JPS57211256A - Semiconductor element cooling device for vehicle - Google Patents

Semiconductor element cooling device for vehicle

Info

Publication number
JPS57211256A
JPS57211256A JP9539681A JP9539681A JPS57211256A JP S57211256 A JPS57211256 A JP S57211256A JP 9539681 A JP9539681 A JP 9539681A JP 9539681 A JP9539681 A JP 9539681A JP S57211256 A JPS57211256 A JP S57211256A
Authority
JP
Japan
Prior art keywords
condenser
vehicle
guide plate
wind
face
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9539681A
Other languages
Japanese (ja)
Inventor
Kinji Yoshioka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyo Denki Seizo KK
Toyo Electric Manufacturing Ltd
Original Assignee
Toyo Denki Seizo KK
Toyo Electric Manufacturing Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyo Denki Seizo KK, Toyo Electric Manufacturing Ltd filed Critical Toyo Denki Seizo KK
Priority to JP9539681A priority Critical patent/JPS57211256A/en
Publication of JPS57211256A publication Critical patent/JPS57211256A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To cool a semiconductor device effectively utilizing the wind generated by a traveling vehicle by a method wherein the vessel, in which the cooling device is housed, is partitioned by the plate which constitutes a part of a condenser, and the wind is brought in the condenser by providing a guide plate. CONSTITUTION:Hollow cooling pieces 5 and semiconductor elements 5 are alternately pressure welded, they are laminated in the vertical direction to the face of paper, and the vehicle proceeds in the same direction. A housing case 1 is partitioned using a plate 9, and a liquid reservoir 4, common to closed parts, and other component parts such as cooling pieces 5, the laminated material of the elements 6 and the like are housed in the closed part. The condenser 3 is placed in the section wherein the outside air can be circulated, a ventilating hole 1'' is provided at the upper part of the condenser 3, and the guide plate 10 to be used to bring in the wind is installed on the outside of the air inlet port located on the side face within the limit line 11. The guide plate 10 has a trapezoidal pyramid shape, its face 10C on the top side is faced to the side of the condenser 3, fixed using the hole 10d of the frame 10b which is the extended part of the bottom face of the guide plate 10, and vanes 10C are attached to each ridge, thereby enabling to cool the condenser 3 by guiding the wind to the inlet port in either case where the vehicle makes a forward or backward movement. When the vehicle is under parking, a natural convection is utilized.
JP9539681A 1981-06-22 1981-06-22 Semiconductor element cooling device for vehicle Pending JPS57211256A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9539681A JPS57211256A (en) 1981-06-22 1981-06-22 Semiconductor element cooling device for vehicle

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9539681A JPS57211256A (en) 1981-06-22 1981-06-22 Semiconductor element cooling device for vehicle

Publications (1)

Publication Number Publication Date
JPS57211256A true JPS57211256A (en) 1982-12-25

Family

ID=14136487

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9539681A Pending JPS57211256A (en) 1981-06-22 1981-06-22 Semiconductor element cooling device for vehicle

Country Status (1)

Country Link
JP (1) JPS57211256A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0771138A1 (en) * 1995-10-26 1997-05-02 The Furukawa Electric Co., Ltd. Cooling device for electric components in a casing of a travelling structure

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0771138A1 (en) * 1995-10-26 1997-05-02 The Furukawa Electric Co., Ltd. Cooling device for electric components in a casing of a travelling structure

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