DE69619330T2 - Herstellung von Halbleiterwafern - Google Patents

Herstellung von Halbleiterwafern

Info

Publication number
DE69619330T2
DE69619330T2 DE69619330T DE69619330T DE69619330T2 DE 69619330 T2 DE69619330 T2 DE 69619330T2 DE 69619330 T DE69619330 T DE 69619330T DE 69619330 T DE69619330 T DE 69619330T DE 69619330 T2 DE69619330 T2 DE 69619330T2
Authority
DE
Germany
Prior art keywords
manufacture
semiconductor wafers
wafers
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69619330T
Other languages
English (en)
Other versions
DE69619330D1 (de
Inventor
Andrew Thorton Appel
Michael Francis Chisholm
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of DE69619330D1 publication Critical patent/DE69619330D1/de
Application granted granted Critical
Publication of DE69619330T2 publication Critical patent/DE69619330T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
DE69619330T 1995-10-23 1996-10-23 Herstellung von Halbleiterwafern Expired - Lifetime DE69619330T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US578895P 1995-10-23 1995-10-23

Publications (2)

Publication Number Publication Date
DE69619330D1 DE69619330D1 (de) 2002-03-28
DE69619330T2 true DE69619330T2 (de) 2002-09-26

Family

ID=21717757

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69619330T Expired - Lifetime DE69619330T2 (de) 1995-10-23 1996-10-23 Herstellung von Halbleiterwafern

Country Status (5)

Country Link
US (1) US5906754A (de)
EP (1) EP0770454B1 (de)
JP (1) JPH09117856A (de)
KR (1) KR100440417B1 (de)
DE (1) DE69619330T2 (de)

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100508082B1 (ko) * 1997-11-06 2005-11-08 삼성전자주식회사 폴리싱장치
KR100286980B1 (ko) * 1998-02-11 2001-04-16 윤종용 웨이퍼 연마 설비 및 웨이퍼 연마 방법
US6135868A (en) * 1998-02-11 2000-10-24 Applied Materials, Inc. Groove cleaning device for chemical-mechanical polishing
US6271140B1 (en) * 1998-10-01 2001-08-07 Vanguard International Semiconductor Corporation Coaxial dressing for chemical mechanical polishing
US6291349B1 (en) 1999-03-25 2001-09-18 Beaver Creek Concepts Inc Abrasive finishing with partial organic boundary layer
US6568989B1 (en) 1999-04-01 2003-05-27 Beaver Creek Concepts Inc Semiconductor wafer finishing control
US6541381B2 (en) 1998-11-06 2003-04-01 Beaver Creek Concepts Inc Finishing method for semiconductor wafers using a lubricating boundary layer
US6428388B2 (en) 1998-11-06 2002-08-06 Beaver Creek Concepts Inc. Finishing element with finishing aids
US7131890B1 (en) 1998-11-06 2006-11-07 Beaver Creek Concepts, Inc. In situ finishing control
US6739947B1 (en) 1998-11-06 2004-05-25 Beaver Creek Concepts Inc In situ friction detector method and apparatus
US6346202B1 (en) 1999-03-25 2002-02-12 Beaver Creek Concepts Inc Finishing with partial organic boundary layer
US6634927B1 (en) 1998-11-06 2003-10-21 Charles J Molnar Finishing element using finishing aids
US6656023B1 (en) * 1998-11-06 2003-12-02 Beaver Creek Concepts Inc In situ control with lubricant and tracking
US6267644B1 (en) 1998-11-06 2001-07-31 Beaver Creek Concepts Inc Fixed abrasive finishing element having aids finishing method
US6293851B1 (en) 1998-11-06 2001-09-25 Beaver Creek Concepts Inc Fixed abrasive finishing method using lubricants
JP4579879B2 (ja) * 1999-03-05 2010-11-10 株式会社荏原製作所 ポリッシング装置
TW467795B (en) * 1999-03-15 2001-12-11 Mitsubishi Materials Corp Wafer transporting device, wafer polishing device and method for making wafers
US6551933B1 (en) 1999-03-25 2003-04-22 Beaver Creek Concepts Inc Abrasive finishing with lubricant and tracking
KR100343967B1 (ko) * 1999-11-17 2002-07-24 엘지전자주식회사 투사렌즈계
US6447374B1 (en) 1999-12-17 2002-09-10 Applied Materials, Inc. Chemical mechanical planarization system
US6517414B1 (en) 2000-03-10 2003-02-11 Appied Materials, Inc. Method and apparatus for controlling a pad conditioning process of a chemical-mechanical polishing apparatus
US6616513B1 (en) * 2000-04-07 2003-09-09 Applied Materials, Inc. Grid relief in CMP polishing pad to accurately measure pad wear, pad profile and pad wear profile
JP2003535462A (ja) * 2000-05-31 2003-11-25 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 半導体及び集積回路を製造するための研磨方法及び装置
US6544033B1 (en) * 2000-09-08 2003-04-08 Applied Materials, Inc. Wafer carrier
US6796883B1 (en) 2001-03-15 2004-09-28 Beaver Creek Concepts Inc Controlled lubricated finishing
US6878045B2 (en) 2001-07-24 2005-04-12 Honeywell International Incorporated Ultrasonic conditioning device cleaner for chemical mechanical polishing systems
US7156717B2 (en) 2001-09-20 2007-01-02 Molnar Charles J situ finishing aid control
US6752442B2 (en) 2001-11-09 2004-06-22 Speedfam-Ipec Corporation Workpiece handling end-effector and a method for processing workpieces using a workpiece handling end-effector
DE10162597C1 (de) * 2001-12-19 2003-03-20 Wacker Siltronic Halbleitermat Verfahren zur Herstellung beidseitig polierter Halbleiterscheiben
KR100470228B1 (ko) * 2001-12-31 2005-02-05 두산디앤디 주식회사 화학기계적 연마장치의 캐리어 헤드
DE10208414B4 (de) * 2002-02-27 2013-01-10 Advanced Micro Devices, Inc. Vorrichtung mit einem verbesserten Polierkissenaufbereiter für das chemisch mechanische Polieren
JP3714268B2 (ja) * 2002-03-18 2005-11-09 ソニー株式会社 ロボット装置
KR100487546B1 (ko) * 2002-09-11 2005-05-03 삼성전자주식회사 반도체 웨이퍼를 연마하기 위한 설비
US20070205112A1 (en) * 2004-08-27 2007-09-06 Masako Kodera Polishing apparatus and polishing method
TW200613092A (en) * 2004-08-27 2006-05-01 Ebara Corp Polishing apparatus and polishing method
JP2007144564A (ja) * 2005-11-28 2007-06-14 Ebara Corp 研磨装置
DE102009047927A1 (de) 2009-10-01 2011-01-27 Siltronic Ag Läuferscheibe und Verfahren zur Politur einer Halbleiterscheibe
TWI639486B (zh) 2018-05-31 2018-11-01 國立清華大學 全向整合式調節裝置

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59134650A (ja) * 1983-01-21 1984-08-02 Toshiba Corp 目詰除去装置
JPS6190868A (ja) * 1984-10-08 1986-05-09 Toshiba Corp 研磨装置
DE3625286A1 (de) * 1986-07-25 1988-02-04 Flier Gustav Schleifscheibenreinigung durch beaufschlagung des kuehlwassers mit ultraschall, insbesondere in anwendung fuer schleifmaschinen
JPH01187930A (ja) * 1988-01-22 1989-07-27 Nippon Telegr & Teleph Corp <Ntt> 研磨剤及び研磨方法
JP3173041B2 (ja) * 1991-05-15 2001-06-04 不二越機械工業株式会社 ドレッサー付きウェハー研磨装置及びその研磨布表面のドレッシング方法
JP2789153B2 (ja) * 1992-01-27 1998-08-20 マイクロン テクノロジー インコーポレイテッド マイクロスクラッチのない平滑面を形成するための半導体ウェハの化学機械的平坦化方法
US5329732A (en) * 1992-06-15 1994-07-19 Speedfam Corporation Wafer polishing method and apparatus
US5216843A (en) * 1992-09-24 1993-06-08 Intel Corporation Polishing pad conditioning apparatus for wafer planarization process
US5232875A (en) * 1992-10-15 1993-08-03 Micron Technology, Inc. Method and apparatus for improving planarity of chemical-mechanical planarization operations
US5653623A (en) * 1993-12-14 1997-08-05 Ebara Corporation Polishing apparatus with improved exhaust
US5486131A (en) * 1994-01-04 1996-01-23 Speedfam Corporation Device for conditioning polishing pads
JPH07237120A (ja) * 1994-02-22 1995-09-12 Nec Corp ウェーハ研磨装置
JP3550180B2 (ja) * 1994-04-28 2004-08-04 同和鉱業株式会社 ウェハの搬送方法および搬送装置
US5536202A (en) * 1994-07-27 1996-07-16 Texas Instruments Incorporated Semiconductor substrate conditioning head having a plurality of geometries formed in a surface thereof for pad conditioning during chemical-mechanical polish
US5522965A (en) * 1994-12-12 1996-06-04 Texas Instruments Incorporated Compact system and method for chemical-mechanical polishing utilizing energy coupled to the polishing pad/water interface
US5688364A (en) * 1994-12-22 1997-11-18 Sony Corporation Chemical-mechanical polishing method and apparatus using ultrasound applied to the carrier and platen
US5597346A (en) * 1995-03-09 1997-01-28 Texas Instruments Incorporated Method and apparatus for holding a semiconductor wafer during a chemical mechanical polish (CMP) process
US5868605A (en) * 1995-06-02 1999-02-09 Speedfam Corporation In-situ polishing pad flatness control
US5569062A (en) * 1995-07-03 1996-10-29 Speedfam Corporation Polishing pad conditioning

Also Published As

Publication number Publication date
EP0770454A1 (de) 1997-05-02
KR100440417B1 (ko) 2004-10-22
DE69619330D1 (de) 2002-03-28
JPH09117856A (ja) 1997-05-06
US5906754A (en) 1999-05-25
KR970023802A (ko) 1997-05-30
EP0770454B1 (de) 2002-02-20

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Legal Events

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8364 No opposition during term of opposition