DE69521556T2 - Herstellungsverfahren für eine optische Halbleitervorrichtung - Google Patents
Herstellungsverfahren für eine optische HalbleitervorrichtungInfo
- Publication number
- DE69521556T2 DE69521556T2 DE69521556T DE69521556T DE69521556T2 DE 69521556 T2 DE69521556 T2 DE 69521556T2 DE 69521556 T DE69521556 T DE 69521556T DE 69521556 T DE69521556 T DE 69521556T DE 69521556 T2 DE69521556 T2 DE 69521556T2
- Authority
- DE
- Germany
- Prior art keywords
- manufacturing
- semiconductor device
- optical semiconductor
- optical
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/026—Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
- H01S5/0265—Intensity modulators
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/026—Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
- H01S5/042—Electrical excitation ; Circuits therefor
- H01S5/0425—Electrodes, e.g. characterised by the structure
- H01S5/04256—Electrodes, e.g. characterised by the structure characterised by the configuration
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/2054—Methods of obtaining the confinement
- H01S5/2077—Methods of obtaining the confinement using lateral bandgap control during growth, e.g. selective growth, mask induced
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/227—Buried mesa structure ; Striped active layer
- H01S5/2272—Buried mesa structure ; Striped active layer grown by a mask induced selective growth
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
- H01S5/4031—Edge-emitting structures
- H01S5/4068—Edge-emitting structures with lateral coupling by axially offset or by merging waveguides, e.g. Y-couplers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
- H01S5/4087—Array arrangements, e.g. constituted by discrete laser diodes or laser bar emitting more than one wavelength
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/095—Laser devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/914—Doping
- Y10S438/925—Fluid growth doping control, e.g. delta doping
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6111884A JP2937751B2 (ja) | 1994-04-28 | 1994-04-28 | 光半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69521556D1 DE69521556D1 (de) | 2001-08-09 |
DE69521556T2 true DE69521556T2 (de) | 2002-04-25 |
Family
ID=14572570
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69521556T Expired - Fee Related DE69521556T2 (de) | 1994-04-28 | 1995-04-27 | Herstellungsverfahren für eine optische Halbleitervorrichtung |
Country Status (4)
Country | Link |
---|---|
US (1) | US5580818A (de) |
EP (1) | EP0680119B1 (de) |
JP (1) | JP2937751B2 (de) |
DE (1) | DE69521556T2 (de) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08116135A (ja) * | 1994-10-17 | 1996-05-07 | Mitsubishi Electric Corp | 導波路集積素子の製造方法,及び導波路集積素子 |
JP2865000B2 (ja) * | 1994-10-27 | 1999-03-08 | 日本電気株式会社 | 出力導波路集積半導体レーザとその製造方法 |
JP2900824B2 (ja) * | 1995-03-31 | 1999-06-02 | 日本電気株式会社 | 光半導体装置の製造方法 |
JP2765545B2 (ja) * | 1995-12-26 | 1998-06-18 | 日本電気株式会社 | 光波長弁別回路およびその製造方法 |
JPH09232625A (ja) * | 1996-02-27 | 1997-09-05 | Oki Electric Ind Co Ltd | 端面発光型光半導体素子及びその製造方法 |
JP2917913B2 (ja) * | 1996-06-10 | 1999-07-12 | 日本電気株式会社 | 半導体光素子の製造方法 |
JPH1056229A (ja) * | 1996-08-08 | 1998-02-24 | Fujitsu Ltd | 半導体光集積素子の製造方法 |
JP3104789B2 (ja) * | 1997-05-02 | 2000-10-30 | 日本電気株式会社 | 半導体光素子およびその製造方法 |
US6133125A (en) * | 1999-01-06 | 2000-10-17 | Lucent Technologies Inc. | Selective area diffusion control process |
JP3329764B2 (ja) * | 1999-05-13 | 2002-09-30 | 日本電気株式会社 | 半導体レーザー及び半導体光増幅器 |
JP2001044566A (ja) * | 1999-07-28 | 2001-02-16 | Nec Corp | 半導体レーザおよびその製造方法 |
JP4618854B2 (ja) * | 2000-08-11 | 2011-01-26 | Okiセミコンダクタ株式会社 | 半導体装置およびその製造方法 |
US6865205B2 (en) | 2001-05-17 | 2005-03-08 | Matsushita Electric Industrial Co., Ltd. | Semiconductor laser |
US6462865B1 (en) | 2001-06-29 | 2002-10-08 | Super Light Wave Corp. | All-optical logic with wired-OR multi-mode-interference combiners and semiconductor-optical-amplifier inverters |
KR100605372B1 (ko) * | 2003-09-29 | 2006-07-28 | 한국전자통신연구원 | 다중양자우물을 갖는 전계흡수형 광 변조기 |
NO325047B1 (no) * | 2005-03-30 | 2008-01-21 | Intopto As | Optiske enheter ved bruk av et pentaert III-V material system |
JP5093033B2 (ja) | 2008-09-30 | 2012-12-05 | ソニー株式会社 | 半導体レーザの製造方法、半導体レーザ、光ピックアップおよび光ディスク装置 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4077817A (en) * | 1975-12-31 | 1978-03-07 | Texas Instruments Incorporated | Making a semiconductor laser structure by liquid phase epitaxy |
US4114257A (en) * | 1976-09-23 | 1978-09-19 | Texas Instruments Incorporated | Method of fabrication of a monolithic integrated optical circuit |
US4961198A (en) * | 1988-01-14 | 1990-10-02 | Matsushita Electric Industrial Co., Ltd. | Semiconductor device |
JP2890745B2 (ja) * | 1990-08-20 | 1999-05-17 | 富士通株式会社 | 半導体装置の製造方法および、光半導体装置の製造方法 |
JP2701569B2 (ja) * | 1991-04-01 | 1998-01-21 | 日本電気株式会社 | 光半導体素子の製造方法 |
JP3263949B2 (ja) * | 1991-02-25 | 2002-03-11 | 日本電気株式会社 | 光集積回路の製造方法 |
JPH0582909A (ja) * | 1991-09-24 | 1993-04-02 | Nippon Telegr & Teleph Corp <Ntt> | 半導体デバイス成長用マスクおよび半導体デバイスの製造方法 |
JP3084416B2 (ja) * | 1991-10-21 | 2000-09-04 | 日本電信電話株式会社 | 光結合デバイスの製造方法 |
EP0558089B1 (de) * | 1992-02-28 | 2002-06-05 | Hitachi, Ltd. | Optische integrierte Halbleitervorrichtung und Verfahren zur Herstellung und Verwendung in einem Lichtempfänger |
JPH05327111A (ja) * | 1992-05-20 | 1993-12-10 | Fujitsu Ltd | 半導体レーザ装置及びその製造方法 |
JPH05327112A (ja) * | 1992-05-20 | 1993-12-10 | Sanyo Electric Co Ltd | 半導体レーザの製造方法 |
JP2950028B2 (ja) * | 1992-07-23 | 1999-09-20 | 日本電気株式会社 | 光半導体素子の製造方法 |
JPH0770791B2 (ja) * | 1992-12-22 | 1995-07-31 | 日本電気株式会社 | 半導体レーザ及びその製造方法 |
JPH07176827A (ja) * | 1993-08-20 | 1995-07-14 | Mitsubishi Electric Corp | 変調器付半導体レーザ装置の製造方法 |
-
1994
- 1994-04-28 JP JP6111884A patent/JP2937751B2/ja not_active Expired - Fee Related
-
1995
- 1995-04-27 DE DE69521556T patent/DE69521556T2/de not_active Expired - Fee Related
- 1995-04-27 EP EP95106383A patent/EP0680119B1/de not_active Expired - Lifetime
- 1995-04-28 US US08/430,619 patent/US5580818A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2937751B2 (ja) | 1999-08-23 |
JPH07302952A (ja) | 1995-11-14 |
EP0680119A1 (de) | 1995-11-02 |
EP0680119B1 (de) | 2001-07-04 |
US5580818A (en) | 1996-12-03 |
DE69521556D1 (de) | 2001-08-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: NEC COMPOUND SEMICONDUCTOR DEVICES, LTD., KAWASAKI |
|
8339 | Ceased/non-payment of the annual fee |