DE69421522T2 - Verfahren zur reparatur einer leitung eines dünnfilm-bildsensors oder einer dünnfilm-anzeige und die dadurch hergestellte struktur - Google Patents
Verfahren zur reparatur einer leitung eines dünnfilm-bildsensors oder einer dünnfilm-anzeige und die dadurch hergestellte strukturInfo
- Publication number
- DE69421522T2 DE69421522T2 DE69421522T DE69421522T DE69421522T2 DE 69421522 T2 DE69421522 T2 DE 69421522T2 DE 69421522 T DE69421522 T DE 69421522T DE 69421522 T DE69421522 T DE 69421522T DE 69421522 T2 DE69421522 T2 DE 69421522T2
- Authority
- DE
- Germany
- Prior art keywords
- repairing
- display
- thin film
- line
- image sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5382—Adaptable interconnections, e.g. for engineering changes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76886—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances
- H01L21/76892—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances modifying the pattern
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1306—Details
- G02F1/1309—Repairing; Testing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US16926093A | 1993-12-20 | 1993-12-20 | |
PCT/US1994/014541 WO1995017768A1 (en) | 1993-12-20 | 1994-12-15 | Address line repair structure and method for thin film imager devices |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69421522D1 DE69421522D1 (de) | 1999-12-09 |
DE69421522T2 true DE69421522T2 (de) | 2000-08-10 |
Family
ID=22614886
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69421522T Expired - Fee Related DE69421522T2 (de) | 1993-12-20 | 1994-12-15 | Verfahren zur reparatur einer leitung eines dünnfilm-bildsensors oder einer dünnfilm-anzeige und die dadurch hergestellte struktur |
Country Status (5)
Country | Link |
---|---|
US (1) | US5480812A (de) |
EP (1) | EP0685113B1 (de) |
JP (1) | JP3671056B2 (de) |
DE (1) | DE69421522T2 (de) |
WO (1) | WO1995017768A1 (de) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5648296A (en) * | 1994-07-27 | 1997-07-15 | General Electric Company | Post-fabrication repair method for thin film imager devices |
KR100197114B1 (ko) * | 1995-07-19 | 1999-06-15 | 김영환 | 메모리 소자 집적 다이의 층결함의 3차원 검사 방법 |
US5834321A (en) * | 1995-12-18 | 1998-11-10 | General Electric Company | Low noise address line repair method for thin film imager devices |
US5731803A (en) * | 1995-12-21 | 1998-03-24 | Xerox Corporation | Array with light active units sized to eliminate artifact from size difference |
US5608245A (en) * | 1995-12-21 | 1997-03-04 | Xerox Corporation | Array on substrate with repair line crossing lines in the array |
US5616524A (en) * | 1995-12-22 | 1997-04-01 | General Electric Company | Repair method for low noise metal lines in thin film imager devices |
JP2000512804A (ja) | 1996-05-08 | 2000-09-26 | 1294339 オンタリオ インコーポレーテッド | 放射線画像用高精細度フラット・パネル |
US5741727A (en) * | 1997-05-23 | 1998-04-21 | Industrial Technology Research Institute | Circuit modification and repair using a low resistance conducting metal bridge and a focused ion beam |
US5976978A (en) * | 1997-12-22 | 1999-11-02 | General Electric Company | Process for repairing data transmission lines of imagers |
JP2000046645A (ja) * | 1998-07-31 | 2000-02-18 | Canon Inc | 光電変換装置及びその製造方法及びx線撮像装置 |
US6486470B2 (en) | 1998-11-02 | 2002-11-26 | 1294339 Ontario, Inc. | Compensation circuit for use in a high resolution amplified flat panel for radiation imaging |
JP4653867B2 (ja) * | 1999-06-30 | 2011-03-16 | エーユー オプトロニクス コーポレイション | 電子部品の欠陥修復方法 |
US6392257B1 (en) * | 2000-02-10 | 2002-05-21 | Motorola Inc. | Semiconductor structure, semiconductor device, communicating device, integrated circuit, and process for fabricating the same |
US6674168B1 (en) * | 2003-01-21 | 2004-01-06 | International Business Machines Corporation | Single and multilevel rework |
KR20070117738A (ko) * | 2006-06-09 | 2007-12-13 | 삼성전자주식회사 | 표시기판의 리페어 방법 및 이에 의해 리페어된 표시기판 |
JP5282381B2 (ja) * | 2007-08-13 | 2013-09-04 | 株式会社島津製作所 | 光マトリックスデバイスの製造方法 |
DE102009044022A1 (de) * | 2009-09-16 | 2011-03-24 | Reis Gmbh & Co. Kg Maschinenfabrik | Verfahren zum Reparieren eines elektrischen Kontakts |
US20120228275A1 (en) * | 2009-06-29 | 2012-09-13 | Reis Group Holding Gmbh & Co. Kg | Method for exposing an electrical contact |
JP5313984B2 (ja) * | 2010-09-14 | 2013-10-09 | エーユー オプトロニクス コーポレイション | 電子部品の欠陥修復装置 |
KR102216675B1 (ko) | 2014-06-12 | 2021-02-18 | 삼성디스플레이 주식회사 | 디스플레이 패널의 리페어 장치 및 디스플레이 패널의 리페어 방법 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3597834A (en) * | 1968-02-14 | 1971-08-10 | Texas Instruments Inc | Method in forming electrically continuous circuit through insulating layer |
US4688896A (en) * | 1985-03-04 | 1987-08-25 | General Electric Company | Information conversion device with auxiliary address lines for enhancing manufacturing yield |
US4630355A (en) * | 1985-03-08 | 1986-12-23 | Energy Conversion Devices, Inc. | Electric circuits having repairable circuit lines and method of making the same |
FR2585167B1 (fr) * | 1985-07-19 | 1993-05-07 | Gen Electric | Structures conductrices redondantes pour affichages a cristaux liquides commandes par des transistors a effet de champ en couche mince |
JPH0766253B2 (ja) * | 1986-06-20 | 1995-07-19 | 松下電器産業株式会社 | マトリクス型画像表示装置 |
JPS63102342A (ja) * | 1986-10-20 | 1988-05-07 | Mitsubishi Electric Corp | 半導体集積回路装置の配線構造 |
JPH0691252B2 (ja) * | 1986-11-27 | 1994-11-14 | 日本電気株式会社 | 薄膜トランジスタアレイ |
JPH01102434A (ja) * | 1987-10-15 | 1989-04-20 | Sharp Corp | マトリックス型液晶表示パネル |
US4840459A (en) * | 1987-11-03 | 1989-06-20 | General Electric Co. | Matrix addressed flat panel liquid crystal display device with dual ended auxiliary repair lines for address line repair |
JPH01191829A (ja) * | 1988-01-27 | 1989-08-01 | Mitsubishi Electric Corp | 液晶表示装置 |
JPH02157828A (ja) * | 1988-12-12 | 1990-06-18 | Hosiden Electron Co Ltd | 液晶表示素子 |
US4990460A (en) * | 1989-01-27 | 1991-02-05 | Nec Corporation | Fabrication method for thin film field effect transistor array suitable for liquid crystal display |
JPH0823643B2 (ja) * | 1989-03-28 | 1996-03-06 | シャープ株式会社 | アクティブマトリクス表示装置 |
US5062690A (en) * | 1989-06-30 | 1991-11-05 | General Electric Company | Liquid crystal display with redundant FETS and redundant crossovers connected by laser-fusible links |
US5153408A (en) * | 1990-10-31 | 1992-10-06 | International Business Machines Corporation | Method and structure for repairing electrical lines |
US5246745A (en) * | 1991-12-23 | 1993-09-21 | International Business Machines Corporation | Laser-induced chemical vapor deposition of thin-film conductors |
JPH05216053A (ja) * | 1992-02-04 | 1993-08-27 | Seiko Epson Corp | 画像表示装置の修正方法及びその構造 |
US5289632A (en) * | 1992-11-25 | 1994-03-01 | International Business Machines Corporation | Applying conductive lines to integrated circuits |
-
1994
- 1994-12-15 EP EP95905981A patent/EP0685113B1/de not_active Expired - Lifetime
- 1994-12-15 JP JP51752295A patent/JP3671056B2/ja not_active Expired - Fee Related
- 1994-12-15 DE DE69421522T patent/DE69421522T2/de not_active Expired - Fee Related
- 1994-12-15 WO PCT/US1994/014541 patent/WO1995017768A1/en active IP Right Grant
-
1995
- 1995-05-08 US US08/436,681 patent/US5480812A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0685113B1 (de) | 1999-11-03 |
EP0685113A1 (de) | 1995-12-06 |
DE69421522D1 (de) | 1999-12-09 |
JP3671056B2 (ja) | 2005-07-13 |
JPH08507180A (ja) | 1996-07-30 |
US5480812A (en) | 1996-01-02 |
WO1995017768A1 (en) | 1995-06-29 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69421522T2 (de) | Verfahren zur reparatur einer leitung eines dünnfilm-bildsensors oder einer dünnfilm-anzeige und die dadurch hergestellte struktur | |
DE69326123D1 (de) | Dünnfilmtransistor und verfahren zur herstellung eines dünnfilmtransistors | |
DE69430230T2 (de) | Verfahren und Vorrichtung zur Herstellung eines Einkristallinen dünnen Films | |
DE69430781T2 (de) | Verfahren zur Herstellung einer Flüssigkristall-Anzeigevorrichtung | |
DE69433928D1 (de) | Verfahren zur Herstellung einer Flüssigkristallanzeigevorrichtung | |
DE69422273D1 (de) | Verfahren und Vorrichtung zur Herstellung eines Flächenhaftverschlusses | |
DE69100140D1 (de) | Verfahren zur anzeige eines bildteiles einer physikalischen struktur. | |
DE69428391D1 (de) | Verfahren und Vorrichtung zur Beschichtung eines Filmes | |
DE69033286T2 (de) | Verfahren und Vorrichtung zur Bildung eines Films | |
DE69633378D1 (de) | Verfahren zur Herstellung einer Flüssigkristallanzeigevorrichtung | |
DE69426213D1 (de) | Vorrichtung und Verfahren zur Ausrichtung von Bildern eines Filmelements bezüglich eines Linsenrasterelements | |
DE69621744T2 (de) | Verfahren und Vorrichtung zur Herstellung eines Bildanzeigegerätes | |
DE69016538D1 (de) | Verfahren zur Herstellung eines Orientierungsfilms für eine Flüssigkristallanzeigevorrichtung. | |
DE69322926T2 (de) | Verfahren und Vorrichtung zur Herstellung eines lichtempfindlichen Elements | |
DE69433375D1 (de) | Verfahren zur Herstellung eines Dünnschichtmusters | |
DE69606263D1 (de) | Konstruktionselement mit Verkleidung und Verfahren zur Herstellung eines solchenElements | |
DE69407237T3 (de) | Verfahren zur Herstellung eines Drehsensors | |
DE3681662D1 (de) | Verfahren zur herstellung eines lichtbildsensors und linearer bildsensor durch dieses verfahren. | |
DE69403275D1 (de) | Verfahren und Vorrichtung zur Herstellung eines Silizium-Einkristalles | |
DE69411994D1 (de) | Verfahren und Vorrichtung zur Steuerung eines Filmantriebs | |
DE69420721T2 (de) | Vorrichtung und verfahren zur herstellung von einem dünnen film | |
DE69419836D1 (de) | Verfahren zur Herstellung eines Orientierungsfilms für Flüssigkristalle mit aufgeteilten Bereichen und Flüssigkristall-Vorrichtung mit solchem Film | |
DE69618702T2 (de) | Verfahren zur Herstellung einer Bildanzeigevorrichtung mit Flachschirm | |
DE69415469D1 (de) | Verfahren zur Verkleinerung des Bildes eines Dokuments | |
DE69723996D1 (de) | Vorrichtung und Verfahren zur Herstellung einer Anzeigetafel mit einem funktionellen Film |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8328 | Change in the person/name/address of the agent |
Representative=s name: ROEGER UND KOLLEGEN, 73728 ESSLINGEN |
|
8339 | Ceased/non-payment of the annual fee |