DE69500796T2 - Ladungsvorrichtung für Halbleiter-Plättchen - Google Patents

Ladungsvorrichtung für Halbleiter-Plättchen

Info

Publication number
DE69500796T2
DE69500796T2 DE1995600796 DE69500796T DE69500796T2 DE 69500796 T2 DE69500796 T2 DE 69500796T2 DE 1995600796 DE1995600796 DE 1995600796 DE 69500796 T DE69500796 T DE 69500796T DE 69500796 T2 DE69500796 T2 DE 69500796T2
Authority
DE
Germany
Prior art keywords
semiconductor wafer
charging device
wafer charging
semiconductor
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE1995600796
Other languages
English (en)
Other versions
DE69500796D1 (de
Inventor
Daniel Testa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics SA
Original Assignee
SGS Thomson Microelectronics SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SGS Thomson Microelectronics SA filed Critical SGS Thomson Microelectronics SA
Publication of DE69500796D1 publication Critical patent/DE69500796D1/de
Application granted granted Critical
Publication of DE69500796T2 publication Critical patent/DE69500796T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
DE1995600796 1994-07-29 1995-07-25 Ladungsvorrichtung für Halbleiter-Plättchen Expired - Fee Related DE69500796T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9409484A FR2723077B1 (fr) 1994-07-29 1994-07-29 Appareil de chargement de plaquettes de semi-conducteur

Publications (2)

Publication Number Publication Date
DE69500796D1 DE69500796D1 (de) 1997-11-06
DE69500796T2 true DE69500796T2 (de) 1998-02-12

Family

ID=9465929

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1995600796 Expired - Fee Related DE69500796T2 (de) 1994-07-29 1995-07-25 Ladungsvorrichtung für Halbleiter-Plättchen

Country Status (3)

Country Link
EP (1) EP0694958B1 (de)
DE (1) DE69500796T2 (de)
FR (1) FR2723077B1 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1312584C (zh) * 2003-01-27 2007-04-25 旺宏电子股份有限公司 预防晶圆重复沉积的方法
CN111361967B (zh) * 2020-03-13 2022-02-25 北京七星华创集成电路装备有限公司 一种卡夹校正装置和卡夹校正设备

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5004399A (en) * 1987-09-04 1991-04-02 Texas Instruments Incorporated Robot slice aligning end effector
US5095300A (en) * 1990-03-28 1992-03-10 Nec Electronics Inc. Device for sensing side positioning of wafers

Also Published As

Publication number Publication date
FR2723077B1 (fr) 1996-09-13
DE69500796D1 (de) 1997-11-06
EP0694958B1 (de) 1997-10-01
EP0694958A1 (de) 1996-01-31
FR2723077A1 (fr) 1996-02-02

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee