DE69616257T2 - Einrichtung und Verfahren zur Montage von elektronischen Bauteilen - Google Patents

Einrichtung und Verfahren zur Montage von elektronischen Bauteilen

Info

Publication number
DE69616257T2
DE69616257T2 DE69616257T DE69616257T DE69616257T2 DE 69616257 T2 DE69616257 T2 DE 69616257T2 DE 69616257 T DE69616257 T DE 69616257T DE 69616257 T DE69616257 T DE 69616257T DE 69616257 T2 DE69616257 T2 DE 69616257T2
Authority
DE
Germany
Prior art keywords
electronic components
assembling electronic
assembling
components
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69616257T
Other languages
English (en)
Other versions
DE69616257D1 (de
Inventor
Ryoji Inutsuka
Kunio Ohe
Tomoyuki Nakano
Yoshiyuki Nagai
Hideo Sakon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Application granted granted Critical
Publication of DE69616257D1 publication Critical patent/DE69616257D1/de
Publication of DE69616257T2 publication Critical patent/DE69616257T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H05K13/0069—Holders for printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/085—Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level
    • H05K13/0857—Product-specific machine setup; Changeover of machines or assembly lines to new product type
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S269/00—Work holders
    • Y10S269/903—Work holder for electrical circuit assemblages or wiring systems
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53265—Means to assemble electrical device with work-holder for assembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53961—Means to assemble or disassemble with work-holder for assembly

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
DE69616257T 1995-12-18 1996-12-16 Einrichtung und Verfahren zur Montage von elektronischen Bauteilen Expired - Fee Related DE69616257T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP32932295A JP3377351B2 (ja) 1995-12-18 1995-12-18 電子部品実装機

Publications (2)

Publication Number Publication Date
DE69616257D1 DE69616257D1 (de) 2001-11-29
DE69616257T2 true DE69616257T2 (de) 2002-06-27

Family

ID=18220169

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69616257T Expired - Fee Related DE69616257T2 (de) 1995-12-18 1996-12-16 Einrichtung und Verfahren zur Montage von elektronischen Bauteilen

Country Status (5)

Country Link
US (3) US5937513A (de)
EP (1) EP0782378B1 (de)
JP (1) JP3377351B2 (de)
DE (1) DE69616257T2 (de)
SG (1) SG71687A1 (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3377351B2 (ja) * 1995-12-18 2003-02-17 松下電器産業株式会社 電子部品実装機
JP3560722B2 (ja) * 1996-03-12 2004-09-02 松下電器産業株式会社 基板搬送方法及び装置
JP4425357B2 (ja) * 1998-06-30 2010-03-03 パナソニック株式会社 部品実装装置
JP2000216596A (ja) * 1999-01-25 2000-08-04 Sanyo Electric Co Ltd 電子部品自動装着装置
JP2002050896A (ja) * 2000-08-03 2002-02-15 Sony Corp 部品把持位置補正装置および補正方法
KR100406059B1 (ko) * 2001-06-22 2003-11-17 미래산업 주식회사 트레이 피더용 트랜스퍼
US6711796B2 (en) * 2001-10-11 2004-03-30 Anderson Industrial Corp. Circuit board stripper
WO2005051066A1 (ja) * 2003-11-21 2005-06-02 Fuji Machine Mfg. Co., Ltd. バックアップ装置における基板支持ユニット、その製造方法、そのユニットを備えた機器、およびその機器における基板支持ユニットの交換方法
US8156642B2 (en) * 2007-04-03 2012-04-17 Panasonic Corporation Component mounting method
DE102007028931B3 (de) * 2007-06-22 2009-02-26 Siemens Ag Rüstsystem zum Be- und Entladen von Unterstützungs-Stifen für Substrate in und aus einem Bestückautomaten zur Bestückung der Substrate mit Bauelementen
JP4835573B2 (ja) * 2007-10-26 2011-12-14 パナソニック株式会社 基板搬送装置および基板搬送方法
US20090255426A1 (en) * 2008-02-14 2009-10-15 Illinois Tool Works Inc. Method and apparatus for placing substrate support components
DE102009041725A1 (de) 2009-09-16 2010-10-28 Siemens Electronics Assembly Systems Gmbh & Co. Kg Unterstützungssystem für Substrate, die zur Bestückung mit Bauelementen durch einen Bestückautomaten vorgesehen sind
DE102009052458A1 (de) 2009-11-09 2011-05-12 Siemens Aktiengesellschaft Unterstützung für zur Bestückung mit Bauelementen vorgesehene Substraten
EP3051933B1 (de) 2013-09-24 2018-08-29 Fuji Machine Mfg. Co., Ltd. Befestigungsvorrichtung
WO2018127956A1 (ja) * 2017-01-05 2018-07-12 株式会社Ｆｕｊｉ 部品実装ラインの管理システム
CN114516011B (zh) * 2022-03-07 2024-05-07 浙江工业大学之江学院 一种u形护颈枕辅助装配装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4131270A (en) * 1977-04-22 1978-12-26 Ecolaire Incorporated Means for positioning steam condenser tube support plates
US4331325A (en) * 1980-04-11 1982-05-25 General Battery Corporation Basket design
DE3410130C1 (de) * 1984-03-20 1985-10-10 Philips Patentverwaltung Gmbh, 2000 Hamburg Werkstuecktraeger fuer Leiterplatten
US5190273A (en) * 1987-12-10 1993-03-02 Sz S.R.L. Pallet with adjustable anchorage system for equipping the clamping fixture of a rough piece to be machined with machine tools
US5218753A (en) * 1989-06-22 1993-06-15 Sanyo Electric Co., Ltd. Assembling apparatus using back up pins for supporting printed circuit board
JPH04186862A (ja) * 1990-11-21 1992-07-03 Tokyo Electron Sagami Ltd キャリア内基板の検出装置
US5240746A (en) * 1991-02-25 1993-08-31 Delco Electronics Corporation System for performing related operations on workpieces
US5465470A (en) * 1994-08-31 1995-11-14 Lsi Logic Corporation Fixture for attaching multiple lids to multi-chip module (MCM) integrated circuit
JPH08118175A (ja) * 1994-10-21 1996-05-14 Imao Corp:Kk 取付用ベース部材及びそのベース部材に取り付けられる取付具
US5669599A (en) * 1995-11-03 1997-09-23 Harris Corporation Magnetic boats
JP3377351B2 (ja) * 1995-12-18 2003-02-17 松下電器産業株式会社 電子部品実装機
DE19654385C1 (de) * 1996-12-24 1998-08-06 Theo Fuchs Brenngutträger für das zahntechnische Labor

Also Published As

Publication number Publication date
EP0782378B1 (de) 2001-10-24
EP0782378A3 (de) 1998-05-20
US6219897B1 (en) 2001-04-24
SG71687A1 (en) 2000-04-18
EP0782378A2 (de) 1997-07-02
US5937513A (en) 1999-08-17
DE69616257D1 (de) 2001-11-29
US20010000366A1 (en) 2001-04-26
JP3377351B2 (ja) 2003-02-17
JPH09172298A (ja) 1997-06-30

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee