DE69424895T2 - Mischgasversorgungssystem - Google Patents

Mischgasversorgungssystem

Info

Publication number
DE69424895T2
DE69424895T2 DE69424895T DE69424895T DE69424895T2 DE 69424895 T2 DE69424895 T2 DE 69424895T2 DE 69424895 T DE69424895 T DE 69424895T DE 69424895 T DE69424895 T DE 69424895T DE 69424895 T2 DE69424895 T2 DE 69424895T2
Authority
DE
Germany
Prior art keywords
gas supply
supply system
mixed gas
mixed
supply
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69424895T
Other languages
English (en)
Other versions
DE69424895D1 (de
Inventor
Yukinobu Nishikawa
Yoshinori Hashizume
Takako Kimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Air Liquide SA
LAir Liquide SA pour lEtude et lExploitation des Procedes Georges Claude
Air Liquide Japan GK
Original Assignee
Air Liquide SA
LAir Liquide SA pour lEtude et lExploitation des Procedes Georges Claude
Air Liquide Japan GK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Air Liquide SA, LAir Liquide SA pour lEtude et lExploitation des Procedes Georges Claude, Air Liquide Japan GK filed Critical Air Liquide SA
Publication of DE69424895D1 publication Critical patent/DE69424895D1/de
Application granted granted Critical
Publication of DE69424895T2 publication Critical patent/DE69424895T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45561—Gas plumbing upstream of the reaction chamber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F23/00—Mixing according to the phases to be mixed, e.g. dispersing or emulsifying
    • B01F23/10—Mixing gases with gases
    • B01F23/19—Mixing systems, i.e. flow charts or diagrams; Arrangements, e.g. comprising controlling means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J4/00—Feed or outlet devices; Feed or outlet control devices
    • B01J4/008—Feed or outlet control devices
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
DE69424895T 1993-05-07 1994-04-15 Mischgasversorgungssystem Expired - Fee Related DE69424895T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10702993A JP3174856B2 (ja) 1993-05-07 1993-05-07 混合ガス供給装置

Publications (2)

Publication Number Publication Date
DE69424895D1 DE69424895D1 (de) 2000-07-20
DE69424895T2 true DE69424895T2 (de) 2000-11-09

Family

ID=14448718

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69424895T Expired - Fee Related DE69424895T2 (de) 1993-05-07 1994-04-15 Mischgasversorgungssystem

Country Status (6)

Country Link
US (1) US5470390A (de)
EP (1) EP0623381B1 (de)
JP (1) JP3174856B2 (de)
KR (1) KR940027043A (de)
DE (1) DE69424895T2 (de)
TW (1) TW247965B (de)

Families Citing this family (56)

* Cited by examiner, † Cited by third party
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KR100389502B1 (ko) 1994-11-16 2003-10-22 굿리치 코포레이션 압력구배화학기상침투및화학기상증착장치,방법및이에의한생성물
US5620524A (en) * 1995-02-27 1997-04-15 Fan; Chiko Apparatus for fluid delivery in chemical vapor deposition systems
JP3360539B2 (ja) * 1996-07-12 2002-12-24 信越半導体株式会社 ガス供給装置及び気相成長用設備
US6074691A (en) * 1997-06-24 2000-06-13 Balzers Aktiengesellschaft Method for monitoring the flow of a gas into a vacuum reactor
IT1298117B1 (it) * 1998-01-14 1999-12-20 Air Liquide Italia S R L Metodo per ottenere un fluido per saldatura avente caratteristiche chimico-fisiche costanti nel tempo ed impianto per il suo
US6039809A (en) * 1998-01-27 2000-03-21 Mitsubishi Materials Silicon Corporation Method and apparatus for feeding a gas for epitaxial growth
JPH11285628A (ja) * 1998-04-02 1999-10-19 Matsushita Electric Ind Co Ltd ガス混合装置及びガス放電パネルの製造方法
US6216708B1 (en) * 1998-07-23 2001-04-17 Micron Technology, Inc. On-line cleaning method for CVD vaporizers
US6669988B2 (en) 2001-08-20 2003-12-30 Goodrich Corporation Hardware assembly for CVI/CVD processes
US7476419B2 (en) * 1998-10-23 2009-01-13 Goodrich Corporation Method for measurement of weight during a CVI/CVD process
KR100330749B1 (ko) * 1999-12-17 2002-04-03 서성기 반도체 박막증착장치
US6772781B2 (en) * 2000-02-04 2004-08-10 Air Liquide America, L.P. Apparatus and method for mixing gases
US6887337B2 (en) * 2000-09-19 2005-05-03 Xactix, Inc. Apparatus for etching semiconductor samples and a source for providing a gas by sublimation thereto
US6591850B2 (en) * 2001-06-29 2003-07-15 Applied Materials, Inc. Method and apparatus for fluid flow control
JP4071968B2 (ja) * 2002-01-17 2008-04-02 東芝三菱電機産業システム株式会社 ガス供給システム及びガス供給方法
TWI273642B (en) * 2002-04-19 2007-02-11 Ulvac Inc Film-forming apparatus and film-forming method
JP3973605B2 (ja) * 2002-07-10 2007-09-12 東京エレクトロン株式会社 成膜装置及びこれに使用する原料供給装置、成膜方法
ES2302776T3 (es) * 2002-09-25 2008-08-01 Oskar Frech Gmbh + Co. Kg Dispositivo de gas de proteccion para maquinas de colada a presion.
WO2004088415A2 (en) * 2003-03-28 2004-10-14 Advanced Technology Materials Inc. Photometrically modulated delivery of reagents
US7063097B2 (en) * 2003-03-28 2006-06-20 Advanced Technology Materials, Inc. In-situ gas blending and dilution system for delivery of dilute gas at a predetermined concentration
JP4423914B2 (ja) * 2003-05-13 2010-03-03 東京エレクトロン株式会社 処理装置及びその使用方法
KR100541050B1 (ko) * 2003-07-22 2006-01-11 삼성전자주식회사 가스공급장치 및 이를 이용한 반도체소자 제조설비
KR100560772B1 (ko) * 2003-09-24 2006-03-13 삼성전자주식회사 가스 공급 장치를 구비하는 반응 챔버 시스템
US20060130896A1 (en) * 2004-01-07 2006-06-22 Skibinski Gregory J High reliability gas mixture back-up system
JP2005262079A (ja) * 2004-03-18 2005-09-29 Taiyo Nippon Sanso Corp 混合ガス供給装置の運転制御方法
US7389722B2 (en) * 2004-06-22 2008-06-24 Fresh Express Incorporated Gas flush mixing system and method
US20060000509A1 (en) * 2004-07-01 2006-01-05 Pozniak Peter M Fluid flow control device and system
JP5264039B2 (ja) * 2004-08-10 2013-08-14 東京エレクトロン株式会社 薄膜形成装置及び薄膜形成方法
WO2006075984A1 (en) * 2005-01-12 2006-07-20 Micro Motion, Inc. Gas flowmeter calibration stand
US7201071B2 (en) * 2005-02-11 2007-04-10 Horiba, Ltd. Wide range continuous diluter
JP4868439B2 (ja) * 2005-03-04 2012-02-01 エイブル株式会社 ガス混合装置及びガス混合方法
US20060243207A1 (en) * 2005-04-20 2006-11-02 Jursich Gregory M Fluid mixing and delivery system
US7717294B2 (en) 2005-06-20 2010-05-18 South-Tek Systems Beverage dispensing gas consumption detection with alarm and backup operation
JP2008543563A (ja) 2005-06-22 2008-12-04 アドバンスド テクノロジー マテリアルズ，インコーポレイテッド 一体型のガス混合装置およびプロセス
KR101468606B1 (ko) * 2007-05-25 2014-12-04 어플라이드 머티어리얼스, 인코포레이티드 전자 디바이스 제조 시스템들을 조립하고 작동시키는 방법들 및 장치
JP5459895B2 (ja) * 2007-10-15 2014-04-02 Ｃｋｄ株式会社 ガス分流供給ユニット
RU2446005C1 (ru) * 2010-07-20 2012-03-27 Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Юго-Западный государственный университет" (ЮЗГУ) Устройство для приготовления многокомпонентных газовых смесей
JP5657446B2 (ja) * 2011-03-23 2015-01-21 株式会社東芝 シリンダーキャビネット
JP5720406B2 (ja) * 2011-05-10 2015-05-20 東京エレクトロン株式会社 ガス供給装置、熱処理装置、ガス供給方法及び熱処理方法
JP5824372B2 (ja) * 2012-01-25 2015-11-25 東京エレクトロン株式会社 処理装置及びプロセス状態の確認方法
EP2667276B1 (de) * 2012-05-24 2017-11-08 Air Products And Chemicals, Inc. Verfahren und Vorrichtung zur Bereitstellung einer Gasmischung
DE102014100135A1 (de) * 2014-01-08 2015-07-09 Aixtron Se Gasmischvorrichtung an einem Reaktor mit Wegeventil
KR101485356B1 (ko) * 2014-06-17 2015-01-27 주식회사 하이퓨리티 Led 및 반도체 웨이퍼 챔버 세정시에 사용되는 세정혼합가스 공급장치 및 이의 구동방법
FR3026319A1 (fr) * 2014-09-26 2016-04-01 Centre Nat Rech Scient Dispositif d'alimentation en gaz d'un equipement de laboratoire et methode de distribution dans le dispositif
US9620376B2 (en) * 2015-08-19 2017-04-11 Lam Research Corporation Self limiting lateral atomic layer etch
US20170362701A1 (en) * 2016-06-16 2017-12-21 Veeco Instruments Inc. Central source delivery for chemical vapor deposition systems
CN107789999A (zh) * 2016-08-30 2018-03-13 中国石油天然气股份有限公司 一种配制多瓶混合标准气体的装置及方法
US11518696B2 (en) 2018-08-29 2022-12-06 Mks Instruments Ozonated water delivery system and method of use
DE102019117543A1 (de) * 2019-06-28 2020-12-31 Aixtron Se Verfahren zum Kalibrieren/Verifizieren von Massenfluss-Mess/Steuer-Geräten eines Gasmischsystems und Vorrichtung zur Durchführung des Verfahrens
CN110314565B (zh) * 2019-08-07 2024-03-15 国网安徽省电力有限公司电力科学研究院 多功能c4f7n/co2混合气体配气系统、配气方法
CN110479123A (zh) * 2019-09-24 2019-11-22 苏州宏博净化设备有限公司 智能型自动氢氮配比装置
FR3111086A1 (fr) * 2020-06-05 2021-12-10 Air Liquide Electronics Systems Installation et procédé de distribution d’un mélange de gaz pour le dopage de plaquettes de silicium
FR3111085B1 (fr) * 2020-06-05 2023-05-12 Air Liquide Electronics Systems Installation et procédé de distribution d’un mélange de gaz
JP2022076382A (ja) * 2020-11-09 2022-05-19 東京エレクトロン株式会社 処理装置及び処理方法
CN113385070A (zh) * 2021-04-21 2021-09-14 铜陵有色金属集团股份有限公司 一种乳化液生产用双系统石灰乳化车间及其工作方法
CN114984842A (zh) * 2022-05-13 2022-09-02 上海至纯系统集成有限公司 一种芯片用高纯特种气体混配柜

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3330773A (en) * 1963-03-28 1967-07-11 Du Pont Process for preparing gaseous mixtures
JPS58115812A (ja) * 1981-12-28 1983-07-09 Fujitsu Ltd 半導体装置製造用ガス供給装置
JPS5980325A (ja) * 1982-10-29 1984-05-09 Fujitsu Ltd 反応ガス分配方法
JPH0766919B2 (ja) * 1991-02-20 1995-07-19 株式会社半導体プロセス研究所 半導体製造装置
JP2567099Y2 (ja) * 1991-06-07 1998-03-30 山形日本電気株式会社 ガス供給装置

Also Published As

Publication number Publication date
JPH06319972A (ja) 1994-11-22
TW247965B (de) 1995-05-21
KR940027043A (ko) 1994-12-10
US5470390A (en) 1995-11-28
DE69424895D1 (de) 2000-07-20
EP0623381B1 (de) 2000-06-14
JP3174856B2 (ja) 2001-06-11
EP0623381A1 (de) 1994-11-09

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee