DE69430114D1 - Element-Anschlussfläche für Halbleiteranordnungsmontageplatte - Google Patents
Element-Anschlussfläche für HalbleiteranordnungsmontageplatteInfo
- Publication number
- DE69430114D1 DE69430114D1 DE69430114T DE69430114T DE69430114D1 DE 69430114 D1 DE69430114 D1 DE 69430114D1 DE 69430114 T DE69430114 T DE 69430114T DE 69430114 T DE69430114 T DE 69430114T DE 69430114 D1 DE69430114 D1 DE 69430114D1
- Authority
- DE
- Germany
- Prior art keywords
- mounting plate
- assembly mounting
- semiconductor assembly
- element pad
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
- H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Ceramic Products (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5330278A JP2606115B2 (ja) | 1993-12-27 | 1993-12-27 | 半導体実装基板用素子接合パッド |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69430114D1 true DE69430114D1 (de) | 2002-04-18 |
DE69430114T2 DE69430114T2 (de) | 2002-11-07 |
Family
ID=18230867
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69430114T Expired - Lifetime DE69430114T2 (de) | 1993-12-27 | 1994-12-22 | Element-Anschlussfläche für Halbleiteranordnungsmontageplatte |
Country Status (4)
Country | Link |
---|---|
US (1) | US5485352A (de) |
EP (1) | EP0660404B1 (de) |
JP (1) | JP2606115B2 (de) |
DE (1) | DE69430114T2 (de) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5910644A (en) * | 1997-06-11 | 1999-06-08 | International Business Machines Corporation | Universal surface finish for DCA, SMT and pad on pad interconnections |
US6476332B1 (en) | 2001-09-12 | 2002-11-05 | Visteon Global Technologies, Inc. | Conductor systems for thick film electronic circuits |
DE10333439A1 (de) * | 2003-07-23 | 2005-02-17 | Robert Bosch Gmbh | Verfahren zur Herstellung eines aus mehreren Verdrahtungsebenen bestehenden Hybrid-Produktes |
KR101159514B1 (ko) * | 2007-05-24 | 2012-06-26 | 프린코 코포레이션 | 다층기판 금속배선 제조방법 및 그 구조 |
TWI354523B (en) * | 2007-05-25 | 2011-12-11 | Princo Corp | Method for manufacturing metal lines in multi-laye |
US8815333B2 (en) | 2007-12-05 | 2014-08-26 | Princo Middle East Fze | Manufacturing method of metal structure in multi-layer substrate |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3964666A (en) * | 1975-03-31 | 1976-06-22 | Western Electric Company, Inc. | Bonding contact members to circuit boards |
JPS584955A (ja) * | 1981-06-30 | 1983-01-12 | Shinko Electric Ind Co Ltd | 金めつきされた電子部品パツケ−ジ |
JPS59114846A (ja) * | 1982-12-21 | 1984-07-03 | Narumi China Corp | 半導体塔載用セラミツクパツケ−ジ |
JPS59121957A (ja) * | 1982-12-28 | 1984-07-14 | Nec Corp | 半導体装置用容器の製造方法 |
GB2134136B (en) * | 1983-01-19 | 1986-03-26 | Shell Int Research | An electronic conduit and a method of manufacturing it |
DE3312713A1 (de) * | 1983-04-08 | 1984-10-11 | The Furukawa Electric Co., Ltd., Tokio/Tokyo | Silberbeschichtete elektrische materialien und verfahren zu ihrer herstellung |
JPS6196754A (ja) * | 1984-10-17 | 1986-05-15 | Nec Corp | ピン付き基板 |
JPS628533A (ja) * | 1985-07-05 | 1987-01-16 | Hitachi Ltd | 金めつきされた電子部品パツケ−ジ |
JP2554358B2 (ja) * | 1988-05-25 | 1996-11-13 | 沖電気工業株式会社 | 配線基板及び配線基板の製造方法 |
JP2572823B2 (ja) * | 1988-09-22 | 1997-01-16 | 日本碍子株式会社 | セラミック接合体 |
JPH0484449A (ja) * | 1990-07-27 | 1992-03-17 | Shinko Electric Ind Co Ltd | Tabテープ |
JPH04101489A (ja) * | 1990-08-20 | 1992-04-02 | Kyocera Corp | 薄膜配線基板 |
JPH0628533A (ja) * | 1992-07-07 | 1994-02-04 | Dainippon Printing Co Ltd | Icカードとicカードのデータ記憶方法 |
JP2783093B2 (ja) * | 1992-10-21 | 1998-08-06 | 日本電気株式会社 | プリント配線板 |
JP2832411B2 (ja) * | 1992-12-22 | 1998-12-09 | 日本航空電子工業株式会社 | スーパールミネッセントダイオード |
-
1993
- 1993-12-27 JP JP5330278A patent/JP2606115B2/ja not_active Expired - Lifetime
-
1994
- 1994-12-16 US US08/358,196 patent/US5485352A/en not_active Expired - Lifetime
- 1994-12-22 DE DE69430114T patent/DE69430114T2/de not_active Expired - Lifetime
- 1994-12-22 EP EP94120431A patent/EP0660404B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US5485352A (en) | 1996-01-16 |
JP2606115B2 (ja) | 1997-04-30 |
EP0660404A3 (de) | 1996-03-27 |
DE69430114T2 (de) | 2002-11-07 |
JPH07193161A (ja) | 1995-07-28 |
EP0660404B1 (de) | 2002-03-13 |
EP0660404A2 (de) | 1995-06-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |