DE69429967D1 - TAB-Schaltungsschmelzverbindungen zur Trennung oder Kodierungsinformation - Google Patents

TAB-Schaltungsschmelzverbindungen zur Trennung oder Kodierungsinformation

Info

Publication number
DE69429967D1
DE69429967D1 DE69429967T DE69429967T DE69429967D1 DE 69429967 D1 DE69429967 D1 DE 69429967D1 DE 69429967 T DE69429967 T DE 69429967T DE 69429967 T DE69429967 T DE 69429967T DE 69429967 D1 DE69429967 D1 DE 69429967D1
Authority
DE
Germany
Prior art keywords
separation
coding information
tab circuit
circuit fuses
fuses
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69429967T
Other languages
English (en)
Other versions
DE69429967T2 (de
Inventor
Winthrop D Childers
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HP Inc
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Application granted granted Critical
Publication of DE69429967D1 publication Critical patent/DE69429967D1/de
Publication of DE69429967T2 publication Critical patent/DE69429967T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/17Ink jet characterised by ink handling
    • B41J2/175Ink supply systems ; Circuit parts therefor
    • B41J2/17503Ink cartridges
    • B41J2/17526Electrical contacts to the cartridge
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J25/00Actions or mechanisms not otherwise provided for
    • B41J25/34Bodily-changeable print heads or carriages
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0266Marks, test patterns or identification means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0286Programmable, customizable or modifiable circuits
    • H05K1/0293Individual printed conductors which are adapted for modification, e.g. fusable or breakable conductors, printed switches
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0286Programmable, customizable or modifiable circuits
    • H05K1/029Programmable, customizable or modifiable circuits having a programmable lay-out, i.e. adapted for choosing between a few possibilities
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0393Flexible materials
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09654Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09727Varying width along a single conductor; Conductors or pads having different widths
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10181Fuse
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1115Resistance heating, e.g. by current through the PCB conductors or through a metallic mask
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17Post-manufacturing processes
    • H05K2203/173Adding connections between adjacent pads or conductors, e.g. for modifying or repairing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17Post-manufacturing processes
    • H05K2203/175Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/24Reinforcing the conductive pattern
    • H05K3/241Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H05K3/242Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus characterised by using temporary conductors on the printed circuit for electrically connecting areas which are to be electroplated

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Accessory Devices And Overall Control Thereof (AREA)
  • Combinations Of Printed Boards (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
DE69429967T 1993-11-16 1994-11-10 TAB-Schaltungsschmelzverbindungen zur Trennung oder Kodierungsinformation Expired - Lifetime DE69429967T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/153,728 US5471163A (en) 1993-11-16 1993-11-16 Tab circuit fusible links for disconnection or encoding information

Publications (2)

Publication Number Publication Date
DE69429967D1 true DE69429967D1 (de) 2002-04-04
DE69429967T2 DE69429967T2 (de) 2002-09-05

Family

ID=22548482

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69429967T Expired - Lifetime DE69429967T2 (de) 1993-11-16 1994-11-10 TAB-Schaltungsschmelzverbindungen zur Trennung oder Kodierungsinformation

Country Status (5)

Country Link
US (1) US5471163A (de)
EP (1) EP0654958B1 (de)
JP (1) JP3784848B2 (de)
DE (1) DE69429967T2 (de)
SG (1) SG74552A1 (de)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0157345B1 (ko) * 1995-06-30 1998-12-01 김광호 반도체 메모리 소자의 전기 휴즈셀
JPH10233564A (ja) * 1997-02-19 1998-09-02 Alps Electric Co Ltd フレキシブル基板
US6227643B1 (en) * 1997-05-20 2001-05-08 Encad, Inc. Intelligent printer components and printing system
US6290333B1 (en) 1997-10-28 2001-09-18 Hewlett-Packard Company Multiple power interconnect arrangement for inkjet printhead
US6386674B1 (en) 1997-10-28 2002-05-14 Hewlett-Packard Company Independent power supplies for color inkjet printers
DE19752938C2 (de) * 1997-11-28 2000-05-31 Pelikan Produktions Ag Egg Umkodierung von Tintendruckköpfen
US6299274B1 (en) 1997-12-15 2001-10-09 Lexmark International, Inc. Thermal ink jet printer cartridge identification
US6278468B1 (en) 1998-03-30 2001-08-21 Xerox Corporation Liquid ink printhead including a programmable temperature sensing device
EP0986289A3 (de) * 1998-09-09 2000-06-07 Siemens Aktiengesellschaft Schaltungsanordnung und Verfahren zur Kennzeichnung von Leiterplatten
WO2000023279A1 (en) * 1998-10-16 2000-04-27 Silverbrook Research Pty. Limited Improvements relating to inkjet printers
AU1139100A (en) * 1998-10-16 2000-05-08 Silverbrook Research Pty Limited Improvements relating to inkjet printers
US7216956B2 (en) * 1998-10-16 2007-05-15 Silverbrook Research Pty Ltd Printhead assembly with power and ground connections along single edge
AUPP702498A0 (en) * 1998-11-09 1998-12-03 Silverbrook Research Pty Ltd Image creation method and apparatus (ART77)
US6377433B1 (en) * 2000-03-17 2002-04-23 The Boeing Company Electrical fuse/support assembly
JP3649123B2 (ja) 2000-12-26 2005-05-18 セイコーエプソン株式会社 回路基板の端子
US20040257402A1 (en) * 2001-07-13 2004-12-23 Lynch Patrick J Printhead for a printer cartridge
US6830391B2 (en) * 2001-09-21 2004-12-14 Panduit Corp. Media cartridge with printed circuit board for use in a printing system
US20050097385A1 (en) * 2003-10-15 2005-05-05 Ahne Adam J. Method of fault correction for an array of fusible links
US7137690B2 (en) * 2003-10-31 2006-11-21 Hewlett-Packard Development Company, L.P. Interconnect circuit
US7101029B2 (en) 2003-10-31 2006-09-05 Hewlett-Packard Development Company, L.P. Interconnect circuit
US6946718B2 (en) * 2004-01-05 2005-09-20 Hewlett-Packard Development Company, L.P. Integrated fuse for multilayered structure
US7108357B2 (en) * 2004-02-13 2006-09-19 Hewlett-Packard Development Company, L.P. Device identification using a programmable memory circuit
JP4194580B2 (ja) * 2004-06-02 2008-12-10 キヤノン株式会社 ヘッド基板、記録ヘッド、ヘッドカートリッジ、及び記録装置
JP4137088B2 (ja) * 2004-06-02 2008-08-20 キヤノン株式会社 ヘッド基板、記録ヘッド、ヘッドカートリッジ、記録装置、及び情報入出力方法
CN100384629C (zh) * 2004-11-29 2008-04-30 晶强电子股份有限公司 喷墨印头的软性电路板及其制造方法
FI122644B (fi) 2007-06-08 2012-04-30 Teknologian Tutkimuskeskus Vtt Menetelmä sähköisesti johtavien tai puolijohtavien reittien muodostamiseksi substraatille sekä menetelmän käyttö transistorien tuottamiseen ja anturien valmistukseen
DE102007036836A1 (de) * 2007-08-02 2009-02-05 Siemens Ag Gerätecodierung durch Leiterplattensicherungen sowie Verfahren zur Speicherung von Konfigurationsdaten
KR101565798B1 (ko) * 2009-03-31 2015-11-05 삼성전자주식회사 콘택 패드와 도전 라인과의 일체형 구조를 가지는 반도체 소자
US10009993B2 (en) * 2014-04-18 2018-06-26 Xerox Corporation Circuit board reflow of components using on board copper traces as heating element
DE102014211838A1 (de) * 2014-06-20 2015-12-24 Robert Bosch Gmbh Verfahren zum Herstellen eines Layoutträgers, Layoutträgerzwischenprodukt und Layoutträger
US10796873B2 (en) * 2017-12-15 2020-10-06 Nio Usa, Inc. Fusible link in battery module voltage sensing circuit

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3967161A (en) * 1972-06-14 1976-06-29 Lichtblau G J A multi-frequency resonant tag circuit for use with an electronic security system having improved noise discrimination
JPS6052084A (ja) * 1983-08-31 1985-03-23 株式会社東芝 印刷配線基板
DE3530354A1 (de) * 1985-08-24 1987-03-05 Opel Adam Ag Elektrische sicherungsanordnung
US4806106A (en) * 1987-04-09 1989-02-21 Hewlett-Packard Company Interconnect lead frame for thermal ink jet printhead and methods of manufacture
US4918385A (en) * 1987-05-18 1990-04-17 Hewlett-Packard Company Method and process for testing the reliability of integrated circuit (IC) chips and novel IC circuitry for accomplishing same
EP0426692B1 (de) * 1988-07-25 1993-04-28 Siemens Aktiengesellschaft Anordnung zur überwachung von tintenvorratsbehältern in tintendruckeinrichtungen
US4878070A (en) * 1988-10-17 1989-10-31 Xerox Corporation Thermal ink jet print cartridge assembly
EP0412459B1 (de) * 1989-08-05 1998-11-25 Canon Kabushiki Kaisha Tintenstrahlaufzeichnungsgerät und Tintenkassette dafür
US5059950A (en) * 1990-09-04 1991-10-22 Monarch Marking Systems, Inc. Deactivatable electronic article surveillance tags, tag webs and method of making tag webs
US5099219A (en) * 1991-02-28 1992-03-24 Rock, Ltd. Partnership Fusible flexible printed circuit and method of making same

Also Published As

Publication number Publication date
DE69429967T2 (de) 2002-09-05
US5471163A (en) 1995-11-28
EP0654958B1 (de) 2002-02-27
SG74552A1 (en) 2000-08-22
JPH07183641A (ja) 1995-07-21
JP3784848B2 (ja) 2006-06-14
EP0654958A1 (de) 1995-05-24

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Legal Events

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8364 No opposition during term of opposition