DE29704885U1 - Anordnung zur Abführung von Wärme einer in einem Gehäuse angeordneten Wärmequelle - Google Patents

Anordnung zur Abführung von Wärme einer in einem Gehäuse angeordneten Wärmequelle

Info

Publication number
DE29704885U1
DE29704885U1 DE29704885U DE29704885U DE29704885U1 DE 29704885 U1 DE29704885 U1 DE 29704885U1 DE 29704885 U DE29704885 U DE 29704885U DE 29704885 U DE29704885 U DE 29704885U DE 29704885 U1 DE29704885 U1 DE 29704885U1
Authority
DE
Germany
Prior art keywords
housing
arrangement
heat
source arranged
heat source
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE29704885U
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE29704885U priority Critical patent/DE29704885U1/de
Priority to PCT/DE1998/000670 priority patent/WO1998042169A2/de
Priority to EP98919048A priority patent/EP0968632A2/de
Publication of DE29704885U1 publication Critical patent/DE29704885U1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DE29704885U 1997-03-19 1997-03-19 Anordnung zur Abführung von Wärme einer in einem Gehäuse angeordneten Wärmequelle Expired - Lifetime DE29704885U1 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DE29704885U DE29704885U1 (de) 1997-03-19 1997-03-19 Anordnung zur Abführung von Wärme einer in einem Gehäuse angeordneten Wärmequelle
PCT/DE1998/000670 WO1998042169A2 (de) 1997-03-19 1998-03-06 Anordnung zur abführung von wärme einer in einem gehäuse angeordneten wärmequelle
EP98919048A EP0968632A2 (de) 1997-03-19 1998-03-06 Anordnung zur abführung von wärme einer in einem gehäuse angeordneten wärmequelle

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE29704885U DE29704885U1 (de) 1997-03-19 1997-03-19 Anordnung zur Abführung von Wärme einer in einem Gehäuse angeordneten Wärmequelle

Publications (1)

Publication Number Publication Date
DE29704885U1 true DE29704885U1 (de) 1998-04-30

Family

ID=8037653

Family Applications (1)

Application Number Title Priority Date Filing Date
DE29704885U Expired - Lifetime DE29704885U1 (de) 1997-03-19 1997-03-19 Anordnung zur Abführung von Wärme einer in einem Gehäuse angeordneten Wärmequelle

Country Status (3)

Country Link
EP (1) EP0968632A2 (de)
DE (1) DE29704885U1 (de)
WO (1) WO1998042169A2 (de)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002075510A1 (de) * 2001-03-21 2002-09-26 Fritschle, Simone Computergehäuse
DE102004030675A1 (de) * 2004-06-24 2005-11-10 Nft Nanofiltertechnik Gmbh Kühleinrichtung für elektronische Bauelemente
DE102005019437A1 (de) * 2005-01-25 2006-08-03 Axel Benner Computer
DE102013010867A1 (de) * 2013-06-28 2014-12-31 Protonet GmbH Gehäuse, Kühlkörper und Verfahren zum Herstellen eines Kühlkörpers zum Kühlen von elektrischen und/oder elektronischen Bauteilen

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10332770A1 (de) * 2003-07-17 2005-02-24 Jürgen Dr.-Ing. Schulz-Harder Kühlvorrichtung zum Abführen von Verlustwärme von einem elektrischen oder elektronischen Bauelement oder Baugruppe

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3226602A (en) * 1962-10-29 1965-12-28 Thore M Elfving Heat transferring mounting panels for electric components and circuits
DE2706165A1 (de) * 1976-02-14 1977-08-18 Sony Corp Kuehlanordnung fuer elektrische bauteile
DE2801660A1 (de) * 1978-01-16 1979-07-19 Kabel Metallwerke Ghh Vorrichtung zum abfuehren der verlustwaerme von elektronischen bauelementen
DE3701477A1 (de) * 1987-01-16 1988-07-28 Licentia Gmbh Einrichtung zur kuehlung von leistungswiderstaenden
DE9312138U1 (de) * 1993-08-13 1993-10-21 Kunze Burkhard Dipl Ing Kühlvorrichtung
EP0577099A2 (de) * 1992-07-03 1994-01-05 Hitachi, Ltd. Kühlvorrichtung für elektronische Elemente
US5339214A (en) * 1993-02-12 1994-08-16 Intel Corporation Multiple-fan microprocessor cooling through a finned heat pipe
US5343940A (en) * 1992-10-29 1994-09-06 Amigo Jean Flexible heat transfer device
DE4312830A1 (de) * 1993-04-20 1994-10-27 Privates Inst Fuer Luft Und Ka Vorrichtung zur Kühlung von hochtemperatursupraleitenden, mikroelektronischen Bauelementen, vorzugsweise Sensoren
US5606341A (en) * 1995-10-02 1997-02-25 Ncr Corporation Passive CPU cooling and LCD heating for a laptop computer

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3852804A (en) * 1973-05-02 1974-12-03 Gen Electric Double-sided heat-pipe cooled power semiconductor device assembly
US4917173A (en) * 1988-11-15 1990-04-17 The United States Of America As Represented By The National Aeronautics And Space Administration Monogroove liquid heat exchanger
DE69031883T2 (de) * 1989-06-08 1998-08-27 Furukawa Electric Co Ltd Kühlvorrichtung mit elektrisch isoliertem Wärmerohr für Halbleiter
JPH0714029B2 (ja) * 1990-02-07 1995-02-15 日本碍子株式会社 電力用半導体素子
FR2687464A1 (fr) * 1992-02-19 1993-08-20 Bernier Jacques Caloducs a melange zeotropique de fluides.
US5598320A (en) * 1995-03-06 1997-01-28 Ast Research, Inc. Rotable and slideble heat pipe apparatus for reducing heat build up in electronic devices

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3226602A (en) * 1962-10-29 1965-12-28 Thore M Elfving Heat transferring mounting panels for electric components and circuits
DE2706165A1 (de) * 1976-02-14 1977-08-18 Sony Corp Kuehlanordnung fuer elektrische bauteile
DE2801660A1 (de) * 1978-01-16 1979-07-19 Kabel Metallwerke Ghh Vorrichtung zum abfuehren der verlustwaerme von elektronischen bauelementen
DE3701477A1 (de) * 1987-01-16 1988-07-28 Licentia Gmbh Einrichtung zur kuehlung von leistungswiderstaenden
EP0577099A2 (de) * 1992-07-03 1994-01-05 Hitachi, Ltd. Kühlvorrichtung für elektronische Elemente
US5343940A (en) * 1992-10-29 1994-09-06 Amigo Jean Flexible heat transfer device
US5339214A (en) * 1993-02-12 1994-08-16 Intel Corporation Multiple-fan microprocessor cooling through a finned heat pipe
DE4312830A1 (de) * 1993-04-20 1994-10-27 Privates Inst Fuer Luft Und Ka Vorrichtung zur Kühlung von hochtemperatursupraleitenden, mikroelektronischen Bauelementen, vorzugsweise Sensoren
DE9312138U1 (de) * 1993-08-13 1993-10-21 Kunze Burkhard Dipl Ing Kühlvorrichtung
US5606341A (en) * 1995-10-02 1997-02-25 Ncr Corporation Passive CPU cooling and LCD heating for a laptop computer
EP0767415A2 (de) * 1995-10-02 1997-04-09 NCR International, Inc. Vorrichtung zur Wärmeübertragung

Non-Patent Citations (5)

* Cited by examiner, † Cited by third party
Title
Ducted Heat Pipe System in Mobile PC Systems. In: IBM Technical Disclosure Bulletin, Vol. 38, No. 6,June 1995, S.289,290 *
Enclosure with Heat Exchanger for Immersion Cooling. In: IBM Technical Disclosure Bulletin, Vol. 36, No. 11, Nov. 1993, S.121,122 *
JP 07169889 A., In: Patent Abstracts of Japan *
Subcooled Flow Boiling Scheme For Direct Immersion Cooling Of Three-Dimensional Electronic Packages In Large-Scale Computers Or Supercomputers. In: IBM Technical Disclosure, Vol. 33, No. 11, April 1991, S.387-390 *
WILSON,E.A.: Cooling Modern Mainframes - A Liquid Approach. In: Computer Design, May 1983, H. 6, S.219-225 *

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002075510A1 (de) * 2001-03-21 2002-09-26 Fritschle, Simone Computergehäuse
DE102004030675A1 (de) * 2004-06-24 2005-11-10 Nft Nanofiltertechnik Gmbh Kühleinrichtung für elektronische Bauelemente
DE102005019437A1 (de) * 2005-01-25 2006-08-03 Axel Benner Computer
DE102013010867A1 (de) * 2013-06-28 2014-12-31 Protonet GmbH Gehäuse, Kühlkörper und Verfahren zum Herstellen eines Kühlkörpers zum Kühlen von elektrischen und/oder elektronischen Bauteilen
DE102013010867B4 (de) * 2013-06-28 2015-11-12 Protonet GmbH Anordnung zum Kühlen von in einem Gehäuse anordnenbaren elektrischen und/oder elektronischen Bauteilen und Rechner mit einer solchen

Also Published As

Publication number Publication date
WO1998042169A2 (de) 1998-09-24
EP0968632A2 (de) 2000-01-05
WO1998042169A3 (de) 1999-02-25

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Legal Events

Date Code Title Description
R163 Identified publications notified
R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: F28D0021000000

Ipc: H05K0007200000

R207 Utility model specification

Effective date: 19980610

R150 Term of protection extended to 6 years

Effective date: 20000606

R157 Lapse of ip right after 6 years

Effective date: 20031001