
Country | Link |
---|---|
US (1) | US5886371A (de) |
EP (1) | EP0791963B1 (de) |
JP (1) | JPH09232435A (de) |
KR (1) | KR100336155B1 (de) |
CN (1) | CN1085410C (de) |
DE (1) | DE69728805T2 (de) |
TW (1) | TW354420B (de) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6786420B1 (en) | 1997-07-15 | 2004-09-07 | Silverbrook Research Pty. Ltd. | Data distribution mechanism in the form of ink dots on cards |
TW399319B (en) * | 1997-03-19 | 2000-07-21 | Hitachi Ltd | Semiconductor device |
US6547364B2 (en) * | 1997-07-12 | 2003-04-15 | Silverbrook Research Pty Ltd | Printing cartridge with an integrated circuit device |
US6618117B2 (en) | 1997-07-12 | 2003-09-09 | Silverbrook Research Pty Ltd | Image sensing apparatus including a microcontroller |
US6624848B1 (en) | 1997-07-15 | 2003-09-23 | Silverbrook Research Pty Ltd | Cascading image modification using multiple digital cameras incorporating image processing |
US6690419B1 (en) | 1997-07-15 | 2004-02-10 | Silverbrook Research Pty Ltd | Utilising eye detection methods for image processing in a digital image camera |
AUPO802797A0 (en) | 1997-07-15 | 1997-08-07 | Silverbrook Research Pty Ltd | Image processing method and apparatus (ART54) |
AUPO850597A0 (en) | 1997-08-11 | 1997-09-04 | Silverbrook Research Pty Ltd | Image processing method and apparatus (art01a) |
US6948794B2 (en) | 1997-07-15 | 2005-09-27 | Silverbrook Reserach Pty Ltd | Printhead re-capping assembly for a print and demand digital camera system |
US6879341B1 (en) | 1997-07-15 | 2005-04-12 | Silverbrook Research Pty Ltd | Digital camera system containing a VLIW vector processor |
US6985207B2 (en) | 1997-07-15 | 2006-01-10 | Silverbrook Research Pty Ltd | Photographic prints having magnetically recordable media |
US7110024B1 (en) | 1997-07-15 | 2006-09-19 | Silverbrook Research Pty Ltd | Digital camera system having motion deblurring means |
US6166403A (en) * | 1997-11-12 | 2000-12-26 | Lsi Logic Corporation | Integrated circuit having embedded memory with electromagnetic shield |
AUPP702098A0 (en) | 1998-11-09 | 1998-12-03 | Silverbrook Research Pty Ltd | Image creation method and apparatus (ART73) |
AUPQ056099A0 (en) | 1999-05-25 | 1999-06-17 | Silverbrook Research Pty Ltd | A method and apparatus (pprint01) |
US6492736B1 (en) * | 2001-03-14 | 2002-12-10 | Lsi Logic Corporation | Power mesh bridge |
JP2003273231A (ja) * | 2002-03-19 | 2003-09-26 | Fujitsu Ltd | 半導体集積回路のシールド構造 |
JP2004031389A (ja) * | 2002-06-21 | 2004-01-29 | Fujitsu Ltd | 半導体回路設計方法、半導体回路設計装置、プログラム及び半導体装置 |
JP4521611B2 (ja) * | 2004-04-09 | 2010-08-11 | ルネサスエレクトロニクス株式会社 | 半導体集積回路装置の製造方法 |
JP5571547B2 (ja) * | 2007-04-09 | 2014-08-13 | プレジデント アンド フェローズ オブ ハーバード カレッジ | 銅の相互接続体のための窒化コバルト層及びそれらを形成する方法 |
US8530880B2 (en) * | 2009-07-27 | 2013-09-10 | Hewlett-Packard Development Company, L.P. | Reconfigurable multilayer circuit |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6197849A (ja) * | 1984-10-18 | 1986-05-16 | Fujitsu Ltd | ゲ−トアレイlsi装置 |
KR920005863B1 (ko) * | 1988-08-12 | 1992-07-23 | 산요덴끼 가부시끼가이샤 | 반도체 집적회로 |
JPH02106968A (ja) * | 1988-10-17 | 1990-04-19 | Hitachi Ltd | 半導体集積回路装置及びその形成方法 |
US5321280A (en) * | 1990-09-13 | 1994-06-14 | Nec Corporation | Composite semiconductor integrated circuit device |
-
1996
- 1996-02-22 JP JP8034635A patent/JPH09232435A/ja active Pending
-
1997
- 1997-02-12 TW TW086101562A patent/TW354420B/zh active
- 1997-02-13 DE DE69728805T patent/DE69728805T2/de not_active Expired - Fee Related
- 1997-02-13 EP EP97102404A patent/EP0791963B1/de not_active Expired - Lifetime
- 1997-02-21 US US08/804,258 patent/US5886371A/en not_active Expired - Fee Related
- 1997-02-21 KR KR1019970005371A patent/KR100336155B1/ko not_active IP Right Cessation
- 1997-02-22 CN CN97109977A patent/CN1085410C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0791963B1 (de) | 2004-04-28 |
TW354420B (en) | 1999-03-11 |
US5886371A (en) | 1999-03-23 |
KR970063679A (ko) | 1997-09-12 |
JPH09232435A (ja) | 1997-09-05 |
CN1169035A (zh) | 1997-12-31 |
DE69728805D1 (de) | 2004-06-03 |
CN1085410C (zh) | 2002-05-22 |
EP0791963A1 (de) | 1997-08-27 |
KR100336155B1 (ko) | 2002-09-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8328 | Change in the person/name/address of the agent |
Representative=s name: PUSCHMANN & BORCHERT, 82041 OBERHACHING |
|
8339 | Ceased/non-payment of the annual fee |