DE69634312D1 - Trägerstruktur für Plattenspeicher - Google Patents

Trägerstruktur für Plattenspeicher

Info

Publication number
DE69634312D1
DE69634312D1 DE69634312T DE69634312T DE69634312D1 DE 69634312 D1 DE69634312 D1 DE 69634312D1 DE 69634312 T DE69634312 T DE 69634312T DE 69634312 T DE69634312 T DE 69634312T DE 69634312 D1 DE69634312 D1 DE 69634312D1
Authority
DE
Germany
Prior art keywords
disk storage
carrier structure
carrier
disk
storage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69634312T
Other languages
English (en)
Other versions
DE69634312T2 (de
Inventor
Kazuhiro Suzuki
Tsuneyori Ino
Katsuaki Ishida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP28617995A external-priority patent/JPH09128912A/ja
Priority claimed from JP7286085A external-priority patent/JP3041761B2/ja
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Publication of DE69634312D1 publication Critical patent/DE69634312D1/de
Application granted granted Critical
Publication of DE69634312T2 publication Critical patent/DE69634312T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B21/00—Head arrangements not specific to the method of recording or reproducing
    • G11B21/02—Driving or moving of heads
    • G11B21/08—Track changing or selecting during transducing operation
    • G11B21/081—Access to indexed tracks or parts of continuous track
    • G11B21/083—Access to indexed tracks or parts of continuous track on discs
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
    • G11B5/4846—Constructional details of the electrical connection between arm and support
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/54—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed with provision for moving the head into or out of its operative position or across tracks
    • G11B5/55—Track change, selection or acquisition by displacement of the head
    • G11B5/5521—Track change, selection or acquisition by displacement of the head across disk tracks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48464—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/056—Folded around rigid support or component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
DE69634312T 1995-11-02 1996-11-01 Trägerstruktur für Plattenspeicher Expired - Fee Related DE69634312T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP28617995A JPH09128912A (ja) 1995-11-02 1995-11-02 ディスク装置のアクチュエータ構造
JP28608595 1995-11-02
JP28617995 1995-11-02
JP7286085A JP3041761B2 (ja) 1995-11-02 1995-11-02 ディスク装置のキャリッジ構造

Publications (2)

Publication Number Publication Date
DE69634312D1 true DE69634312D1 (de) 2005-03-10
DE69634312T2 DE69634312T2 (de) 2005-07-28

Family

ID=26556163

Family Applications (2)

Application Number Title Priority Date Filing Date
DE69634312T Expired - Fee Related DE69634312T2 (de) 1995-11-02 1996-11-01 Trägerstruktur für Plattenspeicher
DE69626598T Expired - Fee Related DE69626598T2 (de) 1995-11-02 1996-11-01 Trägerstruktur für Plattenspeicher

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE69626598T Expired - Fee Related DE69626598T2 (de) 1995-11-02 1996-11-01 Trägerstruktur für Plattenspeicher

Country Status (4)

Country Link
US (2) US5923501A (de)
EP (2) EP0772195B1 (de)
KR (1) KR100297349B1 (de)
DE (2) DE69634312T2 (de)

Families Citing this family (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09128916A (ja) * 1995-10-31 1997-05-16 Fujitsu Ltd ディスク装置
GB2363666B (en) * 1998-07-13 2003-02-26 Seagate Technology Llc Flex support snubber
JP2000228006A (ja) 1999-02-05 2000-08-15 Alps Electric Co Ltd ボンディングパットおよびバンプを用いた接合体、および磁気ヘッド装置
JP4119572B2 (ja) * 1999-06-29 2008-07-16 インターナショナル・ビジネス・マシーンズ・コーポレーション フレックス・ケーブル・アセンブリ（ｆｃａ）、ヘッド・サスペンション・アセンブリ（ｈｓａ）、ハード・ディスク・ドライブ（ｈｄｄ）、これらの製造方法及びこれらの分解方法
JP3736787B2 (ja) * 1999-12-22 2006-01-18 Ｔｄｋ株式会社 磁気ディスク装置
JP2001184618A (ja) * 1999-12-24 2001-07-06 Hitachi Ltd 磁気ディスク装置
US7092214B2 (en) * 2001-08-28 2006-08-15 Sae Magnetics (H.K.) Ltd. Wireless suspension design to accommodate multiple drive designs
US6628185B2 (en) 2001-09-14 2003-09-30 Square D Company Blade assembly for a circuit breaker
US6774749B2 (en) * 2001-09-19 2004-08-10 Square D Company Trip cross bar and trip armature assembly for a circuit breaker
US6842325B2 (en) 2001-09-19 2005-01-11 Square D Company Flexible circuit adhered to metal frame of device
US6624373B2 (en) 2001-09-19 2003-09-23 Square D Company Arc stack assembly for a circuit breaker
JP2003173635A (ja) * 2001-12-04 2003-06-20 Seiko Instruments Inc Ｆｐｃ配置装置
US6937442B2 (en) * 2002-01-24 2005-08-30 Seagate Technology Llc Contacting point damping method between flex circuit and pivot housing
JP3908626B2 (ja) 2002-08-02 2007-04-25 富士通株式会社 記録媒体駆動装置
US7542231B2 (en) 2002-08-20 2009-06-02 Seagate Technology Disc drive apparatus having drive electronics top mounted on flexible printed circuit board
US6934126B1 (en) * 2002-12-23 2005-08-23 Western Digital Technologies, Inc. Disk drive including a base assembly having a flex-to-board edge connector
KR20040099634A (ko) * 2003-05-19 2004-12-02 엘지전자 주식회사 플렉시블 케이블 및 이를 구비한 디스크 드라이브
JP4060810B2 (ja) * 2004-02-27 2008-03-12 富士通株式会社 記録ディスク駆動装置並びにフレキシブルプリント基板ユニットおよびフレキシブルプリント基板
US20050195530A1 (en) * 2004-03-05 2005-09-08 Macpherson Aaron S. Stacked actuator arm assembly with printed circuit card mount
US7362545B2 (en) * 2004-08-23 2008-04-22 Sae Magnetics (H.K.) Ltd. Head stack assembly and manufacturing method thereof, and disk drive unit using the same
JP4847005B2 (ja) * 2004-11-30 2011-12-28 株式会社日立メディアエレクトロニクス 光ピックアップ
JP4398855B2 (ja) * 2004-12-27 2010-01-13 株式会社東芝 情報記録再生装置およびそれに用いられる回路装置
KR100612886B1 (ko) * 2005-01-04 2006-08-14 삼성전자주식회사 하드 디스크 드라이브의 유연성 인쇄 회로의 임피던스불연속 감소 구조 및 그 임피던스 불연속 감소 방법
US7271345B2 (en) * 2005-06-01 2007-09-18 Seagate Technology Llc Method and apparatus for attenuating flexible circuit resonance
US7522382B1 (en) * 2005-08-22 2009-04-21 Western Digital (Fremont), Llc Head stack assembly with interleaved flexure tail bond pad rows
US7733600B2 (en) * 2005-09-30 2010-06-08 Tdk Corporation Hard disk drive and wireless data terminal using the same
KR100660884B1 (ko) * 2005-10-31 2006-12-26 삼성전자주식회사 구동 효율 및 탐색 특성이 향상된 하드 디스크 드라이브
DE202006004045U1 (de) * 2006-03-15 2007-08-02 Synthes Gmbh Chirurgisches Schneidwerkzeug
US20080105963A1 (en) * 2006-07-28 2008-05-08 Tessera, Inc. Stackable electronic device assembly
JP2008037075A (ja) * 2006-08-10 2008-02-21 Brother Ind Ltd 記録装置
US20080088978A1 (en) * 2006-10-11 2008-04-17 Nitto Denko Corporation Heat transfer for a hard-drive wire-bond pre-amp
JP2008159096A (ja) * 2006-12-20 2008-07-10 Hitachi Global Storage Technologies Netherlands Bv 磁気ディスク装置
JPWO2008111176A1 (ja) * 2007-03-13 2010-06-24 東芝ストレージデバイス株式会社 記憶媒体駆動装置およびプリント基板ユニット
US8144431B2 (en) * 2007-04-04 2012-03-27 Hitachi Global Storage Technologies, Netherlands B.V. Flex cable assembly for vibration reduction in HDD applications
US8144432B2 (en) * 2007-11-30 2012-03-27 Seagate Technology Llc Sinking heat from an integrated circuit to an actuator
JP2009238271A (ja) * 2008-03-26 2009-10-15 Fujitsu Ltd ディスク装置
US8111485B2 (en) * 2008-11-19 2012-02-07 Seagate Technology Llc Arm mounted shock sensor and flexible circuit routing
US9520159B2 (en) 2012-01-18 2016-12-13 Echostreams Innovative Solutions, Llc Apparatus for storing solid state drives or hard disk drives
WO2013149208A1 (en) * 2012-03-30 2013-10-03 Echostreams Innovative Solutions, Llc Apparatus for storing solid state drives or hard disk drives
CN104658552A (zh) * 2013-11-19 2015-05-27 株式会社东芝 Fpc组件及盘驱动器
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EP1246184A3 (de) 2002-10-16
DE69626598T2 (de) 2004-03-25
EP0772195B1 (de) 2003-03-12
EP0772195A2 (de) 1997-05-07
EP1246184B1 (de) 2005-02-02
US5923501A (en) 1999-07-13
EP1246184A2 (de) 2002-10-02
DE69626598D1 (de) 2003-04-17
DE69634312T2 (de) 2005-07-28
KR970029418A (ko) 1997-06-26
KR100297349B1 (ko) 2001-10-24
US5995321A (en) 1999-11-30
EP0772195A3 (de) 1998-01-07

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