DE69514311T2 - Verfahren zur Oberflächen-Aufrauhung von Kupferfolie - Google Patents

Verfahren zur Oberflächen-Aufrauhung von Kupferfolie

Info

Publication number
DE69514311T2
DE69514311T2 DE69514311T DE69514311T DE69514311T2 DE 69514311 T2 DE69514311 T2 DE 69514311T2 DE 69514311 T DE69514311 T DE 69514311T DE 69514311 T DE69514311 T DE 69514311T DE 69514311 T2 DE69514311 T2 DE 69514311T2
Authority
DE
Germany
Prior art keywords
copper foil
surface roughening
roughening
foil
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69514311T
Other languages
English (en)
Other versions
DE69514311D1 (de
Inventor
Ryoichi Oguro
Tadao Nakaoka
Kazuyuki Inoue
Kazuhiro Hoshino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Circuit Foil Japan Co Ltd
Original Assignee
Circuit Foil Japan Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Circuit Foil Japan Co Ltd filed Critical Circuit Foil Japan Co Ltd
Application granted granted Critical
Publication of DE69514311D1 publication Critical patent/DE69514311D1/de
Publication of DE69514311T2 publication Critical patent/DE69514311T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
  • Manufacturing Of Printed Wiring (AREA)
DE69514311T 1994-10-06 1995-09-26 Verfahren zur Oberflächen-Aufrauhung von Kupferfolie Expired - Fee Related DE69514311T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP24257994 1994-10-06
JP13327995A JP3709221B2 (ja) 1994-10-06 1995-05-31 銅箔の表面粗化処理方法

Publications (2)

Publication Number Publication Date
DE69514311D1 DE69514311D1 (de) 2000-02-10
DE69514311T2 true DE69514311T2 (de) 2000-08-24

Family

ID=26467670

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69514311T Expired - Fee Related DE69514311T2 (de) 1994-10-06 1995-09-26 Verfahren zur Oberflächen-Aufrauhung von Kupferfolie

Country Status (7)

Country Link
US (1) US5792333A (de)
EP (1) EP0709494B1 (de)
JP (1) JP3709221B2 (de)
KR (1) KR100371524B1 (de)
DE (1) DE69514311T2 (de)
MY (1) MY112930A (de)
TW (1) TW379260B (de)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW389780B (en) * 1995-09-13 2000-05-11 Hitachi Chemical Co Ltd Prepreg for printed circuit board
US6270645B1 (en) * 1997-09-26 2001-08-07 Circuit Foil Usa, Inc. Simplified process for production of roughened copper foil
JPH11135952A (ja) * 1997-10-27 1999-05-21 Furukawa Electric Co Ltd:The 印刷回路基板用樹脂付き銅箔、およびそれを用いた印刷回路基板
US6372113B2 (en) * 1999-09-13 2002-04-16 Yates Foil Usa, Inc. Copper foil and copper clad laminates for fabrication of multi-layer printed circuit boards and process for producing same
KR100401340B1 (ko) * 2001-11-16 2003-10-10 엘지전선 주식회사 Ｐｃｂ용 전해동박의 표면처리방법
JP2003342787A (ja) * 2002-05-24 2003-12-03 Toyo Metallizing Co Ltd フレキシブルプリント配線用基板の製造方法
DE10237052A1 (de) * 2002-08-09 2004-02-19 Km Europa Metal Ag Verwendung einer niedriglegierten Kupferlegierung und hieraus hergestelltes Hohlprofilbauteil
TW200404484A (en) * 2002-09-02 2004-03-16 Furukawa Circuit Foil Copper foil for soft circuit board package module, for plasma display, or for radio-frequency printed circuit board
KR100559933B1 (ko) * 2002-11-29 2006-03-13 엘에스전선 주식회사 저조도 동박의 전해연마방법 및 전해연마장치와 동박
US20040108211A1 (en) * 2002-12-06 2004-06-10 Industrial Technology Research Institute Surface treatment for a wrought copper foil for use on a flexible printed circuit board (FPCB)
DE112004000245T5 (de) * 2003-02-04 2005-12-29 Furukawa Circuit Foil Co., Ltd. Verbund-Kupferfolie, Verfahren zu deren Herstellung und Hochfrequenz-Übertragungsschaltung unter Verwendung einer Verbundkupferfolie
US20040154931A1 (en) * 2003-02-12 2004-08-12 Akihisa Hongo Polishing liquid, polishing method and polishing apparatus
TW200500199A (en) 2003-02-12 2005-01-01 Furukawa Circuit Foil Copper foil for fine patterned printed circuits and method of production of same
JP2004244656A (ja) * 2003-02-12 2004-09-02 Furukawa Techno Research Kk 高周波用途対応可能銅箔とその製造方法
KR101065758B1 (ko) 2003-02-27 2011-09-19 후루카와 덴키 고교 가부시키가이샤 전자파 실드용 동박, 그 제조방법 및 전자파 실드체
WO2004092450A1 (en) * 2003-04-11 2004-10-28 Lynntech, Inc. Compositions and coatings including quasicrystals
JP4497952B2 (ja) * 2004-02-23 2010-07-07 クローバー電子工業株式会社 積層配線基板
JP2006005149A (ja) * 2004-06-17 2006-01-05 Furukawa Circuit Foil Kk 抵抗層付き導電性基材及び抵抗層付き回路基板材料
KR100576385B1 (ko) * 2005-12-07 2006-05-03 이이근 압연동 적층판의 제조방법
JP2008127618A (ja) * 2006-11-20 2008-06-05 Furukawa Circuit Foil Kk 交流給電による銅箔の表面処理方法
CN101622380B (zh) 2007-03-02 2012-05-30 古河电气工业株式会社 表面粗化铜板的制造方法和装置、以及表面粗化铜板
JP5400447B2 (ja) * 2009-03-31 2014-01-29 三井金属鉱業株式会社 粗化処理銅箔、粗化処理銅箔の製造方法及び銅張積層板
JP2010047842A (ja) * 2009-10-01 2010-03-04 Nippon Mining & Metals Co Ltd 電解銅箔及び電解銅箔光沢面の電解研磨方法
JP2010059547A (ja) * 2009-10-01 2010-03-18 Nippon Mining & Metals Co Ltd 電解銅箔及び電解銅箔光沢面の電解研磨方法
JP5448710B2 (ja) * 2009-10-19 2014-03-19 古河電気工業株式会社 表面粗化銅板の製造方法および製造装置
CN102181899B (zh) * 2011-04-29 2012-08-22 广东嘉元科技股份有限公司 电解铜箔双面同步粗化及固化的方法及设备
CN102212853B (zh) * 2011-04-30 2012-11-14 山东金宝电子股份有限公司 一种能够提高铜箔剥离强度的表面处理粗化工艺
US9115441B2 (en) * 2011-10-18 2015-08-25 Nan Ya Plastics Corporation Process to manufacture surface fine grain copper foil with high peeling strength and environmental protection for printed circuit boards
CN102383148A (zh) * 2011-11-18 2012-03-21 山东金宝电子股份有限公司 电解铜箔用混合添加剂、其配制方法以及用于制备超低轮廓电解铜箔的方法
CN103088397B (zh) * 2013-02-07 2015-11-18 灵宝华鑫铜箔有限责任公司 一种清除铜箔表面处理中毛面红道缺陷的方法
TWI515342B (zh) * 2013-09-05 2016-01-01 三井金屬鑛業股份有限公司 表面處理銅箔、使用該表面處理銅箔所得之貼銅積層板以及印刷配線板
CN105058213A (zh) * 2015-08-10 2015-11-18 常州二维碳素科技股份有限公司 一种连续抛光设备
CN105200479A (zh) * 2015-10-30 2015-12-30 中色奥博特铜铝业有限公司 一种压延铜箔粗化处理添加剂、电镀液及粗化处理方法
CN105220214B (zh) * 2015-11-13 2018-02-06 中国科学院上海高等研究院 一种石墨烯薄膜的制备方法
US9707738B1 (en) 2016-01-14 2017-07-18 Chang Chun Petrochemical Co., Ltd. Copper foil and methods of use
WO2020246467A1 (ja) * 2019-06-07 2020-12-10 古河電気工業株式会社 表面処理銅箔、銅張積層板、及びプリント配線板
CN111485260B (zh) * 2020-04-30 2020-12-08 广东嘉元科技股份有限公司 二次电池用低翘曲电解铜箔、制造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112145C (de) *
DD112145B1 (de) * 1974-03-22 1986-10-29 Cordt Schmidt Verfahren und vorrichtung zur erzeugung von wischfesten haftbelaegen auf metallfolien, insbesondere auf kupferfolien
US4140596A (en) * 1975-12-22 1979-02-20 Vereinigte Metallwerke Ranshofen-Berndorf Aktiengesellschaft Process for the electrolytic refining of copper
US4468293A (en) * 1982-03-05 1984-08-28 Olin Corporation Electrochemical treatment of copper for improving its bond strength
JPS599050A (ja) 1982-07-08 1984-01-18 日立電線株式会社 銅張積層板の製造方法
JPS6199700A (ja) * 1984-10-22 1986-05-17 Hitachi Ltd 銅配線基板の構造
US4568431A (en) * 1984-11-13 1986-02-04 Olin Corporation Process for producing electroplated and/or treated metal foil
US4652346A (en) * 1984-12-31 1987-03-24 Olin Corporation Apparatus and process for the continuous plating of wide delicate metal foil
WO1991019024A1 (en) * 1990-05-30 1991-12-12 Gould, Inc. Electrodeposited copper foil and process for making same using electrolyte solutions having low chloride ion concentrations
JP3300085B2 (ja) * 1992-02-07 2002-07-08 武田薬品工業株式会社 吸着性組成物およびその製造法

Also Published As

Publication number Publication date
US5792333A (en) 1998-08-11
MY112930A (en) 2001-10-31
DE69514311D1 (de) 2000-02-10
KR960014421A (ko) 1996-05-22
TW379260B (en) 2000-01-11
EP0709494B1 (de) 2000-01-05
JPH08158100A (ja) 1996-06-18
KR100371524B1 (ko) 2003-05-01
EP0709494A2 (de) 1996-05-01
JP3709221B2 (ja) 2005-10-26
EP0709494A3 (de) 1997-03-12

Similar Documents

Publication Publication Date Title
DE69514311D1 (de) Verfahren zur Oberflächen-Aufrauhung von Kupferfolie
DE69421789D1 (de) Verfahren zur elektrochemischen Aufrauhung
DE69418698D1 (de) Verfahren zur Herstellung von Leiterplatten
DE69508793D1 (de) Verfahren zur herstellung von perfluorkohlenstoffen
DE69431828T2 (de) Verfahren zur Herstellung von gedruckten Schaltungskarten
ATE184313T1 (de) Verfahren zur kontinuierlichen kochung von würze
DE69518680D1 (de) Verfahren zur Entfernung von Heteroatomen
DE69502137D1 (de) Verfahren zur Methathesis von Olefinen
DE69824133D1 (de) Verfahren zur Herstellung von mehrschichtigen Leiterplatten
DE69529343T2 (de) Verfahren zur isolierung von mesophasepech
DE59500390D1 (de) Verfahren zur Förderung von Erdöl
DE69708707D1 (de) Verfahren zur Wiedergewinnung von Bisphenolen
DE69326925T2 (de) Verfahren zur Herstellung von gedruckten Leiterplatten
DE59809314D1 (de) Verfahren zur Aufrauhung von Kunststoffoberflächen
DE69332496D1 (de) Verfahren zur Dielektrikim-Entfernung
DE69324072T2 (de) Verfahren zur Oberflächenbehandlung
DE59700246D1 (de) Verfahren zur galvanotechnischen Metallisierung von Kunststoffoberflächen
DE69027530D1 (de) Verfahren zur erhöhung des isolationswiderstandes von leiterplatten
DE69420314T2 (de) Verfahren zur Elektrogewinnung von schweren Metallen
DE59902633D1 (de) Verfahren zur Umesterung von Alpha-Ketocarbonsäuren
DE69735750D1 (de) Verfahren zur Herstellung von Leiterplatten
DE69501535D1 (de) Verfahren zur Reinigung von Difluormethan
DE69332515D1 (de) Verfahren zur Dielektrikum-Entfernung
DE19880070D2 (de) Verfahren zur Oberflächenbeizung
DE69029696D1 (de) Verfahren zur Behandlung einer Kupferfolienoberfläche

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee