DE69611804D1 - Bildung eines isolierenden dünnen Filmes durch eine Vielzahl von Ionenstrahlen - Google Patents

Bildung eines isolierenden dünnen Filmes durch eine Vielzahl von Ionenstrahlen

Info

Publication number
DE69611804D1
DE69611804D1 DE69611804T DE69611804T DE69611804D1 DE 69611804 D1 DE69611804 D1 DE 69611804D1 DE 69611804 T DE69611804 T DE 69611804T DE 69611804 T DE69611804 T DE 69611804T DE 69611804 D1 DE69611804 D1 DE 69611804D1
Authority
DE
Germany
Prior art keywords
formation
thin film
large number
ion beams
insulating thin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69611804T
Other languages
English (en)
Inventor
Minshen Tan
Swie-In Tan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Read Rite Corp
Original Assignee
Read Rite Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Read Rite Corp filed Critical Read Rite Corp
Application granted granted Critical
Publication of DE69611804D1 publication Critical patent/DE69611804D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0021—Reactive sputtering or evaporation
    • C23C14/0036—Reactive sputtering
    • C23C14/0047—Activation or excitation of reactive gases outside the coating chamber
    • C23C14/0052—Bombardment of substrates by reactive ion beams
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08—Oxides
    • C23C14/081—Oxides of aluminium, magnesium or beryllium
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/46—Sputtering by ion beam produced by an external ion source
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C23C14/505—Substrate holders for rotation of the substrates
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
    • G11B5/8404—Processes or apparatus specially adapted for manufacturing record carriers manufacturing base layers
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/127—Structure or manufacture of heads, e.g. inductive
    • G11B5/187—Structure or manufacture of the surface of the head in physical contact with, or immediately adjacent to the recording medium; Pole pieces; Gap features
    • G11B5/23—Gap features
    • G11B5/232—Manufacture of gap
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/127—Structure or manufacture of heads, e.g. inductive
    • G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
    • G11B5/3109—Details
    • G11B5/313—Disposition of layers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physical Vapour Deposition (AREA)
  • Magnetic Heads (AREA)
  • Formation Of Insulating Films (AREA)
DE69611804T 1995-04-17 1996-04-12 Bildung eines isolierenden dünnen Filmes durch eine Vielzahl von Ionenstrahlen Expired - Lifetime DE69611804D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US42322795A 1995-04-17 1995-04-17

Publications (1)

Publication Number Publication Date
DE69611804D1 true DE69611804D1 (de) 2001-03-29

Family

ID=23678099

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69611804T Expired - Lifetime DE69611804D1 (de) 1995-04-17 1996-04-12 Bildung eines isolierenden dünnen Filmes durch eine Vielzahl von Ionenstrahlen

Country Status (4)

Country Link
US (1) US5962080A (de)
EP (1) EP0739001B1 (de)
JP (1) JPH08296042A (de)
DE (1) DE69611804D1 (de)

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GB2321063A (en) * 1997-01-08 1998-07-15 Oxford Plasma Technology Ltd Reactive particle beam sputtering
US6086727A (en) 1998-06-05 2000-07-11 International Business Machines Corporation Method and apparatus to improve the properties of ion beam deposited films in an ion beam sputtering system
US6214183B1 (en) * 1999-01-30 2001-04-10 Advanced Ion Technology, Inc. Combined ion-source and target-sputtering magnetron and a method for sputtering conductive and nonconductive materials
US6296741B1 (en) * 1999-06-25 2001-10-02 International Business Machines Corporation Method of making oxide barrier layer for a spin tunnel junction
US6783635B2 (en) * 1999-12-09 2004-08-31 International Business Machines Corporation Spin valve sensor free layer structure with a cobalt based layer that promotes magnetic stability and high magnetoresistance
US6853520B2 (en) 2000-09-05 2005-02-08 Kabushiki Kaisha Toshiba Magnetoresistance effect element
US6707647B2 (en) 2001-01-29 2004-03-16 International Business Machines Corporation Magnetic head with thin gap layers
US6679976B2 (en) 2001-03-16 2004-01-20 4Wave, Inc. System and method for performing sputter deposition with multiple targets using independent ion and electron sources and independent target biasing with DC pulse signals
US6402900B1 (en) * 2001-03-16 2002-06-11 4 Wave, Inc. System and method for performing sputter deposition using ion sources, targets and a substrate arranged about the faces of a cube
FR2856677B1 (fr) * 2003-06-27 2006-12-01 Saint Gobain Substrat revetu d'une couche dielectrique et procede pour sa fabrication
FR2857467B1 (fr) * 2003-07-09 2005-08-19 Saint Gobain Dispositif electrocommandable a proprietes optiques et/ou energetiques variables
US7374642B2 (en) * 2004-01-30 2008-05-20 Deutchman Arnold H Treatment process for improving the mechanical, catalytic, chemical, and biological activity of surfaces and articles treated therewith
JP4786331B2 (ja) 2005-12-21 2011-10-05 株式会社東芝 磁気抵抗効果素子の製造方法
JP4514721B2 (ja) 2006-02-09 2010-07-28 株式会社東芝 磁気抵抗効果素子の製造方法、磁気抵抗効果素子、磁気抵抗効果ヘッド、磁気記録再生装置及び磁気記憶装置
JP2007299880A (ja) 2006-04-28 2007-11-15 Toshiba Corp 磁気抵抗効果素子，および磁気抵抗効果素子の製造方法
JP4550777B2 (ja) 2006-07-07 2010-09-22 株式会社東芝 磁気抵抗効果素子の製造方法、磁気抵抗効果素子、磁気ヘッド、磁気記録再生装置及び磁気メモリ
JP4388093B2 (ja) 2007-03-27 2009-12-24 株式会社東芝 磁気抵抗効果素子、磁気ヘッド、磁気記録再生装置
US20090020415A1 (en) * 2007-07-16 2009-01-22 Michael Gutkin "Iontron" ion beam deposition source and a method for sputter deposition of different layers using this source
CN101765677B (zh) 2007-08-29 2012-01-25 佳能安内华股份有限公司 通过溅射的成膜方法及其溅射设备
JP5036501B2 (ja) * 2007-11-19 2012-09-26 小島プレス工業株式会社 基材の支持装置及びスパッタリング装置
JP5259626B2 (ja) * 2007-12-26 2013-08-07 キヤノンアネルバ株式会社 スパッタ装置、スパッタ成膜方法
JP5039006B2 (ja) 2008-09-26 2012-10-03 株式会社東芝 磁気抵抗効果素子の製造方法、磁気抵抗効果素子、磁気ヘッドアセンブリ及び磁気記録再生装置
JP5039007B2 (ja) 2008-09-26 2012-10-03 株式会社東芝 磁気抵抗効果素子の製造方法、磁気抵抗効果素子、磁気ヘッドアセンブリ及び磁気記録再生装置
JP2010080839A (ja) 2008-09-29 2010-04-08 Toshiba Corp 磁気抵抗効果素子の製造方法、磁気抵抗効果素子、磁気ヘッドアセンブリおよび磁気記録再生装置
CN101855381B (zh) 2008-12-22 2012-07-04 佳能安内华股份有限公司 溅射设备和膜沉积方法
JP5280459B2 (ja) 2008-12-25 2013-09-04 キヤノンアネルバ株式会社 スパッタリング装置
CN107723675A (zh) * 2017-11-17 2018-02-23 东莞颠覆产品设计有限公司 物理气相沉积设备和物理气相沉积方法
US20210080380A1 (en) * 2019-09-16 2021-03-18 Halliburton Energy Services, Inc. Customized Thin Film Optical Element Fabrication System and Method
CN113621929B (zh) * 2020-05-08 2023-04-11 武汉光谷创元电子有限公司 微波器件的制造设备和制造方法
GB2599393A (en) * 2020-09-30 2022-04-06 Dyson Technology Ltd Method and apparatus for sputter deposition

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US3889632A (en) * 1974-05-31 1975-06-17 Ibm Variable incidence drive for deposition tooling
JPS6115967A (ja) * 1984-06-29 1986-01-24 Sumitomo Electric Ind Ltd 表面処理方法
JPS61189669A (ja) * 1985-02-19 1986-08-23 Matsushita Electric Ind Co Ltd 薄膜トランジスタの製造方法
US4652954A (en) * 1985-10-24 1987-03-24 International Business Machines Method for making a thin film magnetic head
US4793908A (en) * 1986-12-29 1988-12-27 Rockwell International Corporation Multiple ion source method and apparatus for fabricating multilayer optical films
US4886681A (en) * 1987-01-20 1989-12-12 International Business Machines Corporation Metal-polymer adhesion by low energy bombardment
US4816133A (en) * 1987-05-14 1989-03-28 Northrop Corporation Apparatus for preparing thin film optical coatings on substrates
JPH01149474A (ja) * 1987-12-04 1989-06-12 Matsushita Electric Ind Co Ltd 薄膜トランジスタの製造方法
JP2629223B2 (ja) * 1988-01-07 1997-07-09 富士ゼロックス株式会社 電子写真感光体の製造方法
US4874493A (en) * 1988-03-28 1989-10-17 Microelectronics And Computer Technology Corporation Method of deposition of metal into cavities on a substrate
US4992298A (en) * 1988-10-11 1991-02-12 Beamalloy Corporation Dual ion beam ballistic alloying process
US4951604A (en) * 1989-02-17 1990-08-28 Optical Coating Laboratory, Inc. System and method for vacuum deposition of thin films
FR2644180B1 (fr) * 1989-03-08 1991-05-10 Commissariat Energie Atomique Dispositif pour recouvrir une surface plane d'une couche d'epaisseur uniforme
JP2713481B2 (ja) * 1989-12-04 1998-02-16 株式会社日立製作所 イオンビームスパッタによる多元系薄膜形成方法および多元系薄膜形成装置
US5301418A (en) * 1991-04-12 1994-04-12 U.S. Philips Corporation Method of manufacturing a magnetic head
US5240583A (en) * 1992-01-14 1993-08-31 Honeywell Inc. Apparatus to deposit multilayer films

Also Published As

Publication number Publication date
EP0739001B1 (de) 2001-02-21
JPH08296042A (ja) 1996-11-12
US5962080A (en) 1999-10-05
EP0739001A2 (de) 1996-10-23
EP0739001A3 (de) 1998-05-13

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Legal Events

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8332 No legal effect for de