WO2005051066A1 - バックアップ装置における基板支持ユニット、その製造方法、そのユニットを備えた機器、およびその機器における基板支持ユニットの交換方法 - Google Patents
バックアップ装置における基板支持ユニット、その製造方法、そのユニットを備えた機器、およびその機器における基板支持ユニットの交換方法 Download PDFInfo
- Publication number
- WO2005051066A1 WO2005051066A1 PCT/JP2004/016503 JP2004016503W WO2005051066A1 WO 2005051066 A1 WO2005051066 A1 WO 2005051066A1 JP 2004016503 W JP2004016503 W JP 2004016503W WO 2005051066 A1 WO2005051066 A1 WO 2005051066A1
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- substrate
- unit
- information
- board
- supporting
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
- H05K13/0069—Holders for printed circuit boards
Definitions
- Substrate support unit in a backup device method for manufacturing the same, equipment equipped with the unit, and method for replacing the substrate support unit in the equipment
- the present invention relates to a backup device for supporting a substrate, and more particularly, to a substrate support unit constituting the backup device. Background technology,
- a backup apparatus which constitutes an electronic component mounter for mounting components on a substrate and supports the substrate.
- One type of back-up wrapper has a plurality of back-up pins, which are to support the board from the back side when mounting electronic components, and are removably planted in a large number of pin holes formed in the back-up board. .
- the position of the backup pin was changed in accordance with the change in the type of substrate to be produced.
- the position of the backup pin that can support the board is determined according to the type of the board, and the determined pin placement position is displayed on a display unit or printed on a printer.
- the pin setting position is indicated to the operator by lighting the pin hole at the pin setting position. Then, the worker has planted the backup pin at the designated pin planting position (Patent Document 1).
- Patent Document 1 is Japanese Patent Application Laid-Open No. 6-169198 (pages 3, 4; FIGS. 1-3).
- the present invention has been made in order to solve the above-described problems, and provides a board support unit that can be accurately and reliably set in a backup device according to a board type to be produced and an electronic component mounting machine.
- the purpose is to: Disclosure of the invention
- the present invention relates to a substrate support unit that is detachably attached to a backup device that supports a substrate and supports the substrate, wherein the substrate support unit has ID information for identifying itself that is distinguished from other substrate support units. It is a cut.
- the operator when performing a setup change operation in accordance with a change in the type of a substrate to be supported, the operator uses the ID information to identify a substrate support tub corresponding to the type of the substrate to be supported from among a large number of substrate support units. It can be selected and mounted without fail. In addition, it is possible to reliably detect improper mounting of the board support unit by referring to the ID information, so make sure that the appropriate board support unit is mounted on the supporting board. be able to.
- ID information is recorded on a recording medium, and the recording medium is provided on the substrate supporting unit. According to this, ID information can be easily added to the substrate support unit.
- the ID information is stored in a readable and writable storage medium, and the storage medium is provided in the substrate support unit. According to this, the ID information can be easily added to the substrate supporting unit, and the information can be easily read, written, erased, and added.
- the ID information of the substrate support unit is added as cut-specific information created in association with the production program information of the substrate supported by the substrate support unit. Have been. According to this, not only the ID information but also the production program information of the substrate supported by the substrate supporting unit is added to the substrate supporting unit, so that information on the substrate supporting unit can be easily obtained from the substrate supporting unit. Obtainable.
- the present invention relates to a method for manufacturing a substrate support unit that constitutes an electronic component mounter that mounts components on a substrate and is detachably attached to a backup device that supports the substrate and supports the substrate.
- the unit-specific information creation process for creating unit-specific information by associating the ID information of the board support unit with the board with the production program information of the board supported by the board support unit, and the support unit installation process An information adding step of adding unit-specific information created by unit-specific information to the substrate supporting unit on which the support unit is installed. is there.
- the position according to the production program information in the support part installation process A board support unit with a support section is created in the board support unit, and the board support unit is supported by the board support unit ID information created in the support section installation step in the unit unique information creation step.
- Unit-specific information is created by associating the board production program information, and unit-specific information created with unit-specific information is added to the board support unit created in the support section installation step in the information addition step Is done. Therefore, unit-specific information corresponding to the production program information can be reliably added to the substrate support unit corresponding to the production program information.
- the present invention provides an electronic device for mounting components on a substrate supported by a substrate supporting unit selected from a plurality of different substrate supporting units detachably attached to a backup device supporting the substrate.
- a substrate supporting unit selected from a plurality of different substrate supporting units detachably attached to a backup device supporting the substrate.
- each board support unit is an electronic component mounter to which ID information for identifying itself is added separately from other board support units.
- the operator when performing a setup change operation in accordance with a change in the type of board to be produced, uses the board support unit corresponding to the type of board to be produced from a large number of board support kits as ID information. It can be selected and mounted based on the reliability. In addition, it is possible to reliably detect improper mounting of the board support unit by referring to the ID information, so make sure that the appropriate board support unit is mounted on the board to be produced. can do.
- the present invention provides an electronic device for mounting components on a substrate supported by a substrate supporting unit selected from a plurality of different substrate supporting units detachably attached to a backup device supporting the substrate.
- Unit-specific information consisting of ID information of the support unit and production program information of the substrate supported by the support substrate unit
- the unit unique information obtaining step for acquiring the board supporting unit, and the board supporting unit ID information is notified based on the unit unique information acquired in the unit unique information acquiring step, and the board used for the electronic component mounting machine is obtained.
- An ID information instruction step of instructing a support unit, and a method of exchanging a substrate support unit of an electronic component mounting machine having the steps of:
- the electronic component mounting machine when performing a setup change in accordance with a change in the type of a board to be produced, performs a unit support unit corresponding to a board to be produced next in the unit-specific information acquisition process. Obtain the unique information, and specify the board support unit to be mounted on the backup device in the ID information specifying step. Therefore, the operator can surely select a board support kit corresponding to the type of board to be produced from a large number of board support units based on the instructed ID information and mount it on the backup device. it can.
- a warning process is provided to warn if this is judged.
- the electronic component mounter when performing a setup change in accordance with a change in the type of board to be produced, the electronic component mounter reads the ID information added to the board support unit in the ID information reading step, and in the suitability judgment step.
- the read ID information is compared with the previously acquired ID information to judge the propriety, and if it is judged “No” in the propriety judgment step in the warning step, a warning is given to that effect. Therefore, by referring to the ID information, it is possible to reliably detect erroneous mounting of the board support unit and to make sure that the appropriate board support unit is mounted on the board to be produced. As a result, it is possible to reliably prevent erroneous attachment of the substrate support unit to the backup device.
- FIG. 1 is a schematic diagram showing an electronic component mounting line including an electronic component mounting machine equipped with a backup device to which an embodiment of a substrate support unit according to the present invention is applied.
- FIG. 1 is a perspective view showing the entire structure of the electronic component mounter shown in FIG. 1
- FIG. 3 is a cross-sectional view of the backup device shown in FIG. 2
- FIG. 5 is a conceptual diagram showing a manufacturing process of the substrate supporting unit shown in FIG. 5
- FIG. 5 is a diagram showing unit-specific information of the substrate supporting unit shown in FIG. 3
- FIG. FIG. 7 is a functional block diagram showing the electronic component mounter shown in FIG. 7,
- FIG. 7 is a flowchart showing a program executed by the control device shown in FIG. 6, and
- FIG. 6 is a flowchart showing a program executed by the control device shown in FIG. BEST MODE FOR CARRYING OUT THE INVENTION
- FIG. 1 shows the outline of the electronic component mounting line A
- Fig. 2 shows the overall structure of the electronic component mounting machine
- Fig. 3 mainly shows the cross section of the backup device.
- FIG. 2 shows a state in which two child component mounters are mounted on one stand.
- the electronic component mounting line A is configured by arranging first to fourth electronic component mounters 11 to 14, that is, four electronic component mounters 20 in a row. Upstream of the first electronic component mounting machine 11 and downstream of the fourth electronic component mounting machine 14, respectively, a loading shift device for loading the tomb plate S into the first electronic component mounting machine 11. 15 and an unloading shift device 16 for unloading the substrate S from the fourth electronic component mounter 14.
- Each of the electronic component mounters 11 to 14 has a control device 70 (described later), and each control device is connected to a host computer 18 via a local network LAN 17 so as to be able to communicate with each other. Have been.
- the host computer 18 mainly controls the operation of each of the electronic component mounting machines 20 and also controls the operation of each of the electronic component mounting machines 20.
- the unit 41 creates and stores unit-specific information (described later).
- the board type refers to the type of product produced as a result of mounting the component on the board.
- the type of component to be mounted (even if the board has the same shape and size) If any one of the size, number, position, and direction is different, they are considered as boards of different types.
- the electronic component mounter 20 is a so-called double-tracker-type electronic component mounter, and is provided on the base 21 to transfer the substrate S.
- the transport device 30, a backup device 40 that positions and fixes the transported substrate S in cooperation with the substrate transport device 30, and the electronic components to be mounted on the substrate S provided on one side of the substrate transport device 30.
- the component supply device 50 to be supplied, and the electronic components supplied by the component supply device 50 which are disposed above the devices 30, 40, 50 are suction-held by the mounting head 64.
- a component mounting device 60 is provided for automatically mounting the substrate S held and held on the substrate S positioned and supported on the substrate transfer device 30.
- the substrate transport device 30 transports the substrate S in a predetermined direction (the X direction in FIG. 2).
- the first conveyors 31 extend in the transport direction and
- the first and second guide rails 31a, 31b are provided with first and second guide rails 31a, 3lb arranged in parallel and opposite to each other, and the first and second guide rails 31a, 31b.
- Guide S in the transport direction.
- locking portions 31a1 and 31b1 projecting inward are provided along the longitudinal direction. (See Figure 3).
- the first compressor 31 has first and second compensators provided in parallel with each other immediately below the first and second guides 31a and 31b. Labels 31c and 3Id are provided side by side.
- the first and second comparators 31c and 31d support the substrate S and transport it in the transport direction.
- the first guide 31 1 a and the first conveyor 31 1 c of the first conveyor 31 mainly have a base 21 1 at a lower end as shown in FIG. It is attached to an elongated first attachment frame 31 f extending in the X-axis direction, the ends of which are fixed to the upper ends of a pair of fixed support frames 31 e fixed to each other. Also, the second guide Reynole 31 b and the second conveyor 31 d of the first conveyor 31 are sliders 3 that can move on a pair of rails 22 whose lower ends are fixed to the base 21. It is attached to an elongated second mounting frame 31 h extending in the X-axis direction, both ends of which are fixed to the upper end of the moving support frame 31 g fixed to 1 k.
- the second guide rail 3 lb is moved and fixed in position in the direction (Y direction) orthogonal to the transport direction together with the second conveyor belt 31 d immediately below, so that the first conveyor rail 3 lb is fixed.
- 1 can change the conveyor width according to the width of the substrate S to be transported.
- the first and second mounting frames 31 f and 31 h are respectively connected to the lower surfaces of the first and second conveyor belts 31 c and 31 d to support the first and second mounting belts.
- Support plates 3 1 i and 3 1 j are attached.
- the second conveyor 32 has the same structure as the first conveyor 31 except that the first mounting frame 32 f is movable. That is, as shown in FIG. 2, the second conveyor 31 has first and second guide rails 3 2 a ′ 3 2 which extend in the transport direction and are placed opposite to each other in parallel with each other. b, and the first and second guide rails 32 a and 32 b guide the substrate S in the transport direction, respectively. At the upper ends of the first and second guide rails 32a and 32b, engaging portions (not shown) projecting inward are provided in the longitudinal direction. .
- the second conveyor 32 has first and second conveyor belts (not shown) provided in parallel with each other immediately below the first and second guide rails 3'2a and 32b. ) Are installed side by side. The first and second conveyor belts support the substrate S and transport it in the transport direction.
- the first guide 32a and the first conveyor of the second conveyor 32 can move on a pair of rails 22 whose lower ends are fixed to the base 21 as shown in FIG. It is attached to an elongated first attachment frame 32 f extending in the X-axis direction, both ends of which are fixed to the upper end of a movable support frame 32 g fixed to the slider 32 k.
- the second guide rail 3 2b and the second conveyor of the first conveyor 3 1 are a slider 3 that can move on a pair of rails 22 whose lower ends are fixed to the base 21. It is attached to an elongated second attachment frame 32h extending in the X-axis direction, both ends of which are fixed to the upper end of a movable support frame 32g fixed to 2k.
- the first and second guide rails 32a and 32b move in the direction (Y direction) orthogonal to the transport direction together with the first and second conveyor belts immediately below. Since the positioning is fixed, the second conveyor 32 can change its width in accordance with the width of the substrate S to be transferred.
- the base 21 is provided with a backup device 40 that pushes up and clamps (positions and supports) the substrate S transported to a predetermined mounting position by the substrate transport device 30.
- the backup device 40 A substrate support unit 41 for supporting the substrate S and an elevating device 42 for raising and lowering the substrate support unit 41 are provided.
- the substrate support unit 41 is set up in a rectangular backup plate 41a with a large number of planting holes 41a1 formed on the top surface, and is detachably planted in the planting holes 41a1. It is composed of a backup pin 41b which is a support part for supporting the substrate S.
- the lifting device 42 is composed of an air cylinder, and a rod 42 a in which the four corners of the backup plate 41 a are detachably mounted, and a cylinder for moving the rod 42 a forward and backward.
- the body consists of 4 2 b.
- the backup device 40 thus configured holds the board supporting unit 41 in the lowered position (indicated by a two-dot chain line in FIG. 3) when components are not mounted, and
- the substrate supporting unit 41 is raised by the elevating device 42 to lift the substrate S. Push up from below and hold it in the raised position (indicated by the solid line in Fig. 3), and maintain that state until component mounting is completed.
- the board supporting unit 41 is lowered again to the lowered position.
- FIG. 4 conceptually shows a manufacturing process of the substrate supporting unit 41
- FIG. 5 shows a database of information unique to each unit of the substrate supporting unit.
- the production plan PLA is designed to produce a board type A, a board type B, a board type C, and a board type C in the order of ⁇ , and each board type has a production program corresponding to the board type, ie, a board type. It consists of production programs PRXA, PRXB, PRXC,. These production plans PLA and production programs PRXA, PRXB, PRXC,-. It is stored in the computer 18.
- the production program shows the board information (board size, etc.), component information (mounted components, their mounting coordinates), and production information (the mounting order of the components) of the board type to be produced.
- the worker divides the production program stored in the host computer 18 using the host computer 18 so as to correspond to each electronic component mounting machine constituting the electronic component mounting line A.
- the production program PRXA is divided into production programs PRXA_M1 to PRXA-M4 corresponding to the first to fourth electronic component mounting machines 11 to 14.
- the worker sets the backup pins 4 1b based on the divided production program, that is, the type of board to be produced, the components to be mounted, the mounting coordinates thereof, and the electronic component mounting machine to be mounted. Plant on 1a (support section installation process).
- the position where the backup pin 41b is to be erected if the component is already mounted on the back side of the substrate s that is supported by contacting the backup pin 41b force S, avoid the mounted component and back up. It is preferable to determine the position of pin 41b, and further determine the planting position in consideration of the following conditions.
- each board supporting unit 41 to be mounted on each electronic component mounter is created.
- the unit-specific information includes at least ID information for identifying itself in distinction from the other substrate support units 41.
- the unit-specific information preferably includes production program information of the substrate supported by the substrate support unit 41. In this case, the unit-specific information is created by associating the production program information with the ID information of the substrate support unit.
- the production program information may be an ID of the production program or information required in the production program, for example, an ID of a board type.
- the recording medium 43 for example, there is a recording medium such as a label, a sticker, a force, a plate, etc., which can be recorded by printing, and a recording medium made of paper, a plastic, or a metal.
- the unit-specific information is converted into a bar code, a two-dimensional code, and a numerical value, and is printed on a recording medium 43 (a label in the present embodiment). Pasted.
- the unit-specific information is created as follows (unit-specific information creation step). First, an appropriate ID (ID information) to be given to the created substrate support unit 41 is input to the host computer 18. It may be automatically provided by the host computer 18. Next, the host computer 18 inputs the production program corresponding to the board support unit 41 and the number of the corresponding electronic component mounter in association with the ID of the board support unit 41, respectively. Then, the host computer 18 creates and stores unity-specific information by associating the ID of the substrate support unit, the corresponding production program, and the number of the corresponding electronic component mounter with each other. The host computer 18 converts the created unit-specific information into a bar code, a two-dimensional code, or a numerical value and prints it on the recording medium 43. In this way, unit-specific information of all the substrate support units 41 is created and stored in the host computer 18.
- BU001 is input as the ID of the board supporting unit 41M1 to be mounted on the first electronic component mounter 11, and the corresponding program is PRXA (PRXA—Ml) is input, and Ml is input as the number of the corresponding electronic component mounter.
- the host computer 18 creates and stores one unit-specific information by associating the inputted information.
- the first electronic part B is also mounted on the mounter 11 for each of the board support units 41M2 to 41M4 mounted on the second to fourth electronic component mounters 12 to 14
- the ID of each substrate support unit 41M2 to 41M4 is BUO02 to BU004 Force S
- the corresponding program is PRXA.
- PRXA—M2 to PRXA_M4 are input as M2 to M4 as the numbers of the corresponding electronic component mounters.
- the host computer 18 creates and stores each cut-specific information of the board support cut by associating the input information. ⁇
- the unit-specific information may include related information for associating the ID of the related board support unit and the electronic component mounting machine.
- the unit-specific information of the plate support unit 41 M 1 with the ID of BUO 01 contains the related electronic component mounters in the same production program, that is, the second to fourth electronic component mounters 12.
- the ID of each board support unit 41M2 to 41M4 used for ⁇ 14 and the number of the corresponding electronic component mounter may be associated.
- the board support tuses of the same group used in the same electronic component mounting line are separated, it is possible to search for the related information.
- the substrate supporting unit created as described above has a storage shelf provided with a recording medium similar to the recording medium 43 described above in which the same unit-specific information as the substrate supporting unit is recorded. Stored in And raw They are taken out of the shelves according to the type of board to be produced and used.
- the electronic component mounter 20 is provided with a component supply device 50 on one side of the substrate transfer device 30.
- the component supply device 50 has a large number of detachable components.
- the cassette type feeder (part supply cassette) 51 is installed side by side. It has a cassette-type feeder 5 If, a main unit 5 la, a supply reel 51 b provided at the rear of the main unit 51 a, and a component take-out unit 51 c provided at the tip of the main unit 51 a. .
- On the supply reel 51b an elongate tape (not shown) in which electronic components are sealed at a predetermined pitch is wound and held, and the tape is drawn out at a predetermined pitch by a sprocket (not shown). The products are released from the sealed state and are sequentially sent to the parts extraction section 51c.
- the component supply device 50 is not only a cassette type, but also a tray type in which electronic components are arranged on a tray.
- the electronic component mounter 20 is provided with a component mounting device 60 above the board transfer device 30.
- the component mounting device 60 is of the ⁇ port type, and includes a Y-direction moving slider 62 that is moved in the Y-direction by a Y-axis servo motor 61.
- the Y-direction moving slider 62 is provided with an X-direction moving slider 63 that is moved in a horizontal X direction orthogonal to the Y direction by an X-axis servomotor (not shown).
- the moving slider 63 is provided with a mounting head 64 that is supported so as to be able to move up and down in the X direction and the Z direction perpendicular to the “Y” direction and is controlled to move up and down by a servomotor via a pole screw.
- the mounting head 64 has a suction nozzle 65 (see Fig. 1) that protrudes downward from the mounting head 64 and holds the electronic component at the lower end, and recognizes the board position. For this reason, a board imaging force meter 66 (see FIG. 3) is attached as an imaging device for imaging the board.
- the electronic component mounter 20 configured as described above has the following features.
- the control device 70 has a microcomputer (not shown), and the microcomputer has an input / output interface, a CPU, a RAM, and a ROM (all of which are shown) connected via a bus. (Omitted).
- the CPU executes a predetermined program to control the mounting of electronic components on the board, and executes a program corresponding to the flowchart shown in FIG. 8 to support the board for the next production. Encourage replacement of the unit or determine if the set support board unit is appropriate.
- the RAM temporarily stores variables necessary for executing the program
- the ROM stores the program.
- the control device 70 includes an input device 71, an imaging device (substrate imaging camera) 66, a communication device 72, a storage device 73, a substrate transport device 30, a backup device 40, and a component mounting device 60.
- the component supply device 50 and the output device 74 are connected.
- the input device 71 is used when the start switch for starting the operation of the electronic component mounting machine 20, the stop switch for stopping the electronic component mounter 20, and the setting of the board support unit 41 to the knockup device 40 are completed. And a set completion switch to be recognized by the electronic component mounter 20 (see Fig. 2).
- the communication device 72 is for connecting each other to an external device, and is connected to the host computer 18 via the LAN 17.
- the storage device 73 stores a system program for controlling the entire device, a control program for individually controlling each element of the device on the system program, and a production program transmitted from the host computer 18.
- the output device 74 displays status information, warnings, and the like of the electronic component mounter 20.
- the controller 70 drives the component mounting device 60 to cause the backup device 40 to operate.
- the imaging device 66 is moved onto the recording medium 43 attached to the substrate supporting unit set in the unit, and the ID of the substrate supporting unit is acquired by capturing the image specific to the recording medium 43. Read it (steps 208 to 210).
- the controller 70 compares the read board support unit ID with the ID information previously obtained from the host computer 18 and if both IDs are the same, the appropriate board support unit is set. It is determined that the change has been completed, and the fact that the setup change has been completed is displayed on the output device 74 (steps 2 12 and 2 14).
- the substrate support unit 41 has ID information for identifying itself that is distinguished from other substrate support units 41. Therefore, in the changeover work that accompanies a change in the type of board to be produced, workers are required to work with many board support units 41. Thus, the board support unit 41 corresponding to the board type to be produced can be reliably selected and mounted based on the ID information. In addition, since incorrect mounting of the board supporting unit 41 can be reliably detected by referring to the ID information, it is ensured that the appropriate board supporting unit 41 is mounted on the board to be produced. Can be confirmed.
- ID information can be easily added to the substrate support unit 41.
- ID information not only the ID information but also the production program information of the substrate supported by the substrate supporting unit is added to the substrate supporting unit 41, so that information on the substrate supporting unit 41 can be easily obtained from the substrate supporting unit 41. Can be obtained.
- the board support unit 41 with the backup pins 41b installed at the position corresponding to the production program information is created in the support section installation process, and the unit-specific information is created.
- Unit creation information is created by associating the ID information of the board support unit 41 created in the support part installation step with the production program information of the board supported by the board support unit 41 in the creation process. Then, in the information adding step, the unit-specific information created by the unit-specific information is added to the board supporting unit created in the supporting section setting step. Therefore, unit-specific information corresponding to the production program information can be reliably added to the board support unit 41 corresponding to the production program information.
- the electronic component mounter 20 acquires unit-specific information on the board support unit 41 corresponding to the next board to be produced. (Step 102), the ID of the substrate support unit 41 to be mounted on the backup device 40 is specified (Step 206). Therefore, the operator is instructed to specify the board supporting unit 41 corresponding to the type of the board to be produced from the large number of board supporting units 41. The information can be reliably selected and attached to the backup device 40 based on the information. Further, the electronic component mounter 20 reads the ID information added to the board support unit 41 mounted on the backup device 40 (step 210), and acquires the read ID information first.
- Step 2 12 It is compared with certain ID information to judge the suitability (Step 2 12), and if it is judged “No” in Step 2 L2, a warning is given (Step 2 14). Therefore, by referring to the ID information, it is possible to reliably detect erroneous mounting of the board supporting unit 41 and to confirm that the appropriate board supporting unit 41 is mounted on the board to be produced. Therefore, erroneous mounting of the substrate support unit 41 on the backup device 40 can be reliably prevented.
- the present invention is applied to the substrate supporting unit 41 which is detachably attached to the backup device 40 of the electronic component mounting machine 20 and supports the substrate.
- the present invention can be applied to a backup device 40, for example, a substrate support unit 41 that is detachably attached to a backup device of a print substrate printing machine and supports a substrate.
- the operator selects the substrate support unit corresponding to the type of the substrate to be supported from among the many substrate support units based on the ID information. ⁇ It can be selected and installed. Also, erroneous mounting of the board support unit can be reliably detected by referring to the ID information, so make sure that the appropriate board support hut is mounted on the board to be supported. Can be.
- the ID information is recorded on the recording medium 43.
- the ID information is stored on a readable and writable storage medium, and this storage medium is attached to the board support unit 41. You may. Examples of the storage medium include a RAM and an IC chip. According to this, the ID information can be easily added to the board support unit 41, and furthermore, the information can be added. Information can be easily read, written, erased, and added.
- the support portion of the backup device 40 is configured by the backup pin.
- the support portion of the backup device 40 may be configured by a block-shaped support portion.
- the apparatus may be of a vacuum backup type with substrate suction by vacuum.
- the host computer is used to create the substrate support cut, and the unique information is created and stored.
- a dedicated computer for managing the unit (computer for managing the board support unit) may be separately provided to create the board support unit, and the unit-specific information may be created and stored. .
- the board supporting unit according to the present invention since the board supporting unit according to the present invention has ID information for identifying itself which is distinguished from other board supporting units, it depends on the type of board to be produced and the electronic component mounting machine. It is suitable for setting the backup device properly and accurately.
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Description
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JP2005515578A JPWO2005051066A1 (ja) | 2003-11-21 | 2004-11-01 | バックアップ装置における基板支持ユニット、その製造方法、そのユニットを備えた機器、およびその機器における基板支持ユニットの交換方法 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012023113A (ja) * | 2010-07-13 | 2012-02-02 | Panasonic Corp | 電子部品実装装置及び電子部品実装装置における下受けユニット交換方法 |
WO2015045002A1 (ja) | 2013-09-24 | 2015-04-02 | 富士機械製造株式会社 | 実装装置 |
WO2016203637A1 (ja) * | 2015-06-19 | 2016-12-22 | 富士機械製造株式会社 | 部品実装システム |
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JPH09172298A (ja) * | 1995-12-18 | 1997-06-30 | Matsushita Electric Ind Co Ltd | 電子部品実装機 |
JP2001313499A (ja) * | 2000-05-01 | 2001-11-09 | Nec Corp | 基板固定装置、およびそのピン取付方法 |
JP2002543602A (ja) * | 1999-04-30 | 2002-12-17 | シーメンス アクチエンゲゼルシヤフト | 自動装着機の作動方法、自動装着機、自動装着機用の交換可能なコンポーネント、並びに自動装着機と交換可能なコンポーネントとからなるシステム |
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2004
- 2004-11-01 WO PCT/JP2004/016503 patent/WO2005051066A1/ja active Application Filing
- 2004-11-01 JP JP2005515578A patent/JPWO2005051066A1/ja active Pending
Patent Citations (3)
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JPH09172298A (ja) * | 1995-12-18 | 1997-06-30 | Matsushita Electric Ind Co Ltd | 電子部品実装機 |
JP2002543602A (ja) * | 1999-04-30 | 2002-12-17 | シーメンス アクチエンゲゼルシヤフト | 自動装着機の作動方法、自動装着機、自動装着機用の交換可能なコンポーネント、並びに自動装着機と交換可能なコンポーネントとからなるシステム |
JP2001313499A (ja) * | 2000-05-01 | 2001-11-09 | Nec Corp | 基板固定装置、およびそのピン取付方法 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012023113A (ja) * | 2010-07-13 | 2012-02-02 | Panasonic Corp | 電子部品実装装置及び電子部品実装装置における下受けユニット交換方法 |
WO2015045002A1 (ja) | 2013-09-24 | 2015-04-02 | 富士機械製造株式会社 | 実装装置 |
CN105580506A (zh) * | 2013-09-24 | 2016-05-11 | 富士机械制造株式会社 | 安装装置 |
JPWO2015045002A1 (ja) * | 2013-09-24 | 2017-03-02 | 富士機械製造株式会社 | 実装装置 |
US10104820B2 (en) | 2013-09-24 | 2018-10-16 | Fuji Corporation | Mounting machine |
CN105580506B (zh) * | 2013-09-24 | 2018-12-21 | 株式会社富士 | 安装装置 |
WO2016203637A1 (ja) * | 2015-06-19 | 2016-12-22 | 富士機械製造株式会社 | 部品実装システム |
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JPWO2005051066A1 (ja) | 2007-06-14 |
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