DE69429967D1 - TAB-Schaltungsschmelzverbindungen zur Trennung oder Kodierungsinformation - Google Patents
TAB-Schaltungsschmelzverbindungen zur Trennung oder KodierungsinformationInfo
- Publication number
- DE69429967D1 DE69429967D1 DE69429967T DE69429967T DE69429967D1 DE 69429967 D1 DE69429967 D1 DE 69429967D1 DE 69429967 T DE69429967 T DE 69429967T DE 69429967 T DE69429967 T DE 69429967T DE 69429967 D1 DE69429967 D1 DE 69429967D1
- Authority
- DE
- Germany
- Prior art keywords
- separation
- coding information
- tab circuit
- circuit fuses
- fuses
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/17—Ink jet characterised by ink handling
- B41J2/175—Ink supply systems ; Circuit parts therefor
- B41J2/17503—Ink cartridges
- B41J2/17526—Electrical contacts to the cartridge
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J25/00—Actions or mechanisms not otherwise provided for
- B41J25/34—Bodily-changeable print heads or carriages
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
- H05K1/0293—Individual printed conductors which are adapted for modification, e.g. fusable or breakable conductors, printed switches
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
- H05K1/029—Programmable, customizable or modifiable circuits having a programmable lay-out, i.e. adapted for choosing between a few possibilities
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10181—Fuse
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1115—Resistance heating, e.g. by current through the PCB conductors or through a metallic mask
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/173—Adding connections between adjacent pads or conductors, e.g. for modifying or repairing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
- H05K3/242—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus characterised by using temporary conductors on the printed circuit for electrically connecting areas which are to be electroplated
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Accessory Devices And Overall Control Thereof (AREA)
- Combinations Of Printed Boards (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/153,728 US5471163A (en) | 1993-11-16 | 1993-11-16 | Tab circuit fusible links for disconnection or encoding information |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69429967D1 true DE69429967D1 (de) | 2002-04-04 |
DE69429967T2 DE69429967T2 (de) | 2002-09-05 |
Family
ID=22548482
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69429967T Expired - Lifetime DE69429967T2 (de) | 1993-11-16 | 1994-11-10 | TAB-Schaltungsschmelzverbindungen zur Trennung oder Kodierungsinformation |
Country Status (5)
Country | Link |
---|---|
US (1) | US5471163A (de) |
EP (1) | EP0654958B1 (de) |
JP (1) | JP3784848B2 (de) |
DE (1) | DE69429967T2 (de) |
SG (1) | SG74552A1 (de) |
Families Citing this family (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR0157345B1 (ko) * | 1995-06-30 | 1998-12-01 | 김광호 | 반도체 메모리 소자의 전기 휴즈셀 |
JPH10233564A (ja) * | 1997-02-19 | 1998-09-02 | Alps Electric Co Ltd | フレキシブル基板 |
US6227643B1 (en) * | 1997-05-20 | 2001-05-08 | Encad, Inc. | Intelligent printer components and printing system |
US6290333B1 (en) | 1997-10-28 | 2001-09-18 | Hewlett-Packard Company | Multiple power interconnect arrangement for inkjet printhead |
US6386674B1 (en) | 1997-10-28 | 2002-05-14 | Hewlett-Packard Company | Independent power supplies for color inkjet printers |
DE19752938C2 (de) * | 1997-11-28 | 2000-05-31 | Pelikan Produktions Ag Egg | Umkodierung von Tintendruckköpfen |
US6299274B1 (en) | 1997-12-15 | 2001-10-09 | Lexmark International, Inc. | Thermal ink jet printer cartridge identification |
US6278468B1 (en) | 1998-03-30 | 2001-08-21 | Xerox Corporation | Liquid ink printhead including a programmable temperature sensing device |
EP0986289A3 (de) * | 1998-09-09 | 2000-06-07 | Siemens Aktiengesellschaft | Schaltungsanordnung und Verfahren zur Kennzeichnung von Leiterplatten |
WO2000023279A1 (en) * | 1998-10-16 | 2000-04-27 | Silverbrook Research Pty. Limited | Improvements relating to inkjet printers |
AU1139100A (en) * | 1998-10-16 | 2000-05-08 | Silverbrook Research Pty Limited | Improvements relating to inkjet printers |
US7216956B2 (en) * | 1998-10-16 | 2007-05-15 | Silverbrook Research Pty Ltd | Printhead assembly with power and ground connections along single edge |
AUPP702498A0 (en) * | 1998-11-09 | 1998-12-03 | Silverbrook Research Pty Ltd | Image creation method and apparatus (ART77) |
US6377433B1 (en) * | 2000-03-17 | 2002-04-23 | The Boeing Company | Electrical fuse/support assembly |
JP3649123B2 (ja) † | 2000-12-26 | 2005-05-18 | セイコーエプソン株式会社 | 回路基板の端子 |
US20040257402A1 (en) * | 2001-07-13 | 2004-12-23 | Lynch Patrick J | Printhead for a printer cartridge |
US6830391B2 (en) * | 2001-09-21 | 2004-12-14 | Panduit Corp. | Media cartridge with printed circuit board for use in a printing system |
US20050097385A1 (en) * | 2003-10-15 | 2005-05-05 | Ahne Adam J. | Method of fault correction for an array of fusible links |
US7137690B2 (en) * | 2003-10-31 | 2006-11-21 | Hewlett-Packard Development Company, L.P. | Interconnect circuit |
US7101029B2 (en) | 2003-10-31 | 2006-09-05 | Hewlett-Packard Development Company, L.P. | Interconnect circuit |
US6946718B2 (en) * | 2004-01-05 | 2005-09-20 | Hewlett-Packard Development Company, L.P. | Integrated fuse for multilayered structure |
US7108357B2 (en) * | 2004-02-13 | 2006-09-19 | Hewlett-Packard Development Company, L.P. | Device identification using a programmable memory circuit |
JP4194580B2 (ja) * | 2004-06-02 | 2008-12-10 | キヤノン株式会社 | ヘッド基板、記録ヘッド、ヘッドカートリッジ、及び記録装置 |
JP4137088B2 (ja) * | 2004-06-02 | 2008-08-20 | キヤノン株式会社 | ヘッド基板、記録ヘッド、ヘッドカートリッジ、記録装置、及び情報入出力方法 |
CN100384629C (zh) * | 2004-11-29 | 2008-04-30 | 晶强电子股份有限公司 | 喷墨印头的软性电路板及其制造方法 |
FI122644B (fi) | 2007-06-08 | 2012-04-30 | Teknologian Tutkimuskeskus Vtt | Menetelmä sähköisesti johtavien tai puolijohtavien reittien muodostamiseksi substraatille sekä menetelmän käyttö transistorien tuottamiseen ja anturien valmistukseen |
DE102007036836A1 (de) * | 2007-08-02 | 2009-02-05 | Siemens Ag | Gerätecodierung durch Leiterplattensicherungen sowie Verfahren zur Speicherung von Konfigurationsdaten |
KR101565798B1 (ko) * | 2009-03-31 | 2015-11-05 | 삼성전자주식회사 | 콘택 패드와 도전 라인과의 일체형 구조를 가지는 반도체 소자 |
US10009993B2 (en) * | 2014-04-18 | 2018-06-26 | Xerox Corporation | Circuit board reflow of components using on board copper traces as heating element |
DE102014211838A1 (de) * | 2014-06-20 | 2015-12-24 | Robert Bosch Gmbh | Verfahren zum Herstellen eines Layoutträgers, Layoutträgerzwischenprodukt und Layoutträger |
US10796873B2 (en) * | 2017-12-15 | 2020-10-06 | Nio Usa, Inc. | Fusible link in battery module voltage sensing circuit |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3967161A (en) * | 1972-06-14 | 1976-06-29 | Lichtblau G J | A multi-frequency resonant tag circuit for use with an electronic security system having improved noise discrimination |
JPS6052084A (ja) * | 1983-08-31 | 1985-03-23 | 株式会社東芝 | 印刷配線基板 |
DE3530354A1 (de) * | 1985-08-24 | 1987-03-05 | Opel Adam Ag | Elektrische sicherungsanordnung |
US4806106A (en) * | 1987-04-09 | 1989-02-21 | Hewlett-Packard Company | Interconnect lead frame for thermal ink jet printhead and methods of manufacture |
US4918385A (en) * | 1987-05-18 | 1990-04-17 | Hewlett-Packard Company | Method and process for testing the reliability of integrated circuit (IC) chips and novel IC circuitry for accomplishing same |
EP0426692B1 (de) * | 1988-07-25 | 1993-04-28 | Siemens Aktiengesellschaft | Anordnung zur überwachung von tintenvorratsbehältern in tintendruckeinrichtungen |
US4878070A (en) * | 1988-10-17 | 1989-10-31 | Xerox Corporation | Thermal ink jet print cartridge assembly |
EP0412459B1 (de) * | 1989-08-05 | 1998-11-25 | Canon Kabushiki Kaisha | Tintenstrahlaufzeichnungsgerät und Tintenkassette dafür |
US5059950A (en) * | 1990-09-04 | 1991-10-22 | Monarch Marking Systems, Inc. | Deactivatable electronic article surveillance tags, tag webs and method of making tag webs |
US5099219A (en) * | 1991-02-28 | 1992-03-24 | Rock, Ltd. Partnership | Fusible flexible printed circuit and method of making same |
-
1993
- 1993-11-16 US US08/153,728 patent/US5471163A/en not_active Expired - Lifetime
-
1994
- 1994-11-10 DE DE69429967T patent/DE69429967T2/de not_active Expired - Lifetime
- 1994-11-10 EP EP94117779A patent/EP0654958B1/de not_active Expired - Lifetime
- 1994-11-10 SG SG1996004201A patent/SG74552A1/en unknown
- 1994-11-16 JP JP30807794A patent/JP3784848B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE69429967T2 (de) | 2002-09-05 |
US5471163A (en) | 1995-11-28 |
EP0654958B1 (de) | 2002-02-27 |
SG74552A1 (en) | 2000-08-22 |
JPH07183641A (ja) | 1995-07-21 |
JP3784848B2 (ja) | 2006-06-14 |
EP0654958A1 (de) | 1995-05-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |