DE69631006D1 - Vorrichtung zur Wärmeübertragung - Google Patents

Vorrichtung zur Wärmeübertragung

Info

Publication number
DE69631006D1
DE69631006D1 DE69631006T DE69631006T DE69631006D1 DE 69631006 D1 DE69631006 D1 DE 69631006D1 DE 69631006 T DE69631006 T DE 69631006T DE 69631006 T DE69631006 T DE 69631006T DE 69631006 D1 DE69631006 D1 DE 69631006D1
Authority
DE
Germany
Prior art keywords
heat transfer
transfer device
heat
transfer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69631006T
Other languages
English (en)
Other versions
DE69631006T2 (de
Inventor
Rafael E Aguilera
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NCR International Inc
Original Assignee
NCR International Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NCR International Inc filed Critical NCR International Inc
Publication of DE69631006D1 publication Critical patent/DE69631006D1/de
Application granted granted Critical
Publication of DE69631006T2 publication Critical patent/DE69631006T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/133382Heating or cooling of liquid crystal cells other than for activation, e.g. circuits or arrangements for temperature control, stabilisation or uniform distribution over the cell
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/025Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being corrugated, plate-like elements
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • G06F1/203Cooling means for portable computers, e.g. for laptops
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029Heat sinks
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20Indexing scheme relating to G06F1/20
    • G06F2200/201Cooling arrangements using cooling fluid

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Sustainable Development (AREA)
  • Optics & Photonics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DE69631006T 1995-10-02 1996-09-26 Vorrichtung zur Wärmeübertragung Expired - Lifetime DE69631006T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US538104 1995-10-02
US08/538,104 US5606341A (en) 1995-10-02 1995-10-02 Passive CPU cooling and LCD heating for a laptop computer

Publications (2)

Publication Number Publication Date
DE69631006D1 true DE69631006D1 (de) 2004-01-22
DE69631006T2 DE69631006T2 (de) 2004-08-12

Family

ID=24145513

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69631006T Expired - Lifetime DE69631006T2 (de) 1995-10-02 1996-09-26 Vorrichtung zur Wärmeübertragung

Country Status (4)

Country Link
US (1) US5606341A (de)
EP (1) EP0767415B1 (de)
JP (1) JPH09113158A (de)
DE (1) DE69631006T2 (de)

Families Citing this family (132)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6181555B1 (en) 1995-09-29 2001-01-30 Intel Corporation Cooling system for integrated circuit chips in a portable computer
TW326087B (en) * 1995-09-29 1998-02-01 Intel Corp Cooling system for computer systems
US5751548A (en) * 1996-05-13 1998-05-12 International Business Machines Corporation Docking station for a portable computer providing rotational movement of the computer's viewable screen in three different planes
US5757615A (en) * 1996-07-01 1998-05-26 Compaq Computer Corporation Liquid cooled computer apparatus and associated methods
US5774333A (en) 1996-08-23 1998-06-30 Speculative Incorporated Thermally efficient portable computer incorporating deploying CPU module
US6243261B1 (en) 1996-08-23 2001-06-05 Speculative Incorporated Thermally efficient computer incorporating deploying CPU module
US6288895B1 (en) * 1996-09-30 2001-09-11 Intel Corporation Apparatus for cooling electronic components within a computer system enclosure
US6459576B1 (en) 1996-09-30 2002-10-01 Intel Corporation Fan based heat exchanger
US5748269A (en) * 1996-11-21 1998-05-05 Westinghouse Air Brake Company Environmentally-sealed, convectively-cooled active matrix liquid crystal display (LCD)
KR100242834B1 (ko) * 1996-12-04 2000-02-01 윤종용 Lcd 모니터
US5969944A (en) * 1996-12-31 1999-10-19 Intel Corporation Method and apparatus for mounting a very large scale integration (VLSI) chip package to a computer chasis for cooling
US6137688A (en) 1996-12-31 2000-10-24 Intel Corporation Apparatus for retrofit mounting a VLSI chip to a computer chassis for current supply
DE29704885U1 (de) * 1997-03-19 1998-04-30 Siemens AG, 80333 München Anordnung zur Abführung von Wärme einer in einem Gehäuse angeordneten Wärmequelle
JP3518242B2 (ja) * 1997-04-14 2004-04-12 株式会社日立製作所 電子装置
US6069791A (en) * 1997-08-14 2000-05-30 Fujikura Ltd. Cooling device for notebook personal computer
US5953206A (en) * 1997-10-15 1999-09-14 Hewlett-Packard Company Thermal dissipation and EMI shielding structure for notebook computers
JP3228896B2 (ja) * 1997-10-24 2001-11-12 キヤノン株式会社 反射型lcdパネルユニット及びこれを用いた液晶プロジェクター
US6275211B1 (en) * 1997-12-05 2001-08-14 Gateway, Inc. Waste heat actuated display back light
US6073684A (en) 1998-02-23 2000-06-13 Applied Thermal Technology Clad casting for laptop computers and the like
US6250378B1 (en) 1998-05-29 2001-06-26 Mitsubishi Denki Kabushiki Kaisha Information processing apparatus and its heat spreading method
US6169247B1 (en) * 1998-06-11 2001-01-02 Lucent Technologies Inc. Enclosure for electronic components
US6097597A (en) * 1998-06-30 2000-08-01 Mitsubishi Denki Kabushiki Kaisha Thermo-siphon and manufacturing method of thermo-siphon and information processing apparatus
US20020040377A1 (en) * 1998-09-25 2002-04-04 Newman Edward G. Computer with audio interrupt system
US6052280A (en) * 1999-01-19 2000-04-18 Alliedsignal Inc. Carbon/carbon heat spreader
US6317286B1 (en) 1999-01-29 2001-11-13 Seagate Technology Llc Diaphragm-sealed disc drive
US6384809B1 (en) * 1999-02-26 2002-05-07 Intel Corporation Projection system
US6172871B1 (en) * 1999-03-31 2001-01-09 International Business Machines Corporation Method and system in a data processing system for efficiently cooling a portable computer system
JP3964580B2 (ja) * 1999-09-03 2007-08-22 富士通株式会社 冷却ユニット
US6226178B1 (en) * 1999-10-12 2001-05-01 Dell Usa, L.P. Apparatus for cooling a heat generating component in a computer
DE60035798T2 (de) 1999-12-01 2008-04-30 Cool Options, Inc. Tragrahmen eines wärmeleitenden materials
US6487073B2 (en) 1999-12-01 2002-11-26 Cool Options, Inc. Thermally conductive electronic device case
DE10007467B4 (de) * 2000-02-18 2005-02-03 Rittal Gmbh & Co. Kg Schaltgehäuse mit einem Kühlgerät
DE10015829B4 (de) * 2000-03-30 2005-02-24 Fujitsu Siemens Computers Gmbh Kühlanordnung, für elektrische Geräte
US6466438B1 (en) * 2000-04-17 2002-10-15 Sui-Lin Lim Generic external portable cooling device for computers
US6392883B1 (en) * 2000-06-30 2002-05-21 Intel Corporation Heat exchanger having phase change material for a portable computing device
US7086452B1 (en) 2000-06-30 2006-08-08 Intel Corporation Method and an apparatus for cooling a computer
US6851869B2 (en) * 2000-08-04 2005-02-08 Cool Options, Inc. Highly thermally conductive electronic connector
JP2002099356A (ja) 2000-09-21 2002-04-05 Toshiba Corp 電子機器用冷却装置および電子機器
DE10058739A1 (de) * 2000-11-27 2002-08-22 Leukhardt Systemelektronik Industriecomputer
JP3607608B2 (ja) * 2000-12-19 2005-01-05 株式会社日立製作所 ノート型パソコンの液冷システム
JP2002188876A (ja) * 2000-12-20 2002-07-05 Hitachi Ltd 液冷システムおよびこれを用いたパーソナルコンピュータ
ATE247323T1 (de) * 2001-02-12 2003-08-15 Innowert Service Ct In Ges Fue Vorrichtung zur halterung und kühlung von flachbildschirmen
US6708797B2 (en) 2001-04-23 2004-03-23 Gilbarco Inc. Display enclosure having thin speaker
US6493440B2 (en) * 2001-04-23 2002-12-10 Gilbarco Inc. Thermal management for a thin environmentally-sealed LCD display enclosure
US7280087B2 (en) 2001-04-23 2007-10-09 Gilbarco Inc. Multiple browser interface
US6665180B2 (en) * 2001-06-22 2003-12-16 International Business Machines Corporation System for cooling a component in a computer system
WO2003007372A2 (en) * 2001-07-13 2003-01-23 Coolit Systems Inc. Cooling apparatus for electronic devices
CA2352997A1 (en) 2001-07-13 2003-01-13 Coolit Systems Inc. Computer cooling apparatus
JP2003078270A (ja) * 2001-09-07 2003-03-14 Hitachi Ltd 電子装置
US6620366B2 (en) 2001-12-21 2003-09-16 Cool Options, Inc. Method of making a capacitor post with improved thermal conductivity
US20050039880A1 (en) * 2001-12-26 2005-02-24 Scott Alexander Robin Walter Computer cooling apparatus
KR100723742B1 (ko) * 2002-01-14 2007-05-30 엘지전자 주식회사 시스템내 발열을 이용한 엘시디 밝기 제어 장치 및 그 방법
EP1454218A1 (de) 2002-04-06 2004-09-08 Zalman Tech Co., Ltd. Chipsatzkühleinrichtung einer video-graphikadapterkarte
EP1353262A1 (de) * 2002-04-10 2003-10-15 SFC Smart Fuel Cell GmbH Wärmeabfuhr bei Geräten mit interner Energieversorgung
JP3885679B2 (ja) * 2002-06-28 2007-02-21 株式会社日立製作所 電子機器
JP2004047843A (ja) * 2002-07-15 2004-02-12 Hitachi Ltd 電子装置
JP3725106B2 (ja) * 2002-08-30 2005-12-07 株式会社東芝 電子機器
JP3600606B2 (ja) * 2002-09-20 2004-12-15 株式会社東芝 電子機器
JP2004139186A (ja) * 2002-10-15 2004-05-13 Toshiba Corp 電子機器
JP2004139187A (ja) * 2002-10-15 2004-05-13 Toshiba Corp 電子機器
KR100446958B1 (ko) * 2002-11-12 2004-09-01 한국과학기술원 휴대용 컴퓨터의 방열 장치
EP1422594A3 (de) * 2002-11-22 2005-08-17 Contec Steuerungstechnik & Automation Gesellschaft m.b.H. Anordnung und Verfahren zum Kühlen eines tragbaren Rechners
US6816371B2 (en) * 2002-12-16 2004-11-09 International Business Machines Corporation Method and arrangement for enhancing the cooling capacity of portable computers
JP2004233791A (ja) * 2003-01-31 2004-08-19 Toshiba Corp 電子機器および電子機器に用いる冷却ユニット
DE10304692A1 (de) * 2003-02-06 2004-08-19 Modine Manufacturing Co., Racine Gewellter Einsatz für ein Wärmetauscherrohr
DE10305501A1 (de) * 2003-02-11 2004-09-09 Kastriot Merlaku Notebook mit einem Heizelement
US20040190253A1 (en) * 2003-03-31 2004-09-30 Ravi Prasher Channeled heat sink and chassis with integrated heat rejector for two-phase cooling
JP2004348650A (ja) * 2003-05-26 2004-12-09 Toshiba Corp 電子機器
TWI222346B (en) * 2003-08-08 2004-10-11 Quanta Comp Inc Phase transformation heat dissipation apparatus
US6999316B2 (en) * 2003-09-10 2006-02-14 Qnx Cooling Systems Inc. Liquid cooling system
DE20314532U1 (de) * 2003-09-16 2004-02-19 Pries, Wulf H. Vorrichtung zur Ableitung von Wärme von elektronischen und elektrischen Bauelementen
KR100589313B1 (ko) * 2003-09-24 2006-06-14 삼성에스디아이 주식회사 플라즈마 디스플레이 장치
JP2005141194A (ja) * 2003-10-14 2005-06-02 Seiko Epson Corp 補強構造体、表示装置、及び電子機器
JP2005129734A (ja) 2003-10-23 2005-05-19 Sony Corp 電子機器
US7288895B2 (en) * 2003-11-17 2007-10-30 Intel Corporation System to improve display efficiency based on recycling local heat source
US7269005B2 (en) * 2003-11-21 2007-09-11 Intel Corporation Pumped loop cooling with remote heat exchanger and display cooling
US7017059B2 (en) * 2003-12-12 2006-03-21 Cray Canada Inc. Methods and apparatus for replacing cooling systems in operating computers
JP4446781B2 (ja) * 2004-04-06 2010-04-07 富士フイルム株式会社 デジタルカメラ
TWI231878B (en) * 2004-04-09 2005-05-01 Au Optronics Corp Driving method for driving an OCB mode LCD device
AT412818B (de) * 2004-04-28 2005-07-25 Karl-Heinz Dipl Ing Hinrichs Heiz- und warmwasserbereitungsanlage und verfahren zum betrieb einer solchen anlage
US7926553B2 (en) 2005-03-07 2011-04-19 Asetek A/S Cooling system for electronic devices, in particular, computers
DE102005012350B4 (de) * 2005-03-07 2008-04-03 Asetek A/S Kühlsystem für elektronische Geräte, insbesondere Computer
WO2006114754A1 (en) * 2005-04-28 2006-11-02 Koninklijke Philips Electronics N.V. Computer, particularly laptop computer, and cooling of the same
US20060254754A1 (en) * 2005-05-11 2006-11-16 Jian-Dih Jeng Panel-type radiating system
KR100683412B1 (ko) 2005-06-11 2007-02-20 삼성전자주식회사 컴퓨터
US20060291161A1 (en) * 2005-06-28 2006-12-28 Phi Tran Heat dissipating surface for a portable device
JP4746931B2 (ja) 2005-07-22 2011-08-10 株式会社日立製作所 フラットディスプレイパネルモジュール及びフラットディスプレイ装置
US8240359B2 (en) * 2006-04-17 2012-08-14 Gerald Garrett Liquid storage and cooling computer case
JP4781929B2 (ja) * 2006-07-25 2011-09-28 富士通株式会社 電子機器
JP4842040B2 (ja) 2006-07-25 2011-12-21 富士通株式会社 電子機器
JP5148079B2 (ja) * 2006-07-25 2013-02-20 富士通株式会社 液冷ユニット用熱交換器および液冷ユニット並びに電子機器
JP5133531B2 (ja) * 2006-07-25 2013-01-30 富士通株式会社 液冷ユニット用熱交換器および液冷ユニット並びに電子機器
JP2008027374A (ja) * 2006-07-25 2008-02-07 Fujitsu Ltd 液冷ユニット用受熱器および液冷ユニット並びに電子機器
JP2008027370A (ja) * 2006-07-25 2008-02-07 Fujitsu Ltd 電子機器
JP5283836B2 (ja) 2006-07-25 2013-09-04 富士通株式会社 液冷ユニット用受熱器および液冷ユニット並びに電子機器
ATE519360T1 (de) * 2006-12-23 2011-08-15 Abb Research Ltd Flexible heizkabelvorrichtung
CA2573941A1 (en) 2007-01-15 2008-07-15 Coolit Systems Inc. Computer cooling system
JP4572212B2 (ja) * 2007-04-23 2010-11-04 富士通株式会社 表示装置および電子機器
US8011362B2 (en) 2007-09-17 2011-09-06 Adams Phillip M Compact continuous positive airway pressure apparatus and method
US20090175006A1 (en) * 2008-01-09 2009-07-09 Rong-Yuan Jou Honeycomb heat dissipating apparatus
JP5098681B2 (ja) * 2008-02-15 2012-12-12 セイコーエプソン株式会社 液晶装置、投射装置、及び電子機器
US7791876B2 (en) * 2008-05-12 2010-09-07 Hewlett-Packard Development Company, L.P. Hinge connector with liquid coolant path
US8248777B2 (en) 2008-05-23 2012-08-21 Apple Inc. Viscoelastic material for shock protection in an electronic device
US20090317087A1 (en) * 2008-06-19 2009-12-24 Bernard Marc R Configurable control for network device operation
US20090323276A1 (en) * 2008-06-25 2009-12-31 Mongia Rajiv K High performance spreader for lid cooling applications
JP5241414B2 (ja) * 2008-09-30 2013-07-17 三洋電機株式会社 画像表示装置
US20100129140A1 (en) * 2008-11-26 2010-05-27 Coolit Systems Inc. Connector for a liquid cooling system in a computer
US8305744B2 (en) 2010-05-14 2012-11-06 Apple Inc. Shock mounting cover glass in consumer electronics devices
US9342108B2 (en) 2011-09-16 2016-05-17 Apple Inc. Protecting an electronic device
DE102011116533B3 (de) * 2011-10-20 2013-03-07 Fujitsu Technology Solutions Intellectual Property Gmbh Computersystem
DE102011116532B3 (de) * 2011-10-20 2013-03-07 Fujitsu Technology Solutions Intellectual Property Gmbh Computersystem
US9129659B2 (en) * 2011-10-25 2015-09-08 Apple Inc. Buckling shock mounting
AU2012232968B2 (en) * 2011-10-31 2014-11-13 Abb Technology Ag Thermosiphon cooler arrangement in modules with electric and/or electronic components
AU2012232967B2 (en) 2011-10-31 2015-01-15 Abb Technology Ag Cabinet with modules having a thermosiphon cooler arrangement
US9395036B2 (en) * 2012-06-13 2016-07-19 Samsung Display Co., Ltd. Bracket for a display panel and display device including the same
US8862182B2 (en) 2012-08-31 2014-10-14 Apple Inc. Coupling reduction for electromechanical actuator
US9432492B2 (en) 2013-03-11 2016-08-30 Apple Inc. Drop countermeasures for electronic device
US9505032B2 (en) 2013-03-14 2016-11-29 Apple Inc. Dynamic mass reconfiguration
US9715257B2 (en) 2014-04-18 2017-07-25 Apple Inc. Active screen protection for electronic device
US9612622B2 (en) 2014-05-13 2017-04-04 Apple Inc. Electronic device housing
US9571150B2 (en) 2014-05-21 2017-02-14 Apple Inc. Screen protection using actuated bumpers
US10310602B2 (en) 2014-07-11 2019-06-04 Apple Inc. Controlled gyroscopic torque for an electronic device
JP2016090080A (ja) * 2014-10-30 2016-05-23 富士通株式会社 冷却装置及び電子装置
US9612633B2 (en) * 2015-02-19 2017-04-04 Compulab Ltd. Passively cooled serviceable device
AU365555S (en) * 2015-05-13 2015-12-01 Abb Oy Inverter
CN206249807U (zh) * 2016-11-10 2017-06-13 扬升照明股份有限公司 力量分散装置
US10802556B2 (en) * 2018-04-13 2020-10-13 Dell Products L.P. Information handling system thermal fluid hinge
US10969841B2 (en) 2018-04-13 2021-04-06 Dell Products L.P. Information handling system housing integrated vapor chamber
US10936031B2 (en) 2018-04-13 2021-03-02 Dell Products L.P. Information handling system dynamic thermal transfer control
WO2020243169A1 (en) * 2019-05-28 2020-12-03 Magic Leap, Inc. Thermal management system for portable electronic devices
KR20210026251A (ko) 2019-08-29 2021-03-10 삼성전자주식회사 액정 디스플레이
US11989067B2 (en) 2019-12-06 2024-05-21 Nvidia Corporation Laptop computer with display-side cooling system

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3889053A (en) * 1973-10-30 1975-06-10 Westinghouse Electric Corp Contactless test system
US3976508A (en) * 1974-11-01 1976-08-24 Mobil Tyco Solar Energy Corporation Tubular solar cell devices
US4838664A (en) * 1986-07-10 1989-06-13 Brent Graham Diagnostic overlay
US4987289A (en) * 1988-07-21 1991-01-22 Rockwell International Corporation Liquid crystal display heating system
US4980848A (en) * 1988-10-31 1990-12-25 Zenith Data Systems Corporation Heat-exchange panel for portable computer
US4941530A (en) * 1989-01-13 1990-07-17 Sundstrand Corporation Enhanced air fin cooling arrangement for a hermetically sealed modular electronic cold plate utilizing reflux cooling
JP2879694B2 (ja) * 1990-01-29 1999-04-05 株式会社日立製作所 情報処理システム及び外部記憶装置
US5119215A (en) * 1990-02-20 1992-06-02 Thermo-O-Disc, Incorporated LCD with self regulating PTC thermistor heating element
US5247374A (en) * 1990-04-05 1993-09-21 Stanley Electric Co., Ltd. Liquid crystal display device with common heater between two cells
JPH052164A (ja) * 1991-01-28 1993-01-08 Toshiba Corp Lcdモジユール
EP0516478A2 (de) * 1991-05-30 1992-12-02 Nec Corporation Kühlungsstruktur für integrierte Schaltungen
US5349823A (en) * 1992-02-14 1994-09-27 Intel Corporation Integrated refrigerated computer module
US5255109A (en) * 1992-04-23 1993-10-19 Pc Tech Inc. Heat dissipating LCD display
US5394936A (en) * 1993-03-12 1995-03-07 Intel Corporation High efficiency heat removal system for electric devices and the like
JP3385482B2 (ja) * 1993-11-15 2003-03-10 株式会社日立製作所 電子機器
US5383340A (en) * 1994-03-24 1995-01-24 Aavid Laboratories, Inc. Two-phase cooling system for laptop computers

Also Published As

Publication number Publication date
EP0767415B1 (de) 2003-12-10
EP0767415A3 (de) 1999-05-06
JPH09113158A (ja) 1997-05-02
EP0767415A2 (de) 1997-04-09
DE69631006T2 (de) 2004-08-12
US5606341A (en) 1997-02-25

Similar Documents

Publication Publication Date Title
DE69631006D1 (de) Vorrichtung zur Wärmeübertragung
DE69607725D1 (de) Vorrichtung zur Temperaturreglung
DE69832153D1 (de) Vorrichtung zur geldüberweisung
DE69516510T2 (de) Vorrichtung zur Temperaturmessung
DE69410460D1 (de) Beheizte vorrichtung
DE69528303T2 (de) Vorrichtung zur thermischen Behandlung
DE69633747D1 (de) Vorrichtung zur Implantation
DE69634586D1 (de) Vorrichtung zur Kühlung einer Wärmequelle
DE59606221D1 (de) Heizeinrichtung
DE69840751D1 (de) Gerät zur wärmebehandlung
DE59602432D1 (de) Übergabevorrichtung
DE69322646D1 (de) Vorrichtung zur wärmeübertragung
DE69520168D1 (de) Drehende Vorrichtung zur Wärmeübertragung
DE59509949D1 (de) Vorrichtung zur strahlteilung
DE69631957D1 (de) Chirurgische Vorrichtung
BR9602504A (pt) Dispositivo de aquecimento
DE69614253D1 (de) Vorrichtung zur zielerfassung
DE59508039D1 (de) Vorrichtung zur längsverstellung
DE69611115D1 (de) Vorrichtung zur Keimbildung
DE69635631D1 (de) Vorrichtung zur Wärmeübertragung
DE69505138T2 (de) Vorrichtung zur kühlung von heissem gas
ITMI950448A0 (it) Dispositivo di riscaldamento autotermoregolante
DE69612546T2 (de) Vorrichtung zur wärmeübertragung mit hilfe von luft
DE59603273D1 (de) Vorrichtung zur Kälteerzeugung
ATA226994A (de) Einrichtung zur übertragung von kondensationswärme

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8320 Willingness to grant licences declared (paragraph 23)