DE69605381D1 - Fotoresistzusammensetzung - Google Patents

Fotoresistzusammensetzung

Info

Publication number
DE69605381D1
DE69605381D1 DE69605381T DE69605381T DE69605381D1 DE 69605381 D1 DE69605381 D1 DE 69605381D1 DE 69605381 T DE69605381 T DE 69605381T DE 69605381 T DE69605381 T DE 69605381T DE 69605381 D1 DE69605381 D1 DE 69605381D1
Authority
DE
Germany
Prior art keywords
photoresist composition
photoresist
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69605381T
Other languages
English (en)
Other versions
DE69605381T2 (de
Inventor
Mitsuru Sato
Kazuyuki Nitta
Hideo Hada
Tatsuya Hashiguchi
Hiroshi Komano
Toshimasa Nakayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Ohka Kogyo Co Ltd
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Application granted granted Critical
Publication of DE69605381D1 publication Critical patent/DE69605381D1/de
Publication of DE69605381T2 publication Critical patent/DE69605381T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/114—Initiator containing
    • Y10S430/12—Nitrogen compound containing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/114—Initiator containing
    • Y10S430/122—Sulfur compound containing
DE69605381T 1995-09-29 1996-09-19 Fotoresistzusammensetzung Expired - Fee Related DE69605381T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25421595A JP3456808B2 (ja) 1995-09-29 1995-09-29 ホトレジスト組成物

Publications (2)

Publication Number Publication Date
DE69605381D1 true DE69605381D1 (de) 2000-01-05
DE69605381T2 DE69605381T2 (de) 2000-04-06

Family

ID=17261867

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69605381T Expired - Fee Related DE69605381T2 (de) 1995-09-29 1996-09-19 Fotoresistzusammensetzung

Country Status (4)

Country Link
US (1) US5800964A (de)
EP (1) EP0768572B1 (de)
JP (1) JP3456808B2 (de)
DE (1) DE69605381T2 (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3587413B2 (ja) * 1995-12-20 2004-11-10 東京応化工業株式会社 化学増幅型レジスト組成物及びそれに用いる酸発生剤
JP3665166B2 (ja) 1996-07-24 2005-06-29 東京応化工業株式会社 化学増幅型レジスト組成物及びそれに用いる酸発生剤
CA2263254A1 (en) * 1996-09-02 1998-03-12 Ciba Specialty Chemicals Holding Inc. Alkysulfonyloximes for high-resolution i-line photoresists of high sensitivity
JP3053072B2 (ja) * 1996-09-10 2000-06-19 東京応化工業株式会社 レジスト積層体及びそれを用いたパターン形成方法
TW575792B (en) * 1998-08-19 2004-02-11 Ciba Sc Holding Ag New unsaturated oxime derivatives and the use thereof as latent acids
US6323287B1 (en) 1999-03-12 2001-11-27 Arch Specialty Chemicals, Inc. Hydroxy-amino thermally cured undercoat for 193 NM lithography
NL1014545C2 (nl) 1999-03-31 2002-02-26 Ciba Sc Holding Ag Oxim-derivaten en de toepassing daarvan als latente zuren.
SG78412A1 (en) * 1999-03-31 2001-02-20 Ciba Sc Holding Ag Oxime derivatives and the use thereof as latent acids
US6576394B1 (en) * 2000-06-16 2003-06-10 Clariant Finance (Bvi) Limited Negative-acting chemically amplified photoresist composition
US6482567B1 (en) * 2000-08-25 2002-11-19 Shipley Company, L.L.C. Oxime sulfonate and N-oxyimidosulfonate photoacid generators and photoresists comprising same
JP4694686B2 (ja) * 2000-08-31 2011-06-08 東京応化工業株式会社 半導体素子製造方法
US6824954B2 (en) * 2001-08-23 2004-11-30 Jsr Corporation Sulfonyloxime compound, and radiation sensitive acid generator, positive type radiation sensitive resin composition and negative type radiation sensitive resin composition using same
JP2005517026A (ja) 2002-02-06 2005-06-09 チバ　スペシャルティ　ケミカルズ　ホールディング　インコーポレーテッド スルホナート誘導体及び潜酸としてのその使用
TW200403523A (en) 2002-03-22 2004-03-01 Shinetsu Chemical Co Photoacid generators, chemically amplified resist compositions, and patterning process
JP4040392B2 (ja) * 2002-08-22 2008-01-30 富士フイルム株式会社 ポジ型フォトレジスト組成物
AU2005231979B2 (en) 2004-04-07 2011-02-03 Basf Se Method of coloring a coating composition
JP4566619B2 (ja) * 2004-05-13 2010-10-20 東京応化工業株式会社 ネガ型レジスト組成物およびレジストパターン形成方法
US8049186B2 (en) * 2006-08-24 2011-11-01 Basf Se UV-dosis indicators
JP5850863B2 (ja) 2010-02-24 2016-02-03 ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ 潜在性酸及びそれらの使用
EP3253735B1 (de) 2015-02-02 2021-03-31 Basf Se Latente säuren und ihre verwendung
JP6667204B2 (ja) * 2015-03-18 2020-03-18 東京応化工業株式会社 感光性樹脂層の形成方法、ホトレジストパターンの製造方法、及びメッキ造形物の形成方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3166592D1 (en) * 1980-07-14 1984-11-15 Akzo Nv Thermosetting coating composition containing a blocked acid catalyst
US4540598A (en) * 1983-08-17 1985-09-10 Ciba-Geigy Corporation Process for curing acid-curable finishes
DE3660255D1 (en) * 1985-04-12 1988-07-07 Ciba Geigy Ag Oxime sulphonates containing reactive groups
GB8608528D0 (en) * 1986-04-08 1986-05-14 Ciba Geigy Ag Production of positive images
EP0361907A3 (de) * 1988-09-29 1991-05-02 Hoechst Celanese Corporation Photolack-Zusammensetzung mit Bildumkehr für tiefes UV
US5019488A (en) * 1988-09-29 1991-05-28 Hoechst Celanese Corporation Method of producing an image reversal negative photoresist having a photo-labile blocked imide
US5216135A (en) * 1990-01-30 1993-06-01 Wako Pure Chemical Industries, Ltd. Diazodisulfones
JP3000745B2 (ja) * 1991-09-19 2000-01-17 富士通株式会社 レジスト組成物とレジストパターンの形成方法
DE59309494D1 (de) * 1992-05-22 1999-05-12 Ciba Geigy Ag Hochauflösender I-Linien Photoresist mit höherer Empfindlichkeit
JPH07191463A (ja) * 1993-12-27 1995-07-28 Fujitsu Ltd レジストおよびこれを使った半導体装置の製造方法
JP3317576B2 (ja) * 1994-05-12 2002-08-26 富士写真フイルム株式会社 ポジ型感光性樹脂組成物

Also Published As

Publication number Publication date
DE69605381T2 (de) 2000-04-06
JP3456808B2 (ja) 2003-10-14
EP0768572A1 (de) 1997-04-16
US5800964A (en) 1998-09-01
EP0768572B1 (de) 1999-12-01
JPH0996900A (ja) 1997-04-08

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee