DE69601995D1 - Kühlungsvorrichtung für eine elektrische Baugruppe in einer fahrbaren Struktur - Google Patents

Kühlungsvorrichtung für eine elektrische Baugruppe in einer fahrbaren Struktur

Info

Publication number
DE69601995D1
DE69601995D1 DE69601995T DE69601995T DE69601995D1 DE 69601995 D1 DE69601995 D1 DE 69601995D1 DE 69601995 T DE69601995 T DE 69601995T DE 69601995 T DE69601995 T DE 69601995T DE 69601995 D1 DE69601995 D1 DE 69601995D1
Authority
DE
Germany
Prior art keywords
cooling device
electrical assembly
mobile structure
mobile
electrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69601995T
Other languages
English (en)
Other versions
DE69601995T2 (de
Inventor
Takashi C O The Furukaw Murase
Takeshi C O The Furu Takahashi
Kazuhiro C O The Furuka Kawano
Isao C O The Furukawa Tsukada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Application granted granted Critical
Publication of DE69601995D1 publication Critical patent/DE69601995D1/de
Publication of DE69601995T2 publication Critical patent/DE69601995T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20936Liquid coolant with phase change
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B60VEHICLES IN GENERAL
    • B60KARRANGEMENT OR MOUNTING OF PROPULSION UNITS OR OF TRANSMISSIONS IN VEHICLES; ARRANGEMENT OR MOUNTING OF PLURAL DIVERSE PRIME-MOVERS IN VEHICLES; AUXILIARY DRIVES FOR VEHICLES; INSTRUMENTATION OR DASHBOARDS FOR VEHICLES; ARRANGEMENTS IN CONNECTION WITH COOLING, AIR INTAKE, GAS EXHAUST OR FUEL SUPPLY OF PROPULSION UNITS IN VEHICLES
    • B60K1/00Arrangement or mounting of electrical propulsion units
    • B60K2001/003Arrangement or mounting of electrical propulsion units with means for cooling the electrical propulsion units
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE69601995T 1995-10-26 1996-10-25 Kühlungsvorrichtung für eine elektrische Baugruppe in einer fahrbaren Struktur Expired - Lifetime DE69601995T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27859695A JP3700870B2 (ja) 1995-10-26 1995-10-26 車両における筐体内の電気部品冷却装置

Publications (2)

Publication Number Publication Date
DE69601995D1 true DE69601995D1 (de) 1999-05-12
DE69601995T2 DE69601995T2 (de) 1999-10-28

Family

ID=17599478

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69601995T Expired - Lifetime DE69601995T2 (de) 1995-10-26 1996-10-25 Kühlungsvorrichtung für eine elektrische Baugruppe in einer fahrbaren Struktur

Country Status (4)

Country Link
EP (1) EP0771138B1 (de)
JP (1) JP3700870B2 (de)
KR (1) KR100436970B1 (de)
DE (1) DE69601995T2 (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0946085A1 (de) * 1998-03-24 1999-09-29 Lucent Technologies Inc. Elektronisches Gerät mit Umweltschutz-Aussengehäuse
JP2000161880A (ja) * 1998-11-26 2000-06-16 Toshiba Corp ヒートパイプ式冷却器
DE19960841A1 (de) * 1999-12-16 2001-07-05 Siemens Ag Stromrichtergerät mit einer Zweiphasen-Wärmetransportvorrichtung
KR100947261B1 (ko) * 2009-08-04 2010-03-11 주식회사 케이디파워 주상 변압기
JP4929325B2 (ja) 2009-08-27 2012-05-09 株式会社日立製作所 電力変換装置
JP4948625B2 (ja) 2010-02-08 2012-06-06 古河電気工業株式会社 複数のフィンピッチを有する冷却装置
JP5131323B2 (ja) 2010-07-02 2013-01-30 日立電線株式会社 ヒートパイプ式冷却装置及びこれを用いた車両制御装置
CN103167780B (zh) * 2011-12-16 2016-06-08 台达电子企业管理(上海)有限公司 功率模块用复合式散热器组件
WO2014104204A1 (ja) * 2012-12-27 2014-07-03 古河電気工業株式会社 冷却装置
JP2014152983A (ja) * 2013-02-07 2014-08-25 Mitsubishi Alum Co Ltd 冷却器
WO2015016808A1 (en) * 2013-07-29 2015-02-05 Ge Intelligent Platforms, Inc. Heatspreader with extended surface for heat transfer through a sealed chassis wall
FR3010274B1 (fr) * 2013-08-27 2016-10-21 Valeo Equip Electr Moteur Bloc convertisseur de puissance de vehicule electrique ou hybride
EP2887787A3 (de) 2013-12-13 2015-08-19 Hitachi, Ltd. Kühlstruktur für Heizelement und Leistungswandler
FR3021257B1 (fr) * 2014-05-22 2017-12-08 Renault Sas Dispositif de refroidissement d'une chaine de traction pour vehicule elecrique
JP6559771B2 (ja) 2014-09-16 2019-08-14 エスゼット ディージェイアイ テクノロジー カンパニー リミテッドSz Dji Technology Co.,Ltd 放熱装置及びこの放熱装置を用いるuav
US20170184026A1 (en) * 2015-12-28 2017-06-29 General Electric Company System and method of soakback mitigation through passive cooling
CN106455414A (zh) * 2016-07-30 2017-02-22 无锡信大气象传感网科技有限公司 一种气象监测设备散热器
CN106231826B (zh) * 2016-07-30 2019-07-09 无锡信大气象传感网科技有限公司 一种气象监测设备散热外壳
CN109640585B (zh) * 2018-12-17 2024-04-05 珠海格力电器股份有限公司 散热组件及空调机组
JP7299017B2 (ja) * 2018-12-27 2023-06-27 川崎重工業株式会社 ループ型ヒートパイプ及び輸送機
FR3100489B1 (fr) * 2019-09-10 2021-09-24 Alstom Transp Tech Module de puissance électrique
CN111970910B (zh) * 2020-08-28 2023-05-05 江苏鹏江电子科技有限公司 一种电子热负载液冷散热系统

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2334525A1 (fr) * 1975-12-12 1977-07-08 Alsthom Cgee Dispositif de refroidissement de semi-conducteurs appliques au materiel ferroviaire
JPS6015337Y2 (ja) * 1980-04-22 1985-05-14 昭和アルミニウム株式会社 ヒ−トパイプ利用放熱器
AU520046B2 (en) * 1980-05-21 1982-01-14 Showa Aluminium K.K. Heat releasing device for apparatus incorporating transistors ic circuits etc
JPS57211256A (en) * 1981-06-22 1982-12-25 Toyo Electric Mfg Co Ltd Semiconductor element cooling device for vehicle
JPS57211260A (en) * 1981-06-22 1982-12-25 Matsushita Electric Ind Co Ltd Cooling device for high frequency semiconductor radio wave generating unit
JPH0336794A (ja) * 1989-07-04 1991-02-18 Furukawa Electric Co Ltd:The ヒートパイプ式放熱器
JPH05235224A (ja) * 1992-02-21 1993-09-10 Toshiba Toransupooto Eng Kk 車両用半導体装置
JP3067399B2 (ja) * 1992-07-03 2000-07-17 株式会社日立製作所 半導体冷却装置
JP2759587B2 (ja) * 1992-11-25 1998-05-28 株式会社日立製作所 電気車用インバータ装置の冷却装置
JPH07243782A (ja) * 1994-03-02 1995-09-19 Hitachi Ltd ヒートパイプ式放熱器

Also Published As

Publication number Publication date
KR100436970B1 (ko) 2004-07-30
KR970025332A (ko) 1997-05-30
DE69601995T2 (de) 1999-10-28
EP0771138A1 (de) 1997-05-02
JPH09119785A (ja) 1997-05-06
EP0771138B1 (de) 1999-04-07
JP3700870B2 (ja) 2005-09-28

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8320 Willingness to grant licences declared (paragraph 23)