JPS57211260A - Cooling device for high frequency semiconductor radio wave generating unit - Google Patents

Cooling device for high frequency semiconductor radio wave generating unit

Info

Publication number
JPS57211260A
JPS57211260A JP9710181A JP9710181A JPS57211260A JP S57211260 A JPS57211260 A JP S57211260A JP 9710181 A JP9710181 A JP 9710181A JP 9710181 A JP9710181 A JP 9710181A JP S57211260 A JPS57211260 A JP S57211260A
Authority
JP
Japan
Prior art keywords
heat
transistor
high frequency
generating unit
radio wave
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9710181A
Other languages
Japanese (ja)
Inventor
Shigeru Kusuki
Tomotaka Nobue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP9710181A priority Critical patent/JPS57211260A/en
Publication of JPS57211260A publication Critical patent/JPS57211260A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Constitution Of High-Frequency Heating (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To obtain the cooling device, having no radio leakage, which will be easily assembled by a method wherein the transistor located at the high frequency radio wave generating unit is fixed on a heat conducting pipe through the intermediary of a heat diffusing plate, the transistor is connected to all the heat radiating fins excluding those located on the main body, and the heat radiating fins are fixed to the wall face of the main body using pipe fittings. CONSTITUTION:The transistor 12 is installed on the outer wall 22 located inside the side wall 8 of the main body of a heating chamber 27 through the intermediary of a metal fitting 23, a heat radiating plate 13b and a heat diffusing plate 13a, and a high frequency radio wave generating unit is composed of an electrode 15, strip wires 16-19 and an earth electrode. The generated heat of the transistor 12 is guided to the heat radiating fin 11 located outside the side wall 8 by the help of a heat conducting pipe 10 and a thermo-operating medium 26. The pipe 10 is fixed on the side wall 8 using metal fittings and screws 21. As a result, the radio leakage can be prevented and the assembling work of the device can also be simplified.
JP9710181A 1981-06-22 1981-06-22 Cooling device for high frequency semiconductor radio wave generating unit Pending JPS57211260A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9710181A JPS57211260A (en) 1981-06-22 1981-06-22 Cooling device for high frequency semiconductor radio wave generating unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9710181A JPS57211260A (en) 1981-06-22 1981-06-22 Cooling device for high frequency semiconductor radio wave generating unit

Publications (1)

Publication Number Publication Date
JPS57211260A true JPS57211260A (en) 1982-12-25

Family

ID=14183217

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9710181A Pending JPS57211260A (en) 1981-06-22 1981-06-22 Cooling device for high frequency semiconductor radio wave generating unit

Country Status (1)

Country Link
JP (1) JPS57211260A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6251755U (en) * 1985-09-17 1987-03-31
EP0771138A1 (en) * 1995-10-26 1997-05-02 The Furukawa Electric Co., Ltd. Cooling device for electric components in a casing of a travelling structure
KR19990068992A (en) * 1998-02-03 1999-09-06 구자홍 Heat shield of magnetron and transformer for microwave oven

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6251755U (en) * 1985-09-17 1987-03-31
EP0771138A1 (en) * 1995-10-26 1997-05-02 The Furukawa Electric Co., Ltd. Cooling device for electric components in a casing of a travelling structure
KR19990068992A (en) * 1998-02-03 1999-09-06 구자홍 Heat shield of magnetron and transformer for microwave oven

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