AU520046B2 - Heat releasing device for apparatus incorporating transistors ic circuits etc - Google Patents

Heat releasing device for apparatus incorporating transistors ic circuits etc

Info

Publication number
AU520046B2
AU520046B2 AU58605/80A AU5860580A AU520046B2 AU 520046 B2 AU520046 B2 AU 520046B2 AU 58605/80 A AU58605/80 A AU 58605/80A AU 5860580 A AU5860580 A AU 5860580A AU 520046 B2 AU520046 B2 AU 520046B2
Authority
AU
Australia
Prior art keywords
releasing device
apparatus incorporating
heat releasing
circuits etc
incorporating transistors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
AU58605/80A
Other versions
AU5860580A (en
Inventor
Masaaki Munekawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Aluminum Can Corp
Original Assignee
Showa Aluminum Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Aluminum Corp filed Critical Showa Aluminum Corp
Priority to AU58605/80A priority Critical patent/AU520046B2/en
Publication of AU5860580A publication Critical patent/AU5860580A/en
Application granted granted Critical
Publication of AU520046B2 publication Critical patent/AU520046B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Geometry (AREA)
  • Sustainable Development (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
AU58605/80A 1980-05-21 1980-05-21 Heat releasing device for apparatus incorporating transistors ic circuits etc Ceased AU520046B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU58605/80A AU520046B2 (en) 1980-05-21 1980-05-21 Heat releasing device for apparatus incorporating transistors ic circuits etc

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
AU58605/80A AU520046B2 (en) 1980-05-21 1980-05-21 Heat releasing device for apparatus incorporating transistors ic circuits etc

Publications (2)

Publication Number Publication Date
AU5860580A AU5860580A (en) 1981-12-03
AU520046B2 true AU520046B2 (en) 1982-01-14

Family

ID=3743918

Family Applications (1)

Application Number Title Priority Date Filing Date
AU58605/80A Ceased AU520046B2 (en) 1980-05-21 1980-05-21 Heat releasing device for apparatus incorporating transistors ic circuits etc

Country Status (1)

Country Link
AU (1) AU520046B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0771138A1 (en) * 1995-10-26 1997-05-02 The Furukawa Electric Co., Ltd. Cooling device for electric components in a casing of a travelling structure

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0771138A1 (en) * 1995-10-26 1997-05-02 The Furukawa Electric Co., Ltd. Cooling device for electric components in a casing of a travelling structure

Also Published As

Publication number Publication date
AU5860580A (en) 1981-12-03

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