DE69533078T2 - Schnittstelle für automatische Testanordnung - Google Patents

Schnittstelle für automatische Testanordnung Download PDF

Info

Publication number
DE69533078T2
DE69533078T2 DE69533078T DE69533078T DE69533078T2 DE 69533078 T2 DE69533078 T2 DE 69533078T2 DE 69533078 T DE69533078 T DE 69533078T DE 69533078 T DE69533078 T DE 69533078T DE 69533078 T2 DE69533078 T2 DE 69533078T2
Authority
DE
Germany
Prior art keywords
test head
kinematic
contact
test
coupling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69533078T
Other languages
German (de)
English (en)
Other versions
DE69533078D1 (de
Inventor
Alexander H. Concord Slocum
Michael A. Chiu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Teradyne Inc
Original Assignee
Teradyne Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teradyne Inc filed Critical Teradyne Inc
Publication of DE69533078D1 publication Critical patent/DE69533078D1/de
Application granted granted Critical
Publication of DE69533078T2 publication Critical patent/DE69533078T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/30—Structural combination of electric measuring instruments with basic electronic circuits, e.g. with amplifier
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06705—Apparatus for holding or moving single probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T403/00—Joints and connections
    • Y10T403/32—Articulated members

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)
DE69533078T 1994-09-01 1995-09-01 Schnittstelle für automatische Testanordnung Expired - Fee Related DE69533078T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US29983194A 1994-09-01 1994-09-01
US299831 1999-04-26

Publications (2)

Publication Number Publication Date
DE69533078D1 DE69533078D1 (de) 2004-07-01
DE69533078T2 true DE69533078T2 (de) 2005-07-28

Family

ID=23156483

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69533078T Expired - Fee Related DE69533078T2 (de) 1994-09-01 1995-09-01 Schnittstelle für automatische Testanordnung

Country Status (7)

Country Link
US (2) US6104202A (OSRAM)
EP (1) EP0699913B1 (OSRAM)
JP (1) JPH0926458A (OSRAM)
KR (1) KR100379811B1 (OSRAM)
CN (1) CN1113404C (OSRAM)
DE (1) DE69533078T2 (OSRAM)
TW (1) TW273635B (OSRAM)

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US6850675B1 (en) * 2002-02-04 2005-02-01 Siwave, Inc. Base, payload and connecting structure and methods of making the same
DE10216003B4 (de) * 2002-04-11 2005-03-10 Multitest Elektronische Syst Dockingvorrichtung
US6756800B2 (en) * 2002-04-16 2004-06-29 Teradyne, Inc. Semiconductor test system with easily changed interface unit
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US6833696B2 (en) * 2003-03-04 2004-12-21 Xandex, Inc. Methods and apparatus for creating a high speed connection between a device under test and automatic test equipment
US7235964B2 (en) * 2003-03-31 2007-06-26 Intest Corporation Test head positioning system and method
US6894523B2 (en) * 2003-07-01 2005-05-17 Intel Corporation System and method for testing semiconductor devices
US7145157B2 (en) * 2003-09-11 2006-12-05 Applied Materials, Inc. Kinematic ion implanter electrode mounting
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CN101052886B (zh) * 2004-09-03 2011-06-01 塞莱敦体系股份有限公司 用于探测半导体晶片的可置换探针装置
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JP5184910B2 (ja) * 2008-02-13 2013-04-17 株式会社岡本工作機械製作所 基板の平面研削装置
KR100900162B1 (ko) 2009-01-13 2009-06-02 에버테크노 주식회사 마이크로폰 테스트시스템의 테스트장치
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CN106181629A (zh) * 2016-07-15 2016-12-07 绔ユ旦 一种太阳能供电的磨削装置
DE102017104516B4 (de) * 2017-03-03 2021-06-10 Turbodynamics Gmbh Plattenförmiges Verbindungssystem zum Verbinden von zwei Testeinheiten sowie Verbindungseinheit und Testsystem mit jeweils einem solchen plattenförmigen Verbindungssystem
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Also Published As

Publication number Publication date
DE69533078D1 (de) 2004-07-01
KR100379811B1 (ko) 2003-05-23
EP0699913A2 (en) 1996-03-06
EP0699913A3 (en) 1997-04-16
CN1125898A (zh) 1996-07-03
JPH0926458A (ja) 1997-01-28
CN1113404C (zh) 2003-07-02
EP0699913B1 (en) 2004-05-26
US6104202A (en) 2000-08-15
TW273635B (OSRAM) 1996-04-01
KR960012412A (ko) 1996-04-20
US5821764A (en) 1998-10-13

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8339 Ceased/non-payment of the annual fee