DE69629316D1 - Verfahren und vorrichtung zum aufbringen von porösen schichten und kathodenfilm eines elektrolytischen kondensors - Google Patents

Verfahren und vorrichtung zum aufbringen von porösen schichten und kathodenfilm eines elektrolytischen kondensors

Info

Publication number
DE69629316D1
DE69629316D1 DE69629316T DE69629316T DE69629316D1 DE 69629316 D1 DE69629316 D1 DE 69629316D1 DE 69629316 T DE69629316 T DE 69629316T DE 69629316 T DE69629316 T DE 69629316T DE 69629316 D1 DE69629316 D1 DE 69629316D1
Authority
DE
Germany
Prior art keywords
porous layers
cathode film
electrolytic condenser
applying porous
applying
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69629316T
Other languages
English (en)
Other versions
DE69629316T2 (de
Inventor
Sergei Nikolaevich Ryazantsev
Igor Nikolaevich Jurkevich
Viktor Fadeevich Koshelevsky
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OKB TITAN ZAO
Original Assignee
OKB TITAN ZAO
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from RU96106008/02A external-priority patent/RU2087588C1/ru
Priority claimed from RU96106009/09A external-priority patent/RU2098878C1/ru
Application filed by OKB TITAN ZAO filed Critical OKB TITAN ZAO
Publication of DE69629316D1 publication Critical patent/DE69629316D1/de
Application granted granted Critical
Publication of DE69629316T2 publication Critical patent/DE69629316T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/04—Electrodes or formation of dielectric layers thereon
    • H01G9/042—Electrodes or formation of dielectric layers thereon characterised by the material
    • H01G9/045—Electrodes or formation of dielectric layers thereon characterised by the material based on aluminium
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/046—Coating cavities or hollow spaces, e.g. interior of tubes; Infiltration of porous substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/0641—Nitrides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/225—Oblique incidence of vaporised material on substrate
    • C23C14/226—Oblique incidence of vaporised material on substrate in order to form films with columnar structure
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/04—Electrodes or formation of dielectric layers thereon
    • H01G9/042—Electrodes or formation of dielectric layers thereon characterised by the material
    • H01G9/0425—Electrodes or formation of dielectric layers thereon characterised by the material specially adapted for cathode

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)
DE69629316T 1996-04-03 1996-04-26 Verfahren und vorrichtung zum aufbringen von porösen schichten und kathodenfilm eines elektrolytischen kondensors Expired - Fee Related DE69629316T2 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
RU96106008/02A RU2087588C1 (ru) 1996-04-03 1996-04-03 Устройство для напыления пористых покрытий на ленту
RU96106008 1996-04-03
RU96106009 1996-04-03
RU96106009/09A RU2098878C1 (ru) 1996-04-03 1996-04-03 Способ изготовления катодной фольги (варианты) и катодная фольга электролитического конденсатора
PCT/RU1996/000104 WO1997037052A1 (fr) 1996-04-03 1996-04-26 Procede et dispositif de deposition de revetement poreux et feuille cathodique de condensateur electrolytique

Publications (2)

Publication Number Publication Date
DE69629316D1 true DE69629316D1 (de) 2003-09-04
DE69629316T2 DE69629316T2 (de) 2004-05-27

Family

ID=26653872

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69629316T Expired - Fee Related DE69629316T2 (de) 1996-04-03 1996-04-26 Verfahren und vorrichtung zum aufbringen von porösen schichten und kathodenfilm eines elektrolytischen kondensors

Country Status (8)

Country Link
EP (1) EP0905274B1 (de)
JP (1) JP3475193B2 (de)
CN (1) CN1155735C (de)
AU (1) AU6321796A (de)
CZ (1) CZ311698A3 (de)
DE (1) DE69629316T2 (de)
HK (1) HK1020203A1 (de)
WO (1) WO1997037052A1 (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6287673B1 (en) * 1998-03-03 2001-09-11 Acktar Ltd. Method for producing high surface area foil electrodes
DE19817405A1 (de) * 1998-04-20 1999-10-21 Becromal Spa Verfahren zur Herstellung einer Anode für elektrolytische Kondensatoren und so hergestellte Anoden
IT1307557B1 (it) * 1999-04-14 2001-11-14 Becromal Spa Elettrodi per condensatori elettrolitici e loro processo difabbricazione mediante evaporazione sotto vuoto.
WO2001057928A1 (en) * 2000-02-03 2001-08-09 Case Western Reserve University High power capacitors from thin layers of metal powder or metal sponge particles
DE10219908A1 (de) * 2002-05-03 2003-11-27 Epcos Ag Elektrode und ein Verfahren zu deren Herstellung
JP4201623B2 (ja) 2002-11-19 2008-12-24 三洋電機株式会社 固体電解コンデンサ
US7216428B2 (en) 2003-03-03 2007-05-15 United Technologies Corporation Method for turbine element repairing
US7509734B2 (en) 2003-03-03 2009-03-31 United Technologies Corporation Repairing turbine element
EP1591553A1 (de) * 2004-04-28 2005-11-02 Becromal S.p.A. Verfahren zum Herstellen einer mit Titannitrid überzogenen Elektrode
IL173121A (en) * 2006-01-12 2011-07-31 Dina Katsir Electrodes, membranes, printing plate precursors and other articles including multi-strata porous coatings
WO2008010747A1 (en) * 2006-07-19 2008-01-24 Sandvik Intellectual Property Ab Method of producing a rough surface on a substrate
EP2680286B1 (de) 2011-02-21 2019-06-19 Japan Capacitor Industrial Co., Ltd. Elektrodenfolie, stromkollektor, elektrode und speicherelement elektrischer energie damit
TWI435352B (zh) * 2011-09-21 2014-04-21 Apaq Technology Co Ltd 高比表面積鋁材及其製作方法
GB201203216D0 (en) * 2012-02-24 2012-04-11 Teer Coatings Ltd High surface area (HSA) coatings and method for forming the same
US9206523B2 (en) 2012-09-28 2015-12-08 Intel Corporation Nanomachined structures for porous electrochemical capacitors
JP6233292B2 (ja) * 2014-12-23 2017-11-22 住友金属鉱山株式会社 長尺フィルムの搬送および冷却用ロール、ならびに該ロールを搭載した長尺フィルムの処理装置
DE102016101019A1 (de) 2015-09-28 2017-03-30 Von Ardenne Gmbh Beschichtungsanordnung und Verfahren zum Beschichten eines Bandsubstrats
CN114730666A (zh) * 2019-11-29 2022-07-08 松下知识产权经营株式会社 电解电容器用阴极箔、电解电容器、及它们的制造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU364689A1 (ru) * 1969-08-21 1972-12-28 УСТРОЙСТВО дл НАНЕСЕНИЯ ПОКРЫТИЙ В BAKVVME
SU451135A1 (ru) * 1972-12-06 1974-11-25 Предприятие П/Я Г-4816 Электролитический конденсатор
SU546026A1 (ru) * 1974-10-21 1977-02-05 Ленинградский Ордена Ленина Политехнический Институт Им.М.И.Калинина Катод электролитического конденсатора
JPS5736437A (en) * 1980-08-14 1982-02-27 Fuji Photo Film Co Ltd Producing device of magnetic recording medium
DE3210420A1 (de) * 1982-03-22 1983-09-22 Siemens AG, 1000 Berlin und 8000 München Elektrochemischer doppelschichtkondensator
DD205192A1 (de) * 1982-06-08 1983-12-21 Manfred Neumann Einrichtung zum vakuumbeschichten von baendern
KR910005753B1 (ko) * 1986-12-24 1991-08-02 쇼오와 알루미늄 가부시기가이샤 전해 콘덴서용 알루미늄 전극재료 및 그 제조방법
EP0344316B1 (de) * 1987-07-30 1994-11-02 Matsushita Electric Industrial Co., Ltd. Verfahren zur herstellung eines elektrolytischen kondensators
JP3168587B2 (ja) * 1990-02-09 2001-05-21 東レ株式会社 電解コンデンサ用電極箔およびその製造方法
JPH0529180A (ja) * 1991-07-22 1993-02-05 Elna Co Ltd 電解コンデンサ
JPH07233474A (ja) * 1994-02-23 1995-09-05 Ulvac Japan Ltd 巻取式真空成膜装置
IT1269042B (it) * 1994-03-18 1997-03-18 Galileo Vacuum Tec Spa Impianto continuo di metallizzazione sotto vuoto del tipo con due rulli delimitanti una zona di trattamento (configurazione free-span)

Also Published As

Publication number Publication date
CN1155735C (zh) 2004-06-30
AU6321796A (en) 1997-10-22
WO1997037052A1 (fr) 1997-10-09
EP0905274A1 (de) 1999-03-31
JP2000509101A (ja) 2000-07-18
EP0905274B1 (de) 2003-07-30
CN1216074A (zh) 1999-05-05
HK1020203A1 (en) 2000-03-31
CZ311698A3 (cs) 1999-06-16
EP0905274A4 (de) 2001-07-25
JP3475193B2 (ja) 2003-12-08
DE69629316T2 (de) 2004-05-27

Similar Documents

Publication Publication Date Title
DE69629316D1 (de) Verfahren und vorrichtung zum aufbringen von porösen schichten und kathodenfilm eines elektrolytischen kondensors
DE59509784D1 (de) Verfahren und vorrichtung zum auffinden eines verfügbaren parkplatzes oder parkhauses
DE69732853D1 (de) Verfahren und vorrichtung zur zuordnung von ip-adressen
DE69738429D1 (de) Verfahren und vorrichtung zum dynamischen lastausgleich durch weiterreichen
DE69924956D1 (de) Vorrichtung und Verfahren zum streifenförmigen Auftragen von Bechichtungsmaterial
DE19581483T1 (de) Verfahren und Vorrichtung zur Bildung von Dünnschichten
DE69629420D1 (de) Verfahren und Einrichtung zum Einstellen eines elektronischen Geräts
DE69842002D1 (de) Ein verfahren zum aufbringen eines elektrokatalysators und damit hergestellte elektroden
DE69737281D1 (de) Vorrichtung und Verfahren zum Drucken von Lötpaste
DE69534506T2 (de) Verfahren und Gerät zum Bestimmen von Tonbereichsgrenzen
DE69902089D1 (de) Vorrichtung und verfahren zum auftragen von viskoser flüssigkeit
DE59703703D1 (de) Verfahren zum testen von systemkomponenten eines objektorientierten programms
DE69701076D1 (de) Verfahren und Vorrichtung zum Formwalzen von flachen Rohren
DE69625872D1 (de) Vorrichtung und Verfahren zum Verhindern der Ausbreitung von Mikroben
ATE248935T1 (de) Verfahren und vorrichtung zum regenerieren von verzinnungslösungen
DE69739119D1 (de) Verwendung eines elements und verfahren zum nachweis von enterotoxigenen staphylokokken
DE69620699D1 (de) Verfahren und Vorrichtung zur Herstellung von porösen Metallplatten
DE69719241D1 (de) Vorrichtung und Verfahren zum Perforieren von durchlaufendem Material und Vorrichtung und Verfahren zum Bearbeiten und Befestigen von photographischem Filmmaterial
DE69704997D1 (de) Verfahren und Vorrichtung zum Netzen von Getreide
DE69418177D1 (de) Verfahren und Vorrichtung zum Herstellen von Dünnfilmen
DE69624852D1 (de) Verfahren und Vorrichtung zur Unterstützung der Reparatur von defekten Substraten
DE69431440D1 (de) Verfahren und vorrichtung zum abdichten von lecks
DE59901114D1 (de) Verfahren und vorrichtung zum verdampfen von flüssigem sauerstoff
DE59608859D1 (de) Vorrichtung und verfahren zum beschichten von metallbahnen
DE59610063D1 (de) Verfahren und Vorrichtung zur Innenbeschichtung von Behälterzargen

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8380 Miscellaneous part iii

Free format text: DER VERTRETER IST ZU BERICHTIGEN IN: MEISSNER, BOLTE & PARTNER 81633 MUENCHEN

8339 Ceased/non-payment of the annual fee