DE69609377D1 - Apparat und Methode zur Inspektion von Halbleiterscheibenrändern - Google Patents

Apparat und Methode zur Inspektion von Halbleiterscheibenrändern

Info

Publication number
DE69609377D1
DE69609377D1 DE69609377T DE69609377T DE69609377D1 DE 69609377 D1 DE69609377 D1 DE 69609377D1 DE 69609377 T DE69609377 T DE 69609377T DE 69609377 T DE69609377 T DE 69609377T DE 69609377 D1 DE69609377 D1 DE 69609377D1
Authority
DE
Germany
Prior art keywords
inspection
semiconductor wafer
wafer edges
edges
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69609377T
Other languages
English (en)
Other versions
DE69609377T2 (de
Inventor
Leslie G Santon
Kenneth Krause
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SunEdison Inc
Original Assignee
SunEdison Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SunEdison Inc filed Critical SunEdison Inc
Application granted granted Critical
Publication of DE69609377D1 publication Critical patent/DE69609377D1/de
Publication of DE69609377T2 publication Critical patent/DE69609377T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Length Measuring Devices By Optical Means (AREA)
DE69609377T 1995-05-08 1996-04-17 Apparat und Methode zur Inspektion von Halbleiterscheibenrändern Expired - Fee Related DE69609377T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/436,840 US5592295A (en) 1995-05-08 1995-05-08 Apparatus and method for semiconductor wafer edge inspection

Publications (2)

Publication Number Publication Date
DE69609377D1 true DE69609377D1 (de) 2000-08-24
DE69609377T2 DE69609377T2 (de) 2000-12-07

Family

ID=23734030

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69609377T Expired - Fee Related DE69609377T2 (de) 1995-05-08 1996-04-17 Apparat und Methode zur Inspektion von Halbleiterscheibenrändern

Country Status (9)

Country Link
US (1) US5592295A (de)
EP (1) EP0742587B1 (de)
JP (1) JPH08340031A (de)
KR (1) KR100261832B1 (de)
CN (1) CN1142685A (de)
DE (1) DE69609377T2 (de)
MY (1) MY113745A (de)
SG (1) SG49948A1 (de)
TW (1) TW344111B (de)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100278807B1 (ko) * 1998-05-01 2001-01-15 신덕교 웨이퍼 검사 시스템
WO2000002236A2 (en) 1998-07-07 2000-01-13 Memc Electronic Materials, Inc. Radio frequency identification system and method for tracking silicon wafers
US6535628B2 (en) 1998-10-15 2003-03-18 Applied Materials, Inc. Detection of wafer fragments in a wafer processing apparatus
DE69800756T2 (de) * 1998-10-15 2001-08-09 Wacker Siltronic Halbleitermat Verfahren und Vorrichtung zum Detektieren, Überwachung und Charakterisierung von Kantendefekten in Halbleiterscheiben
US6062084A (en) * 1999-01-29 2000-05-16 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus for detecting wafer edge defects and method of using
US6306670B1 (en) * 1999-08-12 2001-10-23 Lucent Technologies Inc. Tool for handling a workpiece
US6545752B1 (en) 2000-07-07 2003-04-08 Daitron, Inc. Method and apparatus for detecting defects along the edge of electronic media
US6566673B1 (en) 2000-07-07 2003-05-20 Daitron Inc. Method and apparatus for detecting defects along the edge of electronic media
KR100403862B1 (ko) * 2001-01-26 2003-11-01 어플라이드비전텍(주) 반도체 웨이퍼 검사 장치 및 그 방법
US6865948B1 (en) * 2002-01-29 2005-03-15 Taiwan Semiconductor Manufacturing Company Method of wafer edge damage inspection
JP3629244B2 (ja) * 2002-02-19 2005-03-16 本多エレクトロン株式会社 ウエーハ用検査装置
US6785009B1 (en) * 2002-02-28 2004-08-31 Advanced Micro Devices, Inc. Method of using high yielding spectra scatterometry measurements to control semiconductor manufacturing processes, and systems for accomplishing same
KR100460807B1 (ko) * 2002-07-08 2004-12-09 삼성전자주식회사 반도체소자 제조설비의 웨이퍼 외관 검사장치와 이를이용하는 세정설비 및 그 검사방법
US7204669B2 (en) * 2002-07-17 2007-04-17 Applied Materials, Inc. Semiconductor substrate damage protection system
US7220034B2 (en) * 2003-07-11 2007-05-22 Rudolph Technologies, Inc. Fiber optic darkfield ring light
US6947588B2 (en) * 2003-07-14 2005-09-20 August Technology Corp. Edge normal process
US20050038554A1 (en) * 2003-07-14 2005-02-17 Cory Watkins Inspection and metrology module cluster tool
US7589783B2 (en) * 2003-07-14 2009-09-15 Rudolph Technologies, Inc. Camera and illumination matching for inspection system
US7340087B2 (en) * 2003-07-14 2008-03-04 Rudolph Technologies, Inc. Edge inspection
US8045788B2 (en) * 2003-07-14 2011-10-25 August Technology Corp. Product setup sharing for multiple inspection systems
US7197178B2 (en) * 2003-07-14 2007-03-27 Rudolph Technologies, Inc. Photoresist edge bead removal measurement
US7316938B2 (en) * 2003-07-14 2008-01-08 Rudolph Technologies, Inc. Adjustable film frame aligner
US8698327B2 (en) 2003-07-14 2014-04-15 Rudolph Technologies, Inc. Substrate handler
US7280200B2 (en) * 2003-07-18 2007-10-09 Ade Corporation Detection of a wafer edge using collimated light
US6934661B2 (en) * 2003-12-16 2005-08-23 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer edge detector
TWI512865B (zh) 2008-09-08 2015-12-11 Rudolph Technologies Inc 晶圓邊緣檢查技術
US9658169B2 (en) 2013-03-15 2017-05-23 Rudolph Technologies, Inc. System and method of characterizing micro-fabrication processes
JP6229438B2 (ja) * 2013-11-01 2017-11-15 株式会社Sumco 半導体ウェーハの外周部の検査装置および検査方法
US9348057B2 (en) 2014-07-24 2016-05-24 International Business Machines Corporation Method and apparatus for calibrating sensors that detect wafer protrusion from a wafer cassette
KR101984386B1 (ko) * 2017-07-13 2019-05-30 에스케이실트론 주식회사 웨이퍼 세정장비의 육안검사장치
CN108519390B (zh) * 2018-04-09 2021-02-02 芜湖立普德机械科技有限公司 一种玻璃基板检测装置
CN112665536A (zh) * 2020-12-30 2021-04-16 上海新昇半导体科技有限公司 一种晶圆的边缘粗糙度的测量方法及装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4954721A (en) * 1988-03-30 1990-09-04 Tel Sagami Limited Apparatus for detecting an array of wafers
US5003188A (en) * 1988-11-18 1991-03-26 Tokyo Aircraft Instrument Co., Ltd. Semiconductor waxer detection system
JP2674874B2 (ja) * 1990-11-13 1997-11-12 九州日本電気株式会社 半導体製造装置
JPH04177851A (ja) * 1990-11-13 1992-06-25 Nec Kyushu Ltd ウェーハ外観検査装置
JP2876507B2 (ja) * 1993-04-14 1999-03-31 日立電子エンジニアリング株式会社 ウエハ異物検査装置
JP2798112B2 (ja) * 1994-03-25 1998-09-17 信越半導体株式会社 ウェーハノッチ寸法測定装置及び方法
US5504345A (en) * 1994-04-14 1996-04-02 Hama Laboratories, Inc. Dual beam sensor and edge detection system and method

Also Published As

Publication number Publication date
US5592295A (en) 1997-01-07
KR960043072A (ko) 1996-12-23
MY113745A (en) 2002-05-31
TW344111B (en) 1998-11-01
DE69609377T2 (de) 2000-12-07
KR100261832B1 (ko) 2000-07-15
EP0742587A2 (de) 1996-11-13
EP0742587B1 (de) 2000-07-19
JPH08340031A (ja) 1996-12-24
CN1142685A (zh) 1997-02-12
EP0742587A3 (de) 1997-06-11
SG49948A1 (en) 1998-06-15

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee